Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.

Abstract: A power system including a first battery pack, a second battery pack, and a power management circuit is disclosed. The first battery pack has a first end and a second end, and has a first battery capacity. The second battery pack has a third end and a fourth end. The third end is coupled to the second end of the first battery pack and provides a low battery voltage. The fourth end is grounded, the second battery pack has a second battery capacity, and the second battery capacity is greater than the first battery capacity. The power management circuit is coupled to the second battery pack to receive the low battery voltage, and provides a component operating voltage to an electronic components based on the low battery voltage.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: A supporting device includes a bottom seat with a first positioning member, a first supporting frame pivotally connected with the bottom seat, a second supporting frame, a third supporting frame pivotally connected with the first supporting frame and a fourth supporting frame to be coupled with a supported object. The second supporting frame is pivotally connected with the first supporting frame so as to change a height as a result of an angle of the first supporting frame relative to the bottom seat. The second supporting frame has a second positioning member to be coupled with the first positioning member in order to fix the first and second supporting frames. The fourth supporting frame is pivotally connected with the second and third supporting frame so that an angle and a height of the supported object are simultaneously changed with a pivoting motion of the first, second, third and fourth supporting frames.

Abstract: A supporting device includes a bottom seat with a first positioning member, a first supporting frame pivotally connected with the bottom seat, a second supporting frame, a third supporting frame pivotally connected with the first supporting frame and a fourth supporting frame to be coupled with a supported object. The second supporting frame is pivotally connected with the first supporting frame so as to change a height as a result of an angle of the first supporting frame relative to the bottom seat. The second supporting frame has a second positioning member to be coupled with the first positioning member in order to fix the first and second supporting frames. The fourth supporting frame is pivotally connected with the second and third supporting frame so that an angle and a height of the supported object are simultaneously changed with a pivoting motion of the first, second, third and fourth supporting frames.

Abstract: A support frame for a portable electronic device includes a frame body, a first support arm, and a second support arm. The first support arm includes a first casing plate and a first inner plate. The first casing plate is pivotally connected to the frame body. The first inner plate is movably accommodated in the first casing plate. The second support arm includes a second casing plate and a second inner plate. The second casing plate is pivotally connected to the frame body. The second inner plate is movably accommodated in the second casing plate. The first and second inner plates are pivotally connected to each other. The first and second inner plates are provided with multiple positioning portions, respectively. Each of the first and second casing plates is provided with a positioning member that can be positioned to one of the positioning portions of the corresponding inner plate.

Abstract: A support frame for a portable electronic device includes a frame body, a first support arm, and a second support arm. The first support arm includes a first casing plate and a first inner plate. The first casing plate is pivotally connected to the frame body. The first inner plate is movably accommodated in the first casing plate. The second support arm includes a second casing plate and a second inner plate. The second casing plate is pivotally connected to the frame body. The second inner plate is movably accommodated in the second casing plate. The first and second inner plates are pivotally connected to each other. The first and second inner plates are provided with multiple positioning portions, respectively. Each of the first and second casing plates is provided with a positioning member that can be positioned to one of the positioning portions of the corresponding inner plate.

Abstract: Disclosed is a plug retention device consisting of a frame applied between the socket of an electronic device and it's plug. The frame decreases the annular gap present between the plug and socket, thereby improving retention of the plug within the socket and preventing accidental disconnection.

Abstract: A touch-control writing tool wherein the pipe body of the touch-control writing tool has a long through hole and an opening on one end thereof. A rotating element is pivotally provided on the end of the opening of the pipe body. The writing head of a rod body goes through and protrudes from the rotating element. The rotating element drives the rod body to perform an axial displacement in the long through hole via the transmission component in the long through hole, thereby adjusting the length of the writing head outside the rotating element.

Abstract: A touch-control writing tool wherein the pipe body of the touch-control writing tool has a long through hole and an opening on one end thereof. A rotating element is pivotally provided on the end of the opening of the pipe body. The writing head of a rod body goes through and protrudes from the rotating element. The rotating element drives the rod body to perform an axial displacement in the long through hole via the transmission component in the long through hole, thereby adjusting the length of the writing head outside the rotating element.

Abstract: An automatic folding/unfolding umbrella includes a main rod, umbrella ribs for supporting a canopy, a slide element, and a handle. The umbrella ribs are pivotally installed at the tip of the main rod, and primary link rods are pivotally installed under the tip of the main rod. A secondary link rod is pivotally coupled between each corresponding umbrella rib and each primary link rod. The slide element is installed on the main rod. A handle installed at a bottom end of the main rod includes a link mechanism. The main rod includes a link element and a link mechanism coupled to the slide element. Elastically stretchable elements couple the slide element with the primary link rod. The link mechanism is driven by the link element to slide the slide element. The elastically stretchable elements are pulled to drive the primary link rods to unfold or fold the umbrella ribs.

Abstract: An automatic folding/unfolding umbrella includes a main rod, umbrella ribs for supporting a canopy, a slide element, and a handle. The umbrella ribs are pivotally installed at the tip of the main rod, and primary link rods are pivotally installed under the tip of the main rod. A secondary link rod is pivotally coupled between each corresponding umbrella rib and each primary link rod. The slide element is installed on the main rod. A handle installed at a bottom end of the main rod includes a link mechanism. The main rod includes a link element and a link mechanism coupled to the slide element. Elastically stretchable elements couple the slide element with the primary link rod. The link mechanism is driven by the link element to slide the slide element. The elastically stretchable elements are pulled to drive the primary link rods to unfold or fold the umbrella ribs.