Abstract: A display apparatus includes a driving backplane and a light emitting component. The driving backplane has a first pad and a second pad. The light emitting component is disposed on the driving backplane. The light emitting component includes a first semiconductor layer, a second semiconductor layer, an active layer, a first electrode, a second electrode, a first solder and a second solder. The first solder and the second solder of the light-emitting component are respectively disposed on the first pad and the second pad of the driving backplane and electrically connected to the first pad and the second pad respectively. A volume of the first solder is larger than a volume of the second solder, and an area of the first pad is smaller than an area of the second pad.

Abstract: A light emitting element substrate includes a substrate and a light emitting element disposed on the substrate and including first and second semiconductor layers, an active layer, first and second electrodes, and first and second solders. The second semiconductor layer is disposed opposite to the first semiconductor layer. The active layer is disposed between the first and second semiconductor layers. The first and second electrodes are electrically connected to the first and second semiconductor layers respectively. The first and second solders are respectively disposed on and electrically connected to the first and second electrodes respectively. The first electrode includes a first under barrier pattern. The first solder covers the first under barrier pattern. A projection area of the first solder on the substrate is greater than a projection area of the first under barrier pattern on the substrate. A display apparatus is provided.

Abstract: A package structure including a first redistribution layer, a semiconductor die, through insulator vias, an insulating encapsulant and a second redistribution layer. The first redistribution layer includes a dielectric layer, a conductive layer, and connecting portions electrically connected to the conductive layer. The dielectric layer has first and second surfaces, the connecting portions has a first side, a second side, and sidewalls joining the first side to the second side. The first side of the connecting portions is exposed from and coplanar with the first surface of the dielectric layer. The semiconductor die is disposed on the second surface of the dielectric layer. The through insulator vias are connected to the conductive layer. The insulating encapsulant is disposed on the dielectric layer and encapsulating the semiconductor die and the through insulator vias. The second redistribution layer is disposed on the semiconductor die and over the insulating encapsulant.

Abstract: A semiconductor device includes a fin extending from a substrate and including a first fin end, a separation structure separating the first fin end from an adjacent fin end of another fin, a dummy gate spacer along sidewalls of the separation structure and the fin, a first epitaxial source/drain region in the fin and adjacent the separation structure, and a residue of a dummy gate material in a corner region between the dummy gate spacer and the first fin end. The first fin end protrudes from the dummy gate spacer into the separation structure. The residue of the dummy gate material separates the first epitaxial source/drain region from the separation structure and is triangle shaped.

Abstract: The present invention relates to a nicotinohydrazide derivative, a stereoisomer thereof or a pharmaceutically acceptable salt thereof having a structure of formula (I): wherein each of X, Y and Z is one of N and CH, at least one of X, Y and Z is CH, at least one of X, Y and Z is N, and R is one of OH and NH2.

Abstract: A shock-absorbing front fork assembly of a motorcycle includes a front fork, a pressure buffering cylinder and a control valve disposed between the front fork and the pressure buffering cylinder and electrically connected with a brake system to control the communication between the front fork and the pressure buffering cylinder according to the operation of the brake system. When the brake system is not actuated, the control valve is open to make the front fork communicate with the pressure buffering cylinder, thereby making the spring supporting force relatively smaller. When the brake system is actuated, the control valve is close to make the front fork not communicate with the pressure buffering cylinder, thereby making the spring supporting force relatively larger. Therefore, the spring supporting force is adjusted by the brake operation, that raises the riding comfort and safety.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: A shock-absorbing front fork assembly of a motorcycle includes a front fork, a pressure buffering cylinder and a control valve disposed between the front fork and the pressure buffering cylinder and electrically connected with a brake system to control the communication between the front fork and the pressure buffering cylinder according to the operation of the brake system. When the brake system is not actuated, the control valve is open to make the front fork communicate with the pressure buffering cylinder, thereby making the spring supporting force relatively smaller. When the brake system is actuated, the control valve is close to make the front fork not communicate with the pressure buffering cylinder, thereby making the spring supporting force relatively larger. Therefore, the spring supporting force is adjusted by the brake operation, that raises the riding comfort and safety.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: Provided is a light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second electrode. The semiconductor device layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a light-emitting layer therebetween. The first electrode is electrically connected to the first-type doped semiconductor layer. The current-blocking layer is on the second-type doped semiconductor layer. The current-blocking layer is between the current-spreading layer and the second-type doped semiconductor layer. The second electrode is on the current-spreading layer and electrically connected to the second-type doped semiconductor layer. The current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: Provided is a light-emitting diode chip including a semiconductor device layer, a first electrode, a current-blocking layer, a current-spreading layer, and a second electrode. The semiconductor device layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a light-emitting layer therebetween. The first electrode is electrically connected to the first-type doped semiconductor layer. The current-blocking layer is on the second-type doped semiconductor layer. The current-blocking layer is between the current-spreading layer and the second-type doped semiconductor layer. The second electrode is on the current-spreading layer and electrically connected to the second-type doped semiconductor layer. The current-blocking layer has a first surface facing the semiconductor device layer, a second surface back on to the semiconductor device layer, and a first inclined surface.

Abstract: A cart includes a main body, wheels, first drawers, at least one collecting bin and at least one driving unit. The wheels are disposed on the bottom of the main body. The first drawers are contained in a front space of the main body and are configured to be pulled out of the main body via a front surface thereof. The collecting bin is contained in a rear space of the main body. The collecting bin has an opening and an accommodation space communicated with the opening. The opening is located in the rear space such that the accommodation space is not exposed to the outside of the main body. The driving unit is coupled to the collecting bin and configured to receive an external triggering to turn the collecting bin out of the main body via a rear surface thereof, to expose the opening and the accommodation space.

Abstract: An inspection apparatus is capable for inspecting at least one light-emitting device. The inspection apparatus includes a working machine and an inspection light source. The inspection light source is disposed on the working machine and located above the light-emitting device. A dominant wavelength of the inspection light source is smaller than a dominant wavelength of the light-emitting device so as to excite the light-emitting device and get an optical property of the light-emitting device.

Abstract: A cart includes a main body, wheels, first drawers, at least one collecting bin and at least one driving unit. The wheels are disposed on the bottom of the main body. The first drawers are contained in a front space of the main body and are configured to be pulled out of the main body via a front surface thereof. The collecting bin is contained in a rear space of the main body. The collecting bin has an opening and an accommodation space communicated with the opening. The opening is located in the rear space such that the accommodation space is not exposed to the outside of the main body. The driving unit is coupled to the collecting bin and configured to receive an external triggering to turn the collecting bin out of the main body via a rear surface thereof, to expose the opening and the accommodation space.

Abstract: A dimming system is composed of a dimmer having switchable power modes and at least one lighting device. When the dimmer is in a non-dimming bypass mode, an input power is directly transmitted to the at least one lighting device with the dimmer being bypassed so that the circuit in the dimmer consumes no power. When the dimmer is in a dimming mode, an output selector of the dimmer outputs a dimming output power having a dimming command therein to each one of the at least one lighting device for each lighting device to decode the dimming command embedded in the dimming output power and perform a dimming operation according to the dimming command. As the dimming operation lasts briefly, the power consumed by the dimmer is extremely small. Accordingly, no heat dissipation issue arises and the present invention is applicable to all sorts of high power lighting devices.