Patents by Inventor Chih-Kai Chang

Chih-Kai Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296168
    Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.
    Type: Application
    Filed: June 4, 2021
    Publication date: September 23, 2021
    Inventors: Wei-Yip Loh, Chih-Wei Chang, Hong-Mao Lee, Chun-Hsien Huang, Yu-Ming Huang, Yan-Ming Tsai, Yu-Shiuan Wang, Hung-Hsu Chen, Yu-Kai Chen, Yu-Wen Cheng
  • Patent number: 11120722
    Abstract: A data transmission method applied in a display, which includes a display panel, is provided. The data transmission method includes the following steps of: providing a host controller and n display drivers, n is a natural number greater than 1; providing a communication link under mobile industry processor interface (MIPI), connecting the host controller to the n display drivers; determining n virtual channel values Vc1-Vcn corresponding to the respective n display drivers; employing the host controller for providing a command with a virtual channel parameter through the communication link under MIPI; when the virtual channel parameter corresponds to an ith virtual channel values Vci, an ith display driver executing corresponding operations in response to the command, while the rest n?1 display drivers ignoring the command, wherein i is a natural number smaller than or equal to n.
    Type: Grant
    Filed: October 27, 2019
    Date of Patent: September 14, 2021
    Assignee: Novatek Microelectronics Corp.
    Inventors: Po-Chuan Chang-Chian, Chun-Yi Chou, Wing-Kai Tang, Ching-Chun Lin, Chih-Wei Tang
  • Patent number: 11112322
    Abstract: A bicycle has a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: September 7, 2021
    Assignee: GIANT MANUFACTURING CO. LTD.
    Inventors: Chih-Kai Chang, Ching-Yao Lin
  • Publication number: 20210272919
    Abstract: A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Inventors: Chih-Hao LIN, Chien-Kuo CHANG, Tzu-Kai LAN, Chung-Chih CHEN, Jr-Lin HSU
  • Patent number: 11091217
    Abstract: A joint structure of a composite bicycle frame includes a base layer and at least one reinforcing layer. The base layer is made of a first polymeric matrix material doped with a plurality of first fibers. The first fibers have random fiber orientation, and the base layer has a first thickness. The reinforcing layer is adhesively connected to the base layer. The reinforcing layer is made of a second polymeric matrix material doped with a plurality of second fibers. The second fibers have a single fiber orientation. The reinforcing layer has a second thickness which is smaller than the first thickness of the base layer.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: August 17, 2021
    Assignee: GIANT MANUFACTURING CO., LTD.
    Inventors: Chi-Wei Lo, Chih-Kai Chang, Hsu-Pin Hsin, Hung-Chikh Lai
  • Patent number: 11082593
    Abstract: An optical image sensing module includes a base, an optical body, at least one light emitting component, and a sensing unit. The base has a light shielding portion and a bottom portion. The light shielding portion protrudes from the bottom portion. The light shielding portion has a first opening. The bottom portion has a second opening to correspond to the light shielding portion and a third opening adjacent to the second opening. The optical body is located on the base and has a lens portion and a light guiding portion. The lens portion is connected to the light guiding portion, and is adjacent to the first opening. The light emitting component is disposed within the third opening. The sensing unit is disposed in the second opening.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: August 3, 2021
    Assignee: SONIX Technology Co., Ltd.
    Inventors: Sheng-Jie Chen, Chih-Kai Chang, Yung-Le Chang
  • Patent number: 11051402
    Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 ?m to 1 ?m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 ?m and 100 ?m.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: June 29, 2021
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Hung-Yi Chang
  • Patent number: 11008451
    Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: May 18, 2021
    Assignee: Nan Ya Plastics Corporation
    Inventors: Te-Chao Liao, Ying-Te Huang, Chih-Kai Chang, Hung-Yi Chang, Hao-Sheng Chen, Chia-Lin Liu
  • Publication number: 20210048360
    Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.
    Type: Application
    Filed: August 16, 2019
    Publication date: February 18, 2021
    Applicant: Giant Manufacturing Co. Ltd.
    Inventors: CHIH-KAI CHANG, CHING-YAO LIN
  • Publication number: 20210046992
    Abstract: A bicycle capable of measuring power is disclosed. The bicycle comprises a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.
    Type: Application
    Filed: May 13, 2020
    Publication date: February 18, 2021
    Applicant: Giant Manufacturing Co. Ltd.
    Inventors: Chih-Kai CHANG, Ching-Yao LIN, Chung-Wei LIN
  • Patent number: 10889741
    Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: January 12, 2021
    Assignee: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Hao-Sheng Chen, Chih-Kai Chang, Hung-Yi Chang
  • Publication number: 20200389974
    Abstract: A fluorine-containing substrate, a copper clad laminate, and a printed circuit board are provided. The fluorine-containing substrate includes a reinforcing material layer and a fluorine-containing resin layer. The reinforcing material layer includes a substrate and a first inorganic filler. The first inorganic filler is attached on the substrate and is dispersed in the reinforcing material layer. The particle size of the first inorganic filler ranges from 0.02 ?m to 1 ?m. The reinforcing material layer is covered by the fluorine-containing resin layer. The fluoride resin layer includes a second inorganic filler whose particle size ranges between a value larger than 1 ?m and 100 ?m.
    Type: Application
    Filed: October 25, 2019
    Publication date: December 10, 2020
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, CHIH-KAI CHANG, HUNG-YI CHANG
  • Patent number: 10825973
    Abstract: An LED lead frame structure includes a lamp body, and a stamped metal frame including transversely spaced and longitudinally extended first longitudinal frame portion and second longitudinal frame portion, longitudinally spaced and transversely extended first transverse frame portion and second transverse frame portion and a material strip frame. The first transverse frame portion is integrally connected to a rear end of the first longitudinal frame portion. The second transverse frame portions integrally connected to a rear end of the second longitudinal frame portion. This product can be regarded as a semi-finished product having a bendable structure and can be bent again if necessary, and thus, this design can reduce the number of times in bending lamp pins.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: November 3, 2020
    Assignees: U.D. ELECTRONIC CORP., U.D. (DONGGUAN) ELECTRONIC TECHNOLOGY CORP., U.D. (ZHONG JIANG) ELECTRONIC CORP.
    Inventors: Chih-Kai Chang, Qiang Lee, Yao-Ching Huang
  • Patent number: 10819339
    Abstract: A capacitive touch sensing circuit includes a first switch to a fourteenth switch, an operational amplifier, a comparator, a detection capacitor, a feedback capacitor, an amplifier capacitor and a mutual inductance capacitor. The tenth switch is coupled between a first node and a second node respectively coupled to a negative input terminal and an output terminal of operational amplifier. The amplifier capacitor is coupled between a third node and a fourth node. The eleventh switch is coupled between the first node and the third node. The twelfth switch is coupled between the second node and the fourth node. The thirteenth switch is coupled between the third node and the second node. The fourteenth switch is coupled between the fourth node and the first node. The capacitive touch sensing circuit sequentially operates under a first charging phase, a first transfer phase, a second charging phase and a second transfer phase.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: October 27, 2020
    Assignee: Raydium Semiconductor Corporation
    Inventors: Chih-Kai Chang, Chih-Hsiung Chen, Yu-Chin Hsu
  • Publication number: 20200325304
    Abstract: A thermosetting resin composition and a printed circuit board including the same are provided. The composition adopts a thermosetting polyphenylene ether resin whose terminal functional group is a styrene and an acrylic. The thermosetting polyphenylene ether resin has an appropriate hydroxyl value to be easily cured, and the ratio of two different functional groups is between 0.5 and 1.5, for adjusting heat resistance, fluidity, and filling property. A particle diameter of 1 ?m to 40 ?m is added to control a dielectric constant, and after curing characteristics of high dielectric constant, low dielectric loss, high Tg, high rigidity, high flame resistance and low moisture absorption rate can be achieved.
    Type: Application
    Filed: November 11, 2019
    Publication date: October 15, 2020
    Inventors: TE-CHAO LIAO, HAO-SHENG CHEN, HUNG-YI CHANG, CHIA-LIN LIU, CHIH-KAI CHANG
  • Patent number: 10789999
    Abstract: A spread spectrum clock generator including a clock generation circuit, an impedance component and a control circuit is provided. The impedance component is coupled to an impedance terminal of the clock generation circuit. The control circuit is configured to provide a control signal to the impedance component to generate a first voltage at the impedance terminal. The clock generation circuit is configured to generate a spread spectrum clock signal at an oscillation terminal of the clock generation circuit according to the first voltage. Furthermore, a memory storage device and a signal generation method are also provided.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: September 29, 2020
    Assignee: PHISON ELECTRONICS CORP.
    Inventor: Chih-Kai Chang
  • Publication number: 20200230513
    Abstract: A toy building block set includes a socket block piece and at least one of first and second plug block pieces. The socket block piece has a socket wall body and at least one engaging hole of a regular polygonal shape. Each of the first and second plug block pieces has a plug body and at least one polygonal insert plug configured to be inserted into and in frictional engagement with the engaging hole with a first frictional force to permit rotation of the plug block piece relative to the socket block piece by a forcible torque and to keep a predetermined angle of the plug block piece relative to the socket block piece when the forcible torque is removed. The plug body is partially inserted into and in frictional engagement with the engaging hole with a second frictional force larger than the first frictional force.
    Type: Application
    Filed: January 17, 2020
    Publication date: July 23, 2020
    Inventors: Chia-Hao CHAO, Hung-Chan CHEN, Chih-Kai CHANG, Szu-Yuan TENG, Zhi-Hong XU
  • Publication number: 20200220545
    Abstract: A capacitive touch sensing circuit includes a first switch to a fourteenth switch, an operational amplifier, a comparator, a detection capacitor, a feedback capacitor, an amplifier capacitor and a mutual inductance capacitor. The tenth switch is coupled between a first node and a second node respectively coupled to a negative input terminal and an output terminal of operational amplifier. The amplifier capacitor is coupled between a third node and a fourth node. The eleventh switch is coupled between the first node and the third node. The twelfth switch is coupled between the second node and the fourth node. The thirteenth switch is coupled between the third node and the second node. The fourteenth switch is coupled between the fourth node and the first node. The capacitive touch sensing circuit sequentially operates under a first charging phase, a first transfer phase, a second charging phase and a second transfer phase.
    Type: Application
    Filed: December 27, 2019
    Publication date: July 9, 2020
    Inventors: CHIH-KAI CHANG, CHIH-HSIUNG CHEN, YU-CHIN HSU
  • Publication number: 20200220543
    Abstract: In a capacitive touch sensing circuit, a parallel capacitor is coupled to a first input terminal and an output terminal of an operational amplifier. A series capacitor and a sensing capacitor are coupled in series between first input terminal and ground. A test capacitor is coupled to a second node and ground. A first switch is coupled to an operating voltage and a first node. A second switch is coupled to first node and ground. A third switch is coupled to second node and ground. A fourth switch is coupled to operating voltage and second node. A first current source and a fifth switch are coupled between operating voltage and first node. A sixth switch and a second current source are coupled between first node and ground. A seventh switch is coupled to second node and a third node. An eighth switch is coupled to the parallel capacitor.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 9, 2020
    Inventors: Chih-Kai CHANG, Chih-Hsiung CHEN, Yu KUANG, Yu-Chin HSU
  • Publication number: 20200165501
    Abstract: A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Inventors: Te-Chao LIAO, Hao-Sheng CHEN, Chih-Kai CHANG, Hung-Yi CHANG