Abstract: Methods of cutting gate structures, and structures formed, are described. In an embodiment, a structure includes first and second gate structures over an active area, and a gate cut-fill structure. The first and second gate structures extend parallel. The active area includes a source/drain region disposed laterally between the first and second gate structures. The gate cut-fill structure has first and second primary portions and an intermediate portion. The first and second primary portions abut the first and second gate structures, respectively. The intermediate portion extends laterally between the first and second primary portions. First and second widths of the first and second primary portions along longitudinal midlines of the first and second gate structures, respectively, are each greater than a third width of the intermediate portion midway between the first and second gate structures and parallel to the longitudinal midline of the first gate structure.

Abstract: A high-electron mobility transistor (HEMT) includes a substrate, a group III-V channel layer, a group III-V barrier layer, a group III-V cap layer, a source electrode, a first drain electrode, a second drain electrode, and a connecting portion. The group III-V channel layer, the group III-V barrier layer, and the group III-V cap layer are sequentially disposed on the substrate. The source electrode is disposed at one side of the group III-V cap layer, and the first and second drain electrodes are disposed at another side of the group III-V cap layer. The bottom surface of the first drain electrode is separated from the bottom surface of the second drain electrode, and the composition of the first drain electrode is different from the composition of the second drain electrode. The connecting portion is electrically coupled to the first drain electrode and the second drain electrode.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a base, a seed layer, a compound semiconductor layer, a gate structure, a source structure, a drain structure, and a conductive paste. The seed layer is disposed on the base. The compound semiconductor layer is disposed on the seed layer. The gate structure is disposed on the compound semiconductor layer. The source structure and the drain structure are disposed on both sides of the gate structure. In addition, the conductive paste is disposed between the base and a lead frame, and the conductive paste extends to the side surface of the base.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a base, a seed layer, a compound semiconductor layer, a gate structure, a source structure, a drain structure, and a conductive paste. The seed layer is disposed on the base. The compound semiconductor layer is disposed on the seed layer. The gate structure is disposed on the compound semiconductor layer. The source structure and the drain structure are disposed on both sides of the gate structure. In addition, the conductive paste is disposed between the base and a lead frame, and the conductive paste extends to the side surface of the base.

Abstract: A fiber optical connector includes a connector housing, a slidable block, and a handle. The connector housing includes an elastic arm outwardly and inclinedly extending out of the connector housing. Two sides of the elastic arm respectively include engaging protrusions and protruding blocks. The slidable block is fitted out of the connector housing. The slidable block includes sidewalls and slidable grooves formed on side surfaces of the sidewalls. The protruding blocks are respectively engaged in the slidable grooves, and one side of each of the sidewalls includes a buckling groove. An extension block is extending from a first end of the handle and the extension block is received between the sidewalls. The handle includes buckling blocks located out of the extension block, and the buckling blocks are respectively engaged in the buckling grooves.

Abstract: An adaptor with a built-in shutter member for optical connector including a body, a shutter, and an elastic member is provided. The body has a receiving space. The shutter is movably assembled to the body to shield or expose the receiving space. An optical connector is suited for pushing away the shutter to enter the receiving space to be connected to the body. The shutter has a step structure such that a gap is maintained between the shutter and the optical connector. The elastic member is disposed in the body and located on a moving path of the shutter. The shutter deforms the elastic member when the optical connector pushes away the shutter, and the elastic member drives the shutter to be restored when the optical connector leaves the receiving space.

Abstract: A magnetoresistor device includes a magnetoresistor, a protection layer, a first conductive structure, and a second conductive structure. The magnetoresistor is disposed over a substrate. The protection layer is formed over a portion of the magnetoresistor. The first conductive structure is disposed over the protection layer and includes a lower barrier layer and a metal layer disposed over the lower barrier layer. The second conductive structure is disposed over the substrate and partially covers the magnetoresistor. The second conductive structure includes the lower barrier layer and the metal layer disposed over the lower barrier layer.

Abstract: A fiber optical connector includes a connector housing, a slidable block, and a handle. The connector housing includes an elastic arm outwardly and inclinedly extending out of the connector housing. Two sides of the elastic arm respectively include engaging protrusions and protruding blocks. The slidable block is fitted out of the connector housing. The slidable block includes sidewalls and slidable grooves formed on side surfaces of the sidewalls. The protruding blocks are respectively engaged in the slidable grooves, and one side of each of the sidewalls includes a buckling groove. An extension block is extending from a first end of the handle and the extension block is received between the sidewalls. The handle includes buckling blocks located out of the extension block, and the buckling blocks are respectively engaged in the buckling grooves.

Abstract: A magnetoresistor device includes a magnetoresistor, a protection layer, a first conductive structure, and a second conductive structure. The magnetoresistor is disposed over a substrate. The protection layer is formed over a portion of the magnetoresistor. The first conductive structure is disposed over the protection layer and includes a lower barrier layer and a metal layer disposed over the lower barrier layer. The second conductive structure is disposed over the substrate and partially covers the magnetoresistor. The second conductive structure includes the lower barrier layer and the metal layer disposed over the lower barrier layer.

Abstract: An adaptor with a built-in shutter member for optical connector including a body, a shutter, and an elastic member is provided. The body has a receiving space. The shutter is movably assembled to the body to shield or expose the receiving space. An optical connector is suited for pushing away the shutter to enter the receiving space to be connected to the body. The shutter has a step structure such that a gap is maintained between the shutter and the optical connector. The elastic member is disposed in the body and located on a moving path of the shutter. The shutter deforms the elastic member when the optical connector pushes away the shutter, and the elastic member drives the shutter to be restored when the optical connector leaves the receiving space.

Abstract: Disclosed is a single physical antenna structure that has two ports and two ground points and functions as two separate and independent subantennas. Although the two subantennas are in close physical proximity and are physically connected, the antenna structure provides strong isolation to allow the subantennas to function independently of one another, particularly useful in MU-MIMO applications.

Abstract: An optical adapter includes a base body, a shutter member, and a supporting base. The shutter member is pivotally connected at an insertion opening of the base body. The supporting base is assembled on a bottom portion of the base body. A surface of the supporting base has an abutting piece inside the base body. One of two ends of the abutting piece includes a fixing portion fixed on the supporting base, and the other end of the abutting piece includes an abutting portion obliquely extending toward the shutter member to abut against a back surface of the shutter member. Therefore, the supporting base can be assembled on the bottom of the base body conveniently. Furthermore, when the abutting piece is pushed and compressed by the shutter member, the abutting piece is not prone to have excessive deformation, prevent the abutting piece from being deformed or damaged easily.

Abstract: An optical adapter includes a base body, a shutter member, and a supporting base. The shutter member is pivotally connected at an insertion opening of the base body. The supporting base is assembled on a bottom portion of the base body. A surface of the supporting base has an abutting piece inside the base body. One of two ends of the abutting piece includes a fixing portion fixed on the supporting base, and the other end of the abutting piece includes an abutting portion obliquely extending toward the shutter member to abut against a back surface of the shutter member. Therefore, the supporting base can be assembled on the bottom of the base body conveniently. Furthermore, when the abutting piece is pushed and compressed by the shutter member, the abutting piece is not prone to have excessive deformation, prevent the abutting piece from being deformed or damaged easily.

Abstract: The present invention relates to a smart brake warning system, wherein the system is installed on a vehicle body either directly or using a base. The system comprises at least a warning light device, which is used to emit different modes or degrees of light to serve as a warning for vehicles approaching from the rear, and at least one inertia detection device, which is used to detect the inertia of the vehicle at that instance, and control the warning light device to emit different degrees of light mode according to the size of the inertia force. Even if the vehicle driver does not step on the vehicle brake, the present invention is still able to produce a warning signal to vehicle drivers approaching from the rear, achieving a forced warning effect that prevents accidental rear-end collisions.

Abstract: A rack-mount chassis includes a rear casing, a door plate, a first pivot assembly, and a second pivot assembly. The rear casing has an opening. The door plate is configured to shield the opening. The first pivot assembly includes a first bearing portion and a first shaft portion. The first bearing portion has a first shaft hole and a first passage. The first passage extends from the first shaft hole to an outer edge of the first bearing portion. The first shaft portion has a first shaft body. The first shaft body is moved into the first shaft hole through the first passage. The second pivot assembly includes a second bearing portion and a second shaft portion. The second bearing portion has a second shaft hole. The second shaft portion has a second shaft body. The second shaft body is located in the second shaft hole.

Abstract: The present invention relates to a smart brake warning system, wherein the system is installed on a vehicle body either directly or using a base. The system comprises at least a warning light device, which is used to emit different modes or degrees of light to serve as a warning for vehicles approaching from the rear, and at least one inertia detection device, which is used to detect the inertia of the vehicle at that instance, and control the warning light device to emit different degrees of light mode according to the size of the inertia force. Even if the vehicle driver does not step on the vehicle brake, the present invention is still able to produce a warning signal to vehicle drivers approaching from the rear, achieving a forced warning effect that prevents accidental rear-end collisions.

Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.

Abstract: A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same.

Abstract: A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer.