Abstract: A multi junction solar cell structure includes a first sub-cell, a first tunnel diode layer, a second tunnel diode layer, a second sub-cell, a lattice gradient buffer layer and a third sub-cell. The first sub-cell includes a first surface and a second surface opposite to the first surface. The first tunnel diode layer is formed on the first surface of the first sub-cell. The second sub-cell is formed on the first tunnel diode layer. The second tunnel diode layer is formed on the second surface of the first sub-cell. The lattice gradient buffer layer is formed on the second tunnel diode. The third sub-cell is formed on the lattice gradient buffer layer. This disclosure also contains a method for manufacturing the above-mentioned multi-junction solar cell.

Abstract: A mending method for a display includes the steps of making a display device light to make a plurality of light emitting positions thereof shine, searching out a plurality of defect positions among the light emitting positions, providing a transferring device having a transferring surface with a plurality of miniature light emitting elements positioned correspondingly to the light emitting positions, planning a mending procedure which includes in the area the transferring surface corresponds to, choosing in chief the largest number of defect positions able to be mended at a single time according to the positions of the miniature light emitting elements and then in the area the transferring surface corresponds to, planning the rest of the defect positions according to the rest of the miniature light emitting elements, and according to the mending procedure, moving the transferring device to weld the miniature light emitting elements at the defect positions.

Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a first portion and a matrix structure. The first portion is connected to a first optical member and corresponds to a first light. The matrix structure is disposed on the first portion and corresponds to a second light, wherein the first light is different from the second light. The matrix structure includes a regularly-arranged structure.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: Disclosed is a memory cell including a first transistor having a first terminal coupled to a bit line; a second transistor having a first terminal coupled to a bit line bar; a weight storage circuit coupled between a gate terminal of the first transistor and a gate terminal of the second transistor, storing a weight value, and determining to turn on the first transistor or the second transistor according to the weight value; and a driving circuit coupled to a second terminal of the first transistor, a second terminal of the second transistor, and at least one word line, receiving at least one threshold voltage and at least one input data from the word line, and determining whether to generate an operation current on a path of the turned-on first transistor or the turned-on second transistor according to the threshold voltage and the input data.

Abstract: An optical water-quality detection apparatus includes a detection device, a biofilm-inhibition light source, a detection light source and a sensor. The detection device includes a detection chamber. The biofilm-inhibition light source is disposed outside the detection chamber and configured to emit biofilm-inhibition light. The detection light source is disposed outside the detection chamber and configured to emit detection light. The sensor is configured to sense the detection light penetrating the detection chamber. A beam of the detection light and a beam of the inhibition light overlaps as penetrating the detection chamber.

Abstract: An active device substrate includes a substrate, a first thin film transistor located above the substrate and a second thin film transistor located above the substrate. The first thin film transistor includes a first metal oxide layer, a first gate, a first source and a first drain. A first gate dielectric layer and a second gate dielectric layer are located between the first gate and the first metal oxide layer. The second thin film transistor includes a second metal oxide layer, a second gate, a second source and a second drain. The second gate dielectric layer is located between the second gate and the second metal oxide layer, and the second metal oxide layer is located between the first gate dielectric layer and the second gate dielectric layer. The first gate and the second gate belong to a same patterned layer.

Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

Abstract: A wireless communication device and a dynamic anti-interference method for the same are provided. The device includes at least two wireless communication circuits. When the method operates in the wireless communication device, the device monitors activities of every wireless communication circuit through a clear channel assessment method for acquiring signal strength of every wireless communication circuit. The assessment allows the device to perform a corresponding anti-interference measure for each of the wireless communication circuits. For example, when the device acknowledges that a second wireless communication circuit of the device starts to work as a first wireless communication circuit transmits or receives signals, the device controls a receiver or a transmitter of the second wireless communication circuit to perform an anti-interference measure such as a gain control for a receiver or power adjustment for a transmitter.

Abstract: An isolation estimation system includes a transmitter device, a first receiver device, a second receiver device, and a processor circuit. The transmitter device adopts a first communication technology. The transmitter device is configured to transmit a transmitting signal to the first receiving device. The second receiver device is configured to acquire a leakage signal power spectral density of a leakage signal corresponding to the transmitting signal. The second receiver device adopts a second communication technology. A bandwidth of the second communication technology is narrower than a bandwidth of the first communication technology, and the second communication technology supports a frequency hopping process. The processor circuit is configured to calculate isolation according to a signal-in-air power spectral density of the transmitting signal and the leakage signal power spectral density. The isolation is for determining whether to adjust the transmitter device.

Abstract: A wireless communication device that includes an antenna module, a first communication circuit and a second communication circuit is provided. The first communication circuit performs communication by using a first communication protocol and transmits a test signal via the antenna module. The second communication circuit performs communication by using a second communication protocol and receives the test signal to calculate an isolation index based on an actual received power thereof. The second communication circuit determines that the antenna module includes two antennas when the isolation index is smaller than a threshold value to operate the first and the second communication circuits under a dual-antenna operation mode. The second communication circuit determines that the antenna module includes one antenna when the isolation index is not smaller than the threshold value to operate the first and the second communication circuits under a shared-antenna operation mode.

Abstract: The present invention discloses a Wireless Local Area Network (WLAN) and Bluetooth (BT) device including a WLAN circuit and a BT circuit. The WLAN circuit starts a WLAN slot according to a beacon of a beacon signal from an access point and executes WLAN communication. The WLAN slot ends after a measured reception time point of the beacon so as to prevent missing the beacon. The BT circuit starts a BT slot after the end of the WLAN slot and executes BT communication. If the BT slot is shorter than the period of the beacon signal minus the WLAN slot, the WLAN circuit earns additional time to start an extended WLAN slot after the end of the BT slot for carrying on the WLAN communication. The extended WLAN slot is not longer than the period of the beacon signal minus the sum of the WLAN and BT slots.

Abstract: A wireless communication device and a dynamic anti-interference method for the same are provided. The device includes at least two wireless communication circuits. When the method operates in the wireless communication device, the device monitors activities of every wireless communication circuit through a clear channel assessment method for acquiring signal strength of every wireless communication circuit. The assessment allows the device to perform a corresponding anti-interference measure for each of the wireless communication circuits. For example, when the device acknowledges that a second wireless communication circuit of the device starts to work as a first wireless communication circuit transmits or receives signals, the device controls a receiver or a transmitter of the second wireless communication circuit to perform an anti-interference measure such as a gain control for a receiver or power adjustment for a transmitter.

Abstract: A wireless communication device that includes an antenna module, a first communication circuit and a second communication circuit is provided. The first communication circuit performs communication by using a first communication protocol and transmits a test signal via the antenna module. The second communication circuit performs communication by using a second communication protocol and receives the test signal to calculate an isolation index based on an actual received power thereof. The second communication circuit determines that the antenna module includes two antennas when the isolation index is smaller than a threshold value to operate the first and the second communication circuits under a dual-antenna operation mode. The second communication circuit determines that the antenna module includes one antenna when the isolation index is not smaller than the threshold value to operate the first and the second communication circuits under a shared-antenna operation mode.

Abstract: The present invention discloses a Wireless Local Area Network (WLAN) and Bluetooth (BT) device including a WLAN circuit and a BT circuit. The WLAN circuit starts a WLAN slot according to a beacon of a beacon signal from an access point and executes WLAN communication. The WLAN slot ends after a measured reception time point of the beacon so as to prevent missing the beacon. The BT circuit starts a BT slot after the end of the WLAN slot and executes BT communication. If the BT slot is shorter than the period of the beacon signal minus the WLAN slot, the WLAN circuit earns additional time to start an extended WLAN slot after the end of the BT slot for carrying on the WLAN communication. The extended WLAN slot is not longer than the period of the beacon signal minus the sum of the WLAN and BT slots.

Abstract: A display module substrate and a manufacturing method thereof are provided. The display module substrate includes a substrate body and a plurality of signal circuits. The substrate body has a supporting surface. The supporting surface includes a viewing area and a signal circuit area on one side of the viewing area. The signal circuits are disposed on the supporting surface and located at the signal circuit area. The signal circuit area has a plurality of apertures running through the substrate body, wherein the apertures are not shielded by the signal circuits. In a manufacturing thereof, the substrate body is disposed on a transparent carrier plate. When high-energy light is applied through the transparent carrier plate to etch a bottom surface of the substrate body to separate the substrate body and the transparent carrier plate, the resulting gas leaves through the apertures.

Abstract: The present invention provides a manufacturing method of a display module, including a step of disposing a substrate on a transparent carrier plate, wherein the substrate has a bottom surface and a supporting surface opposite to the bottom surface; the bottom surface is attached to the transparent carrier plate and includes a first area and a second area. A step of performing a display elements manufacturing process on the supporting surface. A step of etching the first area by a first energy having a first energy density passing through the transparent carrier plate to separate the first area from the transparent carrier plate. A step of etching the second area by a second energy having a second energy density passing through the transparent carrier plate to separate the second area from the transparent carrier plate, wherein the second energy density is greater than the first energy density. A step of separating the substrate from the transparent carrier plate.