Patents by Inventor Chih-Hung Lin

Chih-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220246614
    Abstract: According to one example, a semiconductor device includes a substrate and a fin stack that includes a plurality of nanostructures, a gate device surrounding each of the nanostructures, and inner spacers along the gate device and between the nanostructures. A width of the inner spacers differs between different layers of the fin stack.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 4, 2022
    Inventors: Jui-Chien Huang, Shih-Cheng Chen, Chih-Hao Wang, Kuo-Cheng Chiang, Zhi-Chang Lin, Jung-Hung Chang, Lo-Heng Chang, Shi Ning Ju, Guan-Lin Chen
  • Publication number: 20220236766
    Abstract: An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Applicant: Acer Incorporated
    Inventors: Yu-Shih Wang, Yi-Ta Huang, Chih-Chun Liu, Cheng-Nan Ling, Wen-Chieh Tai, Chi-Hung Lai, Wu-Chen Lee, Pin-Chueh Lin, Chih-Wei Liao, Ting-Wen Pai, Wen-Chieh Chen
  • Publication number: 20220238341
    Abstract: A semiconductor structure includes a semiconductor fin extending from a substrate, a source/drain (S/D) feature disposed over the semiconductor fin, a silicide layer disposed over the S/D feature, where the silicide layer extends along a sidewall of the S/D feature, and an etch-stop layer (ESL) disposed along a sidewall of the silicide layer.
    Type: Application
    Filed: April 18, 2022
    Publication date: July 28, 2022
    Inventors: Chun-Hsiung Lin, Shih-Cheng Chen, Chih-Hao Wang, Jung-Hung Chang, Jui-Chien Huang
  • Patent number: 11398797
    Abstract: A crystal oscillator and a method for fabricating the same is provided. In the method, a crystal package is provided. The crystal package includes a crystal blank and at least one laser-penetrating area. The laser-penetrating area is exposed outside. The crystal package is provided with at least one airtight space therein. At least one getter is formed in the airtight space. The location of the laser-penetrating area corresponds to that of the getter. A laser beam penetrates through the laser-penetrating area to activate the getter, thereby increasing the degree of vacuum of the airtight space.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: July 26, 2022
    Assignee: TXC CORPORATION
    Inventors: Wun-Kai Wang, Cheng-Wei Lin, Chih Hung Chiu, Chih Hsun Chu
  • Publication number: 20220219093
    Abstract: A motion simulator comprises a base, a motion platform, a carrying platform, a support assembly and a driver assembly for simulating different motions. The motion platform is movably connected to the base, the carrying platform comprises a carrier arranged on the carrying platform, the support assembly is movably connected to the motion platform and the carrying platform, and the driver assembly drives the motion platform to move relative to the base and drives the actuator to actuate the carrying platform to move relative to the motion platform. The support assembly further includes an actuator and a support tube that are movably connected between the motion platform and the carrying platform, respectively.
    Type: Application
    Filed: December 9, 2021
    Publication date: July 14, 2022
    Applicant: BROGENT TECHNOLOGIES INC.
    Inventors: Chih-Hung Ouyang, Yang-Chen Lin, Zong-Yu Yu, Ching-Wen Chuang
  • Publication number: 20220221598
    Abstract: A circuit for sensing an X-ray including a switching element, a storage element, a sensing element and a branching element. The storage element electrically coupled to the switching element. The sensing element electrically coupled to the switching element. The branching element electrically coupled between the storage element and the sensing element.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 14, 2022
    Applicant: InnoCare Optoelectronics Corporation
    Inventors: Hsin-Hung Lin, Chin-Chi Chen, Chih-Hao Wu
  • Publication number: 20220223536
    Abstract: Semiconductor structures and method of forming the same are provided. A semiconductor structure according to the present disclosure includes a contact feature in a dielectric layer, a passivation structure over the dielectric layer, a conductive feature over the passivation structure, a seed layer disposed between the conductive feature and the passivation structure, a protecting layer disposed along sidewalls of the conductive feature, and a passivation layer over the conductive feature and the protecting layer.
    Type: Application
    Filed: May 5, 2021
    Publication date: July 14, 2022
    Inventors: Wen-Chun Wang, Tzy-Kuang Lee, Chih-Hsien Lin, Ching-Hung Kao, Yen-Yu Chen
  • Publication number: 20220223534
    Abstract: A package structure and method of forming the same are provided. The package structure includes a first die and a second die disposed side by side, a first encapsulant laterally encapsulating the first and second dies, a bridge die disposed over and connected to the first and second dies, a second encapsulant and a first RDL structure. The bridge die includes a semiconductor substrate, a conductive via and an encapsulant layer. The semiconductor substrate has a through substrate via embedded therein. The conductive via is disposed over a back side of the semiconductor substrate and electrically connected to the through substrate via. The encapsulant layer is disposed over the back side of the semiconductor substrate and laterally encapsulates the conductive via. The second encapsulant is disposed over the first encapsulant and laterally encapsulates the bridge die. The first RDL structure is disposed on the bridge die and the second encapsulant.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 14, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Lin, Chih-Wei Wu, Chia-Nan Yuan, Ying-Ching Shih, An-Jhih Su, Szu-Wei Lu, Ming-Shih Yeh, Der-Chyang Yeh
  • Publication number: 20220223996
    Abstract: An electronic device including a first body, a second body, and at least one cavity antenna module is provided. The second body has a pivot side and a plurality of non-pivot sides, and the pivot side is connected pivotally to the first body. The cavity antenna module includes a metal cavity body and a first antenna structure. The metal cavity body is disposed in the second body and has an opening. A distance between one of the non-pivot sides and the metal cavity body is smaller than a distance between the pivot side and the metal cavity body, and the opening faces the one of the non-pivot sides. The first antenna structure is disposed in the opening of the metal cavity body, and the first antenna structure includes a feeding portion, a radiating portion, and a ground portion connected with one another.
    Type: Application
    Filed: October 21, 2021
    Publication date: July 14, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Je-Wei Liao, Chun-Cheng Chan, Jui-Hung Lai
  • Publication number: 20220216340
    Abstract: A semiconductor device according to the present disclosure includes a stack of first channel members, a stack of second channel members disposed directly over the stack of first channel members, a bottom source/drain feature in contact with the stack of the first channel members, a separation layer disposed over the bottom source/drain feature, a top source/drain feature in contact with the stack of second channel members and disposed over the separation layer, and a frontside contact that extends through the top source/drain feature and the separation layer to be electrically coupled to the bottom source/drain feature.
    Type: Application
    Filed: January 4, 2021
    Publication date: July 7, 2022
    Inventors: Zhi-Chang Lin, Shih-Cheng Chen, Jung-Hung Chang, Chien Ning Yao, Kuo-Cheng Chiang, Chih-Hao Wang
  • Publication number: 20220213897
    Abstract: The disclosed embodiment is related to a manufacturing method of a die-formed 3-dimensional plastic impeller of a centrifugal pump and the impeller manufactured thereby, including a mold for twisted blade and a mold for impeller outlet, the mold for twisted blade is configured to form a twisted blade portion of each blade of the impeller, the mold for impeller outlet is configured to form a rear portion of each blade, a hub rim part of the impeller, and a shroud rim part of the impeller so that the hub rim part, the shroud rim part, and the blades are formed in a single piece at the same molding process.
    Type: Application
    Filed: September 25, 2019
    Publication date: July 7, 2022
    Inventors: Chih-Hsien SHIH, Chih-Kuan SHIH, Huan-Jan CHIEN, Shu-Yen CHIEN, Chin-Cheng WANG, Yuan Hung Lin, PENG-HSIANG CHEN
  • Patent number: 11370062
    Abstract: A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: June 28, 2022
    Assignees: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE, PARFAITE TOOL CO., LTD.
    Inventors: Yu-Ting Lyu, Yu-Fu Lin, Jui-Teng Chen, Chih-Hung Chou
  • Patent number: 11374136
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: June 28, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11371885
    Abstract: An optical sensor circuit is provided. In the optical sensor circuit, an output stage circuit transmits a voltage of first and second node to the output line according to a first driving signal. A first sensor is configured to generate a first photocurrent according to a first color light that senses an ambient light, and generate a second photocurrent according to a second color light. A second sensor is configured to generate a third photocurrent according to a third color light, and generate a fourth photocurrent according to the second color light. In a sensing phase, when the first sensor senses the first color light, and the second sensor senses the third color light, the first sensor adjusts a voltage level of the voltage according to the first photocurrent, and the second sensor adjusts the voltage level of the voltage according to the third photocurrent.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 28, 2022
    Assignees: Au Optronics Corporation, National Cheng-Kung University
    Inventors: Chih-Lung Lin, Chia-En Wu, Chia-Lun Lee, Jui-Hung Chang, Jian-Shen Yu
  • Publication number: 20220132237
    Abstract: The present invention provides an audio output device. The audio output device includes a speaker unit, a first plate and a second plate. The speaker unit has a sound-emitting surface, and the sound-emitting surface has a first side and a second side opposite to each other. A first side edge of the first plate corresponds to the first side and is rotatably connected. A second side of the second plate corresponds to the second side and is rotatably connected, and a sound channel corresponding to the speaker unit is formed between the first plate and the second plate, and a sound outlet is formed at an end of the sound channel farthest away from the speaker unit, and a direction pointed by a connection line between a center point of the sound-emitting surface and a center point of the sound outlet is adjustable.
    Type: Application
    Filed: October 26, 2021
    Publication date: April 28, 2022
    Applicant: Qisda Corporation
    Inventors: Chih-Hung LIN, Hsun-Cheng CHO
  • Publication number: 20220085163
    Abstract: A semiconductor structure includes a substrate, a channel layer, a barrier layer, a source structure, a drain structure, a doped compound semiconductor layer, a dielectric layer, and a gate structure. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The source structure and the drain structure are disposed on opposite sides of the barrier layer. The doped compound semiconductor layer is disposed on the barrier layer. The doped compound semiconductor layer has a first side adjacent to the source structure and a second side adjacent to the drain structure. The doped compound semiconductor layer has at least one opening exposing at least a portion of the barrier layer. The dielectric layer is disposed on the doped compound semiconductor layer and the barrier layer. The gate structure is disposed on the doped compound semiconductor layer.
    Type: Application
    Filed: September 16, 2020
    Publication date: March 17, 2022
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng LIN, Chih-Hung LIN, Po-Heng LIN
  • Publication number: 20220077484
    Abstract: Various embodiments of fuel cells and cell assemblies and methods of using the same are provided. Each fuel cell or cell assembly can simultaneously perform a charging function and a discharging function, the former by receiving electric currents from external charging devices, the latter by outputting an electric current to an electrical load. The fuel cell includes a metal layer serving as a positive electrode for the charging function, at least one air electrode layer serving as a positive electrode for the discharging function, as well as a zinc material serving as a negative electrode for both the charging and discharging functions. The fuel cell also includes a plurality of gas chambers via which an electrolyte is disposed into the fuel cell. The electrolyte is disposed up to a level located lower than the gas chambers.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 10, 2022
    Inventors: Rong-Jie Chen, Chih-Hung Lin
  • Publication number: 20220028598
    Abstract: A magnetic induction assembly includes a magnetic core, a primary winding, a secondary winding and a base. The primary winding is wound by a wire. The secondary winding is a conductive plate having an open loop and two contact ends. The base has a body having a through hollow. A surface of the body is formed with n partitions, where n is greater than or equal to 1. The partitions divide the body into n+1 winding areas for being selectively wound by the wire. Each of the partitions has a chamber, a through hole communicating with the through hollow and an opening allowing the secondary winding to enter the chamber. The magnetic core passes through the through hollow, the through holes and the loop of the conductive plate to magnetically couple with the primary winding and the secondary winding.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 27, 2022
    Applicant: PIN SHINE INDUSTRIAL CO., LTD.
    Inventors: Chih-Hung Lin, Kun-Chuan Chang
  • Publication number: 20210408816
    Abstract: Various embodiments of a battery charging apparatus are disclosed, along with methods of charging and rejuvenating a battery using the apparatus. The apparatus may include a positive electrode and a negative electrode which are configured to connect to a battery, and a charging current generator generating a charging current that charges the battery for a period of time via the positive and and negative electrodes by adding electric charge to the battery. The charging current is generated based on parameters of the battery, including a charging constant and an initial charging state. In some embodiments, a natural logarithm of a ratio of the added electric charge to the initial charging state substantially equals to a product of the charging constant and a length of the period of time and negative one.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 30, 2021
    Inventors: Rong-Jie Chen, Chih-Hung Lin
  • Patent number: 11158723
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a first well region, a second well region, an isolation structure, and a gate structure. The first well region is disposed in the substrate. The second well region is disposed in the substrate. The second well region is adjoining the first well region. The isolation structure is disposed in the first well region. The gate structure is disposed on the substrate. The gate structure includes a first gate portion and a second gate portion. The first gate portion overlaps the first well region and the second well region. There is an opening between the first gate portion and the second gate portion exposing a portion of the isolation structure.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: October 26, 2021
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Chih-Hung Lin, Chia-Hao Lee