Patents by Inventor Chih-Ju Hung

Chih-Ju Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140268734
    Abstract: A light-emitting diode (LED) module lamp with adjustable chromaticity is provided. The LED module lamp is formed by at least one set of second module including a plurality of LED modules, namely a first LED module to an nth LED module. Each of the LED modules includes a plurality of LEDs having visible spectrum chromaticities. That is, a first chromaticity LED C1 to an nth chromaticity LED Cn form a structure in a cyclic arrangement. The second module array is: ? [ C 1 C 2 C 3 … C n - 1 C n C 2 C 3 C 4 … … C n C 1 C 3 C 4 … … C n C 1 C 2 … … … … … … … C n C 1 … … … C n - 2 C n - 1 ] , where the first to nth columns are independently connected in series.
    Type: Application
    Filed: September 17, 2013
    Publication date: September 18, 2014
    Inventors: CHEN-HAO CHANG, CHIH-JU HUNG
  • Patent number: 7409660
    Abstract: A method of avoiding substrate noise in an integrated circuit includes steps of receiving as input an integrated circuit design that includes at least a portion of a block for placement and routing on a substrate and an outer boundary of the block. An end cell is selected from a set of end cells for terminating the block in an outer area that extends from the outer boundary to an end cell boundary outside the block. The selected end cell is placed in the outer area to isolate the block electrically from the substrate.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: August 5, 2008
    Assignee: LSI Corporation
    Inventors: Chih-Ju Hung, Xiang Matthew Song, Hsiao-Hui Wu, Kai Lai, Fredrick Jen
  • Publication number: 20070157145
    Abstract: A method of avoiding substrate noise in an integrated circuit includes steps of receiving as input from an integrated circuit design at least a portion of a block for placement and routing on a substrate and an outer boundary of the block, selecting an end cell from a set of end cells for terminating the block in an outer area that extends from the outer boundary to an end cell boundary outside the block, and placing the selected end cell in the outer area to isolate the block electrically from the substrate.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Chih-Ju Hung, Xiang Song, Hsiao-Hui Wu, Kai Lai, Fredrick Jen
  • Patent number: 6998716
    Abstract: Provided are methods and composition for forming diamond metal-filled patterns above an integrated circuit substrate. A metal layer is formed above the integrated circuit substrate, which is then patterned such that a metal line is created. A plurality of diamond-shaped metal regions are then formed at least one of above and adjacent to the metal line formed on the integrated circuit substrate such that the density of metal on the integrated circuit substrate is greater than a specified density, thereby ensuring that a surface of dielectric formed above the metal line remains substantially planar after application of CMP to the dielectric layer.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: February 14, 2006
    Assignee: LSI Logic Corporation
    Inventor: Chih-Ju Hung
  • Publication number: 20050098895
    Abstract: Provided are methods and composition for forming diamond metal-filled patterns above an integrated circuit substrate. A metal layer is formed above the integrated circuit substrate, which is then patterned such that a metal line is created. A plurality of diamond-shaped metal regions are then formed at least one of above and adjacent to the metal line formed on the integrated circuit substrate such that the density of metal on the integrated circuit substrate is greater than a specified density, thereby ensuring that a surface of dielectric formed above the metal line remains substantially planar after application of CMP to the dielectric layer.
    Type: Application
    Filed: December 16, 2004
    Publication date: May 12, 2005
    Inventor: Chih-Ju Hung
  • Patent number: 6867127
    Abstract: Provided are methods and composition for forming diamond metal-filled patterns above an integrated circuit substrate. A metal layer is formed above the integrated circuit substrate, which is then patterned such that a metal line is created. A plurality of diamond-shaped metal regions are then formed at least one of above and adjacent to the metal line formed on the integrated circuit substrate such that the density of metal on the integrated circuit substrate is greater than a specified density, thereby ensuring that a surface of dielectric formed above the metal line remains substantially planar after application of CMP to the dielectric layer.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: March 15, 2005
    Assignee: LSI Logic Corporation
    Inventor: Chih-Ju Hung
  • Patent number: 5504395
    Abstract: An incandescent lamp bulb which is driven by an electronic control module (ECM) and method of manufacture characterized in that an inductor comprising a magnetic element and a winding thereon is disposed within a screw shell base of the lamp bulb and surrounds the lamp exhaust tube therein. One end of the winding on the magnetic element is connected to a filament wire within the screw shell base and the other end of the inductive winding is connected to an output terminal of the ECM control module. In this manner, the inductor significantly reduces the di/dt rise time of voltage and current when a triac within the ECM module is driven to conduction on each one half cycle of the applied AC line voltage. This operation in turn produces a substantial reduction in radio frequency interference, both of radiation transmitted into space from the lamp bulb and by direct DC coupling back into the AC line voltage source.
    Type: Grant
    Filed: March 4, 1994
    Date of Patent: April 2, 1996
    Assignee: Beacon Light Products, Inc.
    Inventors: Samuel A. Johnson, Patrick Roblin, Chih-Ju Hung, Veng-Chong Lau