Patents by Inventor Chih-Kai Chan

Chih-Kai Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating apparatus and electroplating method
    Patent number: 11859302
    Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: January 2, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan, Shih-Lian Cheng
  • ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230335466
    Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Jun-Ho Chen
  • ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230335506
    Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan
  • ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
    Publication number: 20230124913
    Abstract: An electroplating apparatus includes an anode and a cathode, a power supply, a regulating plate, and a controller. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes an insulation grid plate and a plurality of wires. The controller is electrically connected to the plurality of wires to control a state of an electromagnetic field around the plurality of wires. An electroplating method is also provided.
    Type: Application
    Filed: March 28, 2022
    Publication date: April 20, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Heng-Ming Nien, Chih-Chiang Lu, Chih-Kai Chan, Shih-Lian Cheng
  • Signal filtering system and method for a computer system remote controller
    Patent number: 6982665
    Abstract: A signal filtering system for a computer system remote controller. The system includes a remote controller, a filtering control enabling unit, and a keyboard encoder. The filtering control enabling unit sets a filtering pin, enabling a keyboard encoder receiving a function signal from the remote controller to filter the signal, selectively transmitting the function signal to a computer system.
    Type: Grant
    Filed: January 24, 2003
    Date of Patent: January 3, 2006
    Assignee: Mitac Technology Corp.
    Inventor: Chih-Kai Chan
  • Signal filtering system and method for a computer system remote controller
    Publication number: 20040090357
    Abstract: A signal filtering system for a computer system remote controller. The system includes a remote controller, a filtering control enabling unit, and a keyboard encoder. The filtering control enabling unit sets a filtering pin, enabling a keyboard encoder receiving a function signal from the remote controller to filter the signal, selectively transmitting the function signal to a computer system.
    Type: Application
    Filed: January 24, 2003
    Publication date: May 13, 2004
    Applicant: Mitac Technology Corp.
    Inventor: Chih-Kai Chan