Patents by Inventor Chih Jen Wu
Chih Jen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9257326Abstract: A method of making a backside illuminated image sensor includes forming a first isolation structure in a pixel region of a substrate, where a bottom of the first isolation structure is exposed at a back surface of the substrate. The method further includes forming a second isolation structure in a peripheral region of the substrate, where the second isolation structure has a depth less than a depth of the first isolation structure. Additionally, the method includes forming an implant region adjacent to at least a portion of sidewalls of the first isolation structure, where the portion of the sidewalls is located closer to the back surface than a front surface of the substrate, and where the second isolation structure is free of the implant region.Type: GrantFiled: December 31, 2014Date of Patent: February 9, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, Dun-Nian Yaung, An-Chun Tu
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Patent number: 9250286Abstract: A method performed using a resistive device, where the resistive device includes a substrate with an active region separated from a gate electrode by a dielectric and electrical contacts along a longest dimension of the gate electrode, the method comprising, performing one or more processes to form the resistive device, measuring a resistance between the electrical contacts, and correlating the measured resistance with a variation in one or more of the processes.Type: GrantFiled: April 7, 2014Date of Patent: February 2, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: An-Chun Tu, Chen-Ming Huang, Chih-Jen Wu, Chin-Hsiang Lin
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Publication number: 20150111334Abstract: A method of making a backside illuminated image sensor includes forming a first isolation structure in a pixel region of a substrate, where a bottom of the first isolation structure is exposed at a back surface of the substrate. The method further includes forming a second isolation structure in a peripheral region of the substrate, where the second isolation structure has a depth less than a depth of the first isolation structure. Additionally, the method includes forming an implant region adjacent to at least a portion of sidewalls of the first isolation structure, where the portion of the sidewalls is located closer to the back surface than a front surface of the substrate, and where the second isolation structure is free of the implant region.Type: ApplicationFiled: December 31, 2014Publication date: April 23, 2015Inventors: Kuan-Chieh HUANG, Chih-Jen WU, Chen-Ming HUANG, Dun-Nian YAUNG, An-Chun TU
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Patent number: 8952474Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.Type: GrantFiled: October 4, 2012Date of Patent: February 10, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Chieh Huang, Dun-Nian Yaung, Chih-Jen Wu, Chen-Ming Huang
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Patent number: 8946847Abstract: A backside illuminated image sensor includes a substrate with a substrate depth, where the substrate includes a pixel region and a peripheral region. The substrate further includes a front surface and a back surface. The backside illuminated image sensor includes a first isolation structure formed in the pixel region of the substrate, where a bottom of the first isolation structure is exposed at the back surface of the substrate. The backside illuminated image sensor includes a second isolation structure formed in the peripheral region of the substrate, where the second isolation structure has a depth less than a depth of the first isolation structure. The backside illuminated image sensor includes an implant region adjacent to at least a portion of sidewalls of each isolation structure in the pixel region.Type: GrantFiled: February 4, 2014Date of Patent: February 3, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, Dun-Nian Yaung, An-Chun Tu
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Patent number: 8796105Abstract: A method for depositing a polysilazane on a semiconductor wafer is provided. The method includes steps of disposing a silazane onto the semiconductor wafer, and heating the silazane to form the polysilazane on the semiconductor wafer. An apparatus for preparing a polysilazane on a semiconductor wafer is also provided.Type: GrantFiled: July 25, 2012Date of Patent: August 5, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: You-Hua Chou, Chih-Tsung Lee, Min-Hao Hong, Ming-Huei Lien, Chih-Jen Wu, Chen-Ming Huang
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Patent number: 8791541Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.Type: GrantFiled: July 5, 2012Date of Patent: July 29, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Chieh Huang, Dun-Nian Yaung, Chih-Jen Wu, Chen-Ming Huang
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Publication number: 20140203282Abstract: A method performed using a resistive device, where the resistive device includes a substrate with an active region separated from a gate electrode by a dielectric and electrical contacts along a longest dimension of the gate electrode, the method comprising, performing one or more processes to form the resistive device, measuring a resistance between the electrical contacts, and correlating the measured resistance with a variation in one or more of the processes.Type: ApplicationFiled: April 7, 2014Publication date: July 24, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: An-Chun Tu, Chen-Ming Huang, Chih-Jen Wu, Chin-Hsiang Lin
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Publication number: 20140206113Abstract: A method performed using a resistive device, where the resistive device includes a substrate with an active region separated from a gate electrode by a dielectric and electrical contacts along a longest dimension of the gate electrode, the method comprising, performing one or more processes to form the resistive device, measuring a resistance between the electrical contacts, and correlating the measured resistance with a variation in one or more of the processes.Type: ApplicationFiled: April 7, 2014Publication date: July 24, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: An-Chun Tu, Chen-Ming Huang, Chih-Jen Wu, Chin-Hsiang Lin
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Publication number: 20140162534Abstract: A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.Type: ApplicationFiled: December 6, 2012Publication date: June 12, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shih-Chi LIN, Kun-Tai WU, You-Hua CHOU, Chih-Tsung LEE, Min Hao HONG, Chih-Jen WU, Chen-Ming HUANG, Soon-Kang HUANG, Chin-Hsiang CHANG, Chih-Yuan YANG
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Publication number: 20140151835Abstract: A backside illuminated image sensor includes a substrate with a substrate depth, where the substrate includes a pixel region and a peripheral region. The substrate further includes a front surface and a back surface. The backside illuminated image sensor includes a first isolation structure formed in the pixel region of the substrate, where a bottom of the first isolation structure is exposed at the back surface of the substrate. The backside illuminated image sensor includes a second isolation structure formed in the peripheral region of the substrate, where the second isolation structure has a depth less than a depth of the first isolation structure. The backside illuminated image sensor includes an implant region adjacent to at least a portion of sidewalls of each isolation structure in the pixel region.Type: ApplicationFiled: February 4, 2014Publication date: June 5, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kuan-Chieh HUANG, Chih-Jen WU, Chen-Ming HUANG, Dun-Nian YAUNG, An-Chun TU
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Patent number: 8704224Abstract: A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.Type: GrantFiled: September 23, 2011Date of Patent: April 22, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: An-Chun Tu, Chen-Ming Huang, Chih-Jen Wu, Chin-Hsiang Lin
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Patent number: 8674469Abstract: A backside illuminated image sensor includes an isolation structure passing through a substrate, a sensor element formed overlying the front surface of the substrate, and a color filter formed overlying the back surface of the substrate.Type: GrantFiled: April 23, 2010Date of Patent: March 18, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, Dun-Nian Yaung, An-Chun Tu
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Publication number: 20140030866Abstract: A method for depositing a polysilazane on a semiconductor wafer is provided. The method includes steps of disposing a silazane onto the semiconductor wafer, and heating the silazane to form the polysilazane on the semiconductor wafer. An apparatus for preparing a polysilazane on a semiconductor wafer is also provided.Type: ApplicationFiled: July 25, 2012Publication date: January 30, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: You-Hua Chou, Chih-Tsung Lee, Min-Hao Hong, Ming-Huei Lien, Chih-Jen Wu, Chen-Ming Huang
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Patent number: 8605276Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.Type: GrantFiled: November 1, 2011Date of Patent: December 10, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Jen Wu, Chen-Ming Huang, Kuan-Chieh Huang, Chi-Yuan Shih, Chin-Hsiang Lin
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Patent number: 8586404Abstract: This description relates to a method for reducing CMOS Image Sensor (CIS) contact resistance, the CIS having a pixel array and a periphery. The method includes performing Physical Vapor Deposition (PVD) at a pixel contact hole area, annealing for silicide formation at the pixel contact hole area and performing contact filling. This description also relates to a method for reducing CMOS Image Sensor (CIS) contact resistance, the CIS having a pixel array and a periphery. The method includes implanting N+ or P+ for pixel contact plugs at a pixel contact hole area, performing Physical Vapor Deposition (PVD) at pixel contact hole area, annealing for silicide formation at the pixel contact hole area, performing contact filling and depositing a first metal film layer, wherein the first metal film layer links contact holes for a source, a drain, or a poly gate of a CMOS device.Type: GrantFiled: July 24, 2012Date of Patent: November 19, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Chieh Huang, Chih-Jen Wu, Chen-Ming Huang, Dun-Nian Yaung, An-Chun Tu
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Publication number: 20130107248Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.Type: ApplicationFiled: November 1, 2011Publication date: May 2, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Jen Wu, Chen-Ming Huang, Kuan-Chieh Huang, Chi-Yuan Shih, Chin-Hsiang Lin
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Publication number: 20130093036Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.Type: ApplicationFiled: October 4, 2012Publication date: April 18, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Chieh Huang, Dun-Nian Yaung, Chih-Jen Wu, Chen-Ming Huang
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Publication number: 20130076385Abstract: A resistive test structure that includes a semiconductor substrate with an active region, a gate stack formed over the active region, a first electrical contact in communication with the active region on opposing sides of the gate stack, the first electrical contact providing an electrical short across a first dimension of the gate stack, and a second electrical contact in communication with the active region on the opposing sides of the gate stack, the second electrical contact providing an electrical short across the first dimension of the gate stack, the first and second electrical contacts spaced along a second dimension of the gate stack perpendicular to the first dimension.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: An-Chun Tu, Chen-Ming Huang, Chih-Jen Wu, Chin-Hsiang Lin
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Patent number: 8352062Abstract: A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; performing a plurality of processes to form a gate stack over the substrate, wherein the gate stack comprises a gate layer; measuring a grain size of the gate layer after at least one of the plurality of processes; determining whether the measured grain size is within a target range; and modifying a recipe of at least one of the plurality of processes if the measured grain size of the gate layer is not within the target range.Type: GrantFiled: March 11, 2009Date of Patent: January 8, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Jen Wu, Chen-Ming Huang, An-Chun Tu