Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A light-emitting diode (LED) module lamp with adjustable chromaticity is provided. The LED module lamp is formed by at least one set of second module including a plurality of LED modules, namely a first LED module to an nth LED module. Each of the LED modules includes a plurality of LEDs having visible spectrum chromaticities. That is, a first chromaticity LED C1 to an nth chromaticity LED Cn form a structure in a cyclic arrangement. The second module array is: ? [ C 1 C 2 C 3 … C n - 1 C n C 2 C 3 C 4 … … C n C 1 C 3 C 4 … … C n C 1 C 2 … … … … … … … C n C 1 … … … C n - 2 C n - 1 ] , where the first to nth columns are independently connected in series.

Abstract: A method of avoiding substrate noise in an integrated circuit includes steps of receiving as input an integrated circuit design that includes at least a portion of a block for placement and routing on a substrate and an outer boundary of the block. An end cell is selected from a set of end cells for terminating the block in an outer area that extends from the outer boundary to an end cell boundary outside the block. The selected end cell is placed in the outer area to isolate the block electrically from the substrate.

Abstract: A method of avoiding substrate noise in an integrated circuit includes steps of receiving as input from an integrated circuit design at least a portion of a block for placement and routing on a substrate and an outer boundary of the block, selecting an end cell from a set of end cells for terminating the block in an outer area that extends from the outer boundary to an end cell boundary outside the block, and placing the selected end cell in the outer area to isolate the block electrically from the substrate.

Abstract: Provided are methods and composition for forming diamond metal-filled patterns above an integrated circuit substrate. A metal layer is formed above the integrated circuit substrate, which is then patterned such that a metal line is created. A plurality of diamond-shaped metal regions are then formed at least one of above and adjacent to the metal line formed on the integrated circuit substrate such that the density of metal on the integrated circuit substrate is greater than a specified density, thereby ensuring that a surface of dielectric formed above the metal line remains substantially planar after application of CMP to the dielectric layer.

Abstract: Provided are methods and composition for forming diamond metal-filled patterns above an integrated circuit substrate. A metal layer is formed above the integrated circuit substrate, which is then patterned such that a metal line is created. A plurality of diamond-shaped metal regions are then formed at least one of above and adjacent to the metal line formed on the integrated circuit substrate such that the density of metal on the integrated circuit substrate is greater than a specified density, thereby ensuring that a surface of dielectric formed above the metal line remains substantially planar after application of CMP to the dielectric layer.

Abstract: Provided are methods and composition for forming diamond metal-filled patterns above an integrated circuit substrate. A metal layer is formed above the integrated circuit substrate, which is then patterned such that a metal line is created. A plurality of diamond-shaped metal regions are then formed at least one of above and adjacent to the metal line formed on the integrated circuit substrate such that the density of metal on the integrated circuit substrate is greater than a specified density, thereby ensuring that a surface of dielectric formed above the metal line remains substantially planar after application of CMP to the dielectric layer.

Abstract: An incandescent lamp bulb which is driven by an electronic control module (ECM) and method of manufacture characterized in that an inductor comprising a magnetic element and a winding thereon is disposed within a screw shell base of the lamp bulb and surrounds the lamp exhaust tube therein. One end of the winding on the magnetic element is connected to a filament wire within the screw shell base and the other end of the inductive winding is connected to an output terminal of the ECM control module. In this manner, the inductor significantly reduces the di/dt rise time of voltage and current when a triac within the ECM module is driven to conduction on each one half cycle of the applied AC line voltage. This operation in turn produces a substantial reduction in radio frequency interference, both of radiation transmitted into space from the lamp bulb and by direct DC coupling back into the AC line voltage source.