Patents by Inventor CHIH-JUI LIN

CHIH-JUI LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105642
    Abstract: A method of manufacturing a package structure at least includes the following steps. An encapsulant laterally is formed to encapsulate the die and the plurality of through vias. A plurality of first connectors are formed to electrically connect to first surfaces of the plurality of through vias. A warpage control material is formed over the die, wherein the warpage control material is disposed to cover an entire surface of the die. A protection material is formed over the encapsulant and around the plurality of first connectors and the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Publication number: 20240107682
    Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.
    Type: Application
    Filed: April 21, 2023
    Publication date: March 28, 2024
    Inventors: Chao-Wei Chiu, Chih-Chiang Tsao, Jen-Jui Yu, Hsuan-Ting Kuo, Hsiu-Jen Lin, Ching-Hua Hsieh
  • Publication number: 20240088062
    Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Jen-Jui Yu, Cheng-Shiuan Wong
  • Patent number: 10883201
    Abstract: A polytetrafluoroethylene textile and manufacturing method thereof is disclosed. a pretreatment process is performed on a plurality of polytetrafluoroethylene yarns. In the pretreatment process, a step of extending the polytetrafluoroethylene yarns are extended, the polytetrafluoroethylene yarns are knitted into a polytetrafluoroethylene fabric, the shape of the polytetrafluoroethylene fabric is fixed, and the polytetrafluoroethylene fabric are de-knitted into the polytetrafluoroethylene yarns with a plurality of knit-assisting parts. A second knitting process is performed to knit the polytetrafluoroethylene yarns and a plurality of artificial yarns together to obtain the polytetrafluoroethylene textile.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: January 5, 2021
    Inventors: Ching-Hai Liang, Huang-Shan Lin, Cheng-Hsuan Wu, Chih-Jui Lin
  • Publication number: 20200115829
    Abstract: A polytetrafluoroethylene textile and manufacturing method thereof is disclosed. a pretreatment process is performed on a plurality of polytetrafluoroethylene yarns. In the pretreatment process, a step of extending the polytetrafluoroethylene yarns are extended, the polytetrafluoroethylene yarns are knitted into a polytetrafluoroethylene fabric, the shape of the polytetrafluoroethylene fabric is fixed, and the polytetrafluoroethylene fabric are de-knitted into the polytetrafluoroethylene yarns with a plurality of knit-assisting parts. A second knitting process is performed to knit the polytetrafluoroethylene yarns and a plurality of artificial yarns together to obtain the polytetrafluoroethylene textile.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 16, 2020
    Applicant: EVEREST TEXTILE CO., LTD.
    Inventors: CHING-HAI LIANG, HUANG-SHAN LIN, CHENG-HSUAN WU, CHIH-JUI LIN
  • Publication number: 20180148865
    Abstract: A polytetrafluoroethylene textile and manufacturing method thereof is disclosed. The method of manufacturing the polytetrafluoroethylene textile comprises: providing a polytetrafluoroethylene yarn and an artificial fiber yarn; and performing a knitting process to knit the polytetrafluoroethylene yarn and the artificial fiber yarn together to thereby obtain the polytetrafluoroethylene textile. The polytetrafluoroethylene textile comprises: an artificial fiber structural layer comprising a plurality of artificial fiber yarns; and a polytetrafluoroethylene structural layer comprising a plurality of polytetrafluoroethylene yarns, and a part of the polytetrafluoroethylene yarns of the polytetrafluoroethylene structural layer and a part of the artificial fiber yarns of the artificial fiber structural layer are knitted together.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 31, 2018
    Applicant: EVEREST TEXTILE CO., LTD.
    Inventors: CHING-HAI LIANG, HUANG-SHAN LIN, CHENG-HSUAN WU, CHIH-JUI LIN