Patents by Inventor Chih-Hung HU

Chih-Hung HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240144966
    Abstract: The present disclosure generally relates to a dual free layer two dimensional magnetic recording read head. The read head comprises a first lower shield, a first sensor disposed over the first lower shield, a first upper shield disposed over the first sensor, a read separation gap (RSG) disposed on the first upper shield, a second lower shield disposed over the RSG, a second sensor disposed over the second lower shield, and a second upper shield disposed over the second sensor. In some embodiments, the second lower shield comprises a CoFeHf layer. In another embodiment, the second lower shield is a synthetic antiferromagnetic multilayer comprising a first shield layer, a second shield layer, and a CoFe/Ru/CoFe anti-ferromagnetic coupling layer or a Ru layer disposed therebetween, the first and second shield layers comprising NiFe and CoFe. In yet another embodiment, the second lower shield comprises layers of Ru, IrMn, and NiFe.
    Type: Application
    Filed: July 26, 2023
    Publication date: May 2, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Chen-Jung CHIEN, Goncalo Marcos BAIÃO DE ALBUQUERQUE, Chih-Ching HU, Yung-Hung WANG, Ming JIANG
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Publication number: 20240071413
    Abstract: The present disclosure generally relates to a dual free layer (DFL) read head and methods of forming thereof. In one embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a stripe height of the DFL sensor, depositing a rear bias (RB) adjacent to the DFL sensor, defining a track width of the DFL sensor and the RB, and depositing synthetic antiferromagnetic (SAF) soft bias (SB) side shields adjacent to the DFL sensor. In another embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a track width of the DFL sensor, depositing SAF SB side shields adjacent to the DFL sensor, defining a stripe height of the DFL sensor and the SAF SB side shield, depositing a RB adjacent to the DFL sensor and the SAF SB side shield, and defining a track width of the RB.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ming MAO, Yung-Hung WANG, Chih-Ching HU, Chen-Jung CHIEN, Carlos CORONA, Hongping YUAN, Ming JIANG, Goncalo Marcos BAIÃO DE ALBUQUERQUE
  • Publication number: 20110251024
    Abstract: The resilient assembly has an innermost inflatable enclosure, a reinforced fiber layer around the inflatable enclosure, first and second mounting members on top and bottom points of the inflatable enclosure, each mounting member having a threaded shank, a leather layer around the reinforced fiber layer and the first and second mounting members, a first cap having a central through hole, and a second cap having a central through hole so that the threaded shanks are driven through the through holes to releasably secure to the pedestal and the punching bag respectively.
    Type: Application
    Filed: April 13, 2010
    Publication date: October 13, 2011
    Inventor: Chih-Hung HU