Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A wireless implant and associated system for motor function recovery after spinal cord injury, and more particularly a multi-channel wireless implant with small package size. The wireless implant can further be used in various medical applications, such as retinal prostheses, gastrointestinal implant, vagus nerve stimulation, and cortical neuromodulation. The system also includes a method and its implementation to acquire the impedance model of the electrode-tissue interface of the implant.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

Abstract: An example computing device comprises: a media capture device to capture media; a pin coupled to the media capture device to communicate an unlock signal to the media capture device; and a basic input/output system interconnected with the pin, wherein, to control activation of the media capture device, the basic input/output system is to: store an authentication parameter, receive, from the media capture device, an unlock request; in response to the unlock request, verify an authentication input against the authentication parameter, and in response to a successful verification, send the unlock signal to unlock the media capture device via the pin.

Abstract: A power-measuring device includes a spindle, a power gauge, an electrical circuit, and a cover. The spindle is configured to provide a coupling with a driving unit. The spindle includes a battery chamber within a hollow space of the spindle. The battery chamber is configured to receive a battery unit. The power gauge is coupled with the spindle to measure power applied to the spindle for driving a movement of the driving unit. The electrical circuit is coupled with the spindle, and electrically coupled with the power gauge. The electrical circuit is coupled with the battery unit and configured to receive and process signals from the power gauge. The cover is coupled with the spindle and arranged to enclose at least a portion of at least one of the power gauge and the electrical circuit.

Abstract: A reinforced prepreg which is applied to a wear-resistant layer structure of a braking track is provided. The reinforced prepreg includes a fiber fabric and a mixture mixed with the fiber fabric. The mixture includes a resin and a plurality of needle-shaped crystals having microscale or nanoscale sizes mixed with the resin.

Abstract: In some examples a computing device, comprising a battery, a processing resource and a memory resource storing non-transitory machine-readable instructions can cause the processing resource to determine a battery charge capacity of the battery, in response to the battery charge capacity being less than a threshold capacity, cause the battery to charge, and in response to the battery charge capacity being greater than the threshold capacity, compare the battery charge capacity of the computing device with a different battery charge capacity associated with a different computing device, and based on the comparison, cause a charge determination event to occur.

Abstract: An image processing method includes: performing content analysis upon an input frame to generate at least one content analysis result of the input frame; determining, by a processing circuit, an anti-blue light strength level for the input frame according to content analysis result(s) of the input frame; and in response to the anti-blue light strength level determined for the input frame, performing color correction upon the input frame to generate an output frame.

Abstract: A method for forming a resin-based composite structure is provided. The method includes: providing a prepreg layup, wherein the prepreg layup includes an epoxy resin-carbon fiber composite material; covering a thermal-fusion material on a surface of the prepreg layup; and performing a molding and curing process to fuse the thermal-fusion material with the prepreg layup. Wherein the molding and curing process includes: heating at a first temperature to melt, soften and fully fuse the thermal-fusion material with the prepreg layup; and heating at a second temperature to solidify the thermal-fusion material for forming the resin-based composite structure. Wherein the first temperature is lower than the second temperature.

Abstract: A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

Abstract: A bicycle has a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: A locking mechanism for securing different expansion cards in a slot of a chassis of a computing device is disclosed. The locking mechanism includes a base and a main body. The base is coupled to the chassis and movable between an open position and a closed position. The main body is coupled to the base and movable between a first orientation and a second orientation. When the base is in the closed position and the main body is in the first orientation, a first mating feature of the main body engages an expansion card having a first form factor inserted into the slot. When the base is in the closed position and the main body is in the second orientation, the second mating feature engages an expansion card having a second form factor inserted into the slot of the chassis.

Abstract: A resin composition for a high frequency substrate and a metal clad laminate are provided. Based on a total weight of the resin composition for the high frequency substrate being 100 phr, the resin composition for the high frequency substrate includes: 20 phr to 70 phr of a polyphenylene ether resin, 5 phr to 40 phr of a polybutadiene resin, 5 phr to 30 phr of a bismaleimide resin, and 20 phr to 45 phr of a crosslinker. A glass transition temperature of the resin composition for the high frequency substrate is higher than or equal to 230° C. The metal clad laminate includes a substrate and a metal layer disposed on the substrate. The substrate is formed from the resin composition for the high frequency substrate.

Abstract: A prepreg and a metallic clad laminate are provided. The prepreg includes a reinforcing material and a thermosetting resin layer. The thermosetting resin layer is formed by immersing the reinforcing material in a thermosetting resin composition. The thermosetting resin composition includes a polyphenylene ether resin, a liquid polybutadiene resin, a crosslinker, and fillers. Based on a total weight of the thermosetting resin composition being 100 phr, an amount of the fillers ranges from 50 phr to 70 phr. The fillers include a granular dielectric filler and a flaky thermal conductive filler. The metallic clad laminate is formed by disposing at least one metal layer onto the prepreg.

Abstract: A locking mechanism for securing different expansion cards in a slot of a chassis of a computing device is disclosed. The locking mechanism includes a base and a main body. The base is coupled to the chassis and movable between an open position and a closed position. The main body is coupled to the base and movable between a first orientation and a second orientation. When the base is in the closed position and the main body is in the first orientation, a first mating feature of the main body engages an expansion card having a first form factor inserted into the slot. When the base is in the closed position and the main body is in the second orientation, the second mating feature engages an expansion card having a second form factor inserted into the slot of the chassis.

Abstract: A bicycle has a spider including a torque input section and at least one torque output section; a crank assembly coupled with the spider through the torque input section and applying an input torque to the spider; a chainring mounted to the spider through the at least one torque output section and receiving an output torque from the spider; a gauge disposed and oriented generally along a tangential direction or a quasi-tangential direction with respect to the torque input section and the at least one torque output section; and a circuitry coupled to the gauge and receiving a signal from the gauge.

Abstract: A joint structure of a composite bicycle frame includes a base layer and at least one reinforcing layer. The base layer is made of a first polymeric matrix material doped with a plurality of first fibers. The first fibers have random fiber orientation, and the base layer has a first thickness. The reinforcing layer is adhesively connected to the base layer. The reinforcing layer is made of a second polymeric matrix material doped with a plurality of second fibers. The second fibers have a single fiber orientation. The reinforcing layer has a second thickness which is smaller than the first thickness of the base layer.

Abstract: An optical image sensing module includes a base, an optical body, at least one light emitting component, and a sensing unit. The base has a light shielding portion and a bottom portion. The light shielding portion protrudes from the bottom portion. The light shielding portion has a first opening. The bottom portion has a second opening to correspond to the light shielding portion and a third opening adjacent to the second opening. The optical body is located on the base and has a lens portion and a light guiding portion. The lens portion is connected to the light guiding portion, and is adjacent to the first opening. The light emitting component is disposed within the third opening. The sensing unit is disposed in the second opening.