Abstract: A hardware-aware zero-cost neural network architecture search system is configured to perform the following. A neural network search space is divided into multiple search blocks. Each of the search blocks includes multiple candidate blocks. The candidate blocks are guided and scored through a latent pattern generator. The candidate blocks in each of the search blocks are scored through a zero-cost accuracy proxy. One of the candidate blocks included in each of the search blocks is sequentially selected as selected candidate blocks, the selected candidate blocks are combined into multiple neural networks to be evaluated, and network potential of the neural networks to be evaluated is calculated according to scores of the selected candidate blocks. One neural network to be evaluated with the highest network potential is selected to determine the corresponding selected candidate blocks.

Abstract: In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including alignment marks; measuring a position of the wafer by measuring positions of the alignment marks with one or more cameras; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.

Abstract: An aiming system includes a positioner, an aiming device, and a processor. The positioner has a function of acquiring spatial information, and the aiming device is connected to the positioner, and the processor is connected to the positioner or the aiming device. A method of using the aiming system is also provided. Surgical guidance is more intuitive by directly combining the positioner with the aiming device.

Abstract: A system and a method for cybersecurity threat detection and early warning are provided. The method includes the following steps: determining whether a network element has an abnormal change according to operation information; if yes, performing a deduction by a cybersecurity event inference model according to the operation information of an abnormal network element to generate a cybersecurity prediction warning; at the same time, collecting and comparing cybersecurity event information and further performing a self-response test on the abnormal network element and a comparison for response result information to finally generate a threat event decision. The cybersecurity prediction warning provides early warning of potential cyberattacks, and the threat event decision provides a robust judgment of the cyberattack event. The present invention solves the problems of long determination time and easily missing judgment and misjudgment.

Abstract: A method of correcting a misalignment of a wafer on a wafer holder and an apparatus for performing the same are disclosed. In an embodiment, a semiconductor alignment apparatus includes a wafer stage; a wafer holder over the wafer stage; a first position detector configured to detect an alignment of a wafer over the wafer holder in a first direction; a second position detector configured to detect an alignment of the wafer over the wafer holder in a second direction; and a rotational detector configured to detect a rotational alignment of the wafer over the wafer holder.

Abstract: The present disclosure discloses a servo motor and an encoder calibration method. The encoder calibration method includes: calculating a gain error, an offset error and a phase error, by an error calculation block, according to a first signal and a second signal output by an encoder; calculating at least one gain calibration parameter, at least one offset calibration parameter and at least one phase calibration parameter, by the error calibration block, according to the gain error, the offset error and the phase error; and calibrating sequentially, by the encoder, the gain, the offset and the phase of the first signal and the second signal according to the at least one gain calibration parameter, the at least one offset calibration parameter and the at least one phase calibration parameter, wherein performing at least one gain calibration and offset calibration after the phase calibration is completed.

Abstract: A casing structure with functionality of effective thermal management is disclosed, which consists of a casing member, a low thermal conductivity medium, a second heat spreader, and a first heat spreader. When a user operates the electronic device, heat generated from CPU and/or GPU is transferred to the second heat spreader via the first heat spreader, and then is two-dimensionally spread in the second heat spreader. Consequently, the heat is dissipated away from the casing member to air due to the outstanding thermal radiation ability of the casing member. The low thermal conductivity medium is adopted for controlling a heat transfer of heat transferring paths from the heat source and ends to the casing member. By applying the casing structure in an electronic device by a form of a top casing and/or a back casing, an outer surface temperature of the casing member can be well controlled.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: A virtual reality tracker includes a first part and a second part. The first part includes a plurality of first light-emitting diodes (LEDs) and an inner measurement unit (IMU). The inertial measurement unit is used for measuring the acceleration and the triaxial angular velocity of the first part. The second part includes a plurality of second light-emitting diodes. Moreover, the first part and the second part are connected by a flexible component.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A fluid pump module includes a heat dissipation board assembly, a fixing frame body, fluid pumps, a control board and a conveying pipe is provided. The fixing frame body is fixed at one side of the heat dissipation board assembly, so as to form two accommodating spaces between the heat dissipation board assembly and the fixing frame body. Two fluid pumps are respectively disposed in the two accommodating spaces. The control board is disposed at another side of the heat dissipation board assembly. The conveying pipe connects the two fluid pumps in series so as to form a series connection therebetween. The control board controls operations of the fluid pumps, and the heat dissipation board assembly dissipates heats produced by a module formed by the two fluid pumps.

Abstract: A heat-dissipating component for a mobile device includes a case body, a micro pump, and a heat dissipation tube plate. The case body has a vent hole and a positioning accommodation trough. The bottom of the positioning accommodation trough is in communication with the vent hole. The micro pump is disposed in the positioning accommodation trough and corresponds to the vent hole The heat dissipation tube plate has cooling fluid inside. One end of the heat dissipation tube plate is fixed on the positioning accommodation trough and contacts a heating element of the mobile device. The gas transmitted by the micro pump forms gas flow so as to perform heat exchange with heat absorbed by the heat dissipation tube plate, and the gas flow is discharged out through the vent hole.

Abstract: A breast pump includes a main body and a breast milk suctioning shield. The main body has an accommodation space. The breast milk suctioning shield is assembled in the accommodation space and detachably connected to the main body. A front end of the breast milk suctioning shield has a breast shielding portion, and a nipple passage extends from a rear end of a center portion of the breast shielding portion. One or more deformable members are assembled with an annular connection portion between the breast shielding portion and the nipple passage, and the deformable member is controlled to be inflated or deflated by a first air pump.

Abstract: A mobile power device capable of detecting gas is disclosed and includes a main body, a gas detection module, a driving and controlling board, a power module and a microprocessor. The main body includes a ventilation opening, a connection port and an accommodation chamber. The ventilation opening is in communication with the accommodation chamber. The gas detection module and the driving and controlling board are disposed within the accommodation chamber. The gas detection module, the power module and the microprocessor are fixed on and electrically connected to the driving and controlling board. The power module is capable of storing an electric energy and outputting the electric energy outwardly. The microprocessor enables the gas detection module to detect and operate. The microprocessor converts the detection information of the gas detection module into a detection data, which is stored and transmitted to the mobile device or an external device.

Abstract: A power driver of an unmanned aerial vehicle is disclosed and includes a main body, a fluid actuation system and a controller, wherein the fluid actuation system includes a driving zone, a converging chamber, a plurality of valves and a fluid discharging zone. The driving zone includes a plurality of flow guiding units which arranged in series, parallel or series-parallel, each of the flow guiding unit generates an inside pressure gradient after being actuated, so as to inhale fluid and diverge fluid by guiding channels, and flow into the convergence chamber for storage, wherein the amount of the fluid transported is controlled by the plurality of valves disposed in the connection channels through the controller, and fluid is finally converged to the fluid discharging zone for discharging the specific transportation amount of fluid.

Abstract: A dynamic pressure controlling footwear is disclosed and includes a main body, a control box and plural dynamic pressure controlling components. The main body includes a vamp disposed on an airbag. The control box includes a microprocessor and is disposed on a top surface region of the vamp. Each dynamic pressure controlling component is positioned on the airbag and includes an actuating pump and a pressure sensor packaged on a substrate by a semiconductor process. The substrate is positioned on the airbag and electrically connected to the microprocessor of the control box through a conductor. The actuating pump is in fluid communication with the airbag for inflating the airbag. The pressure sensor detects an inner pressure of the airbag to generate a pressure information. The microprocessor enables or disables the actuating pump according to the pressure information, so that the inner pressure of the airbag is adjusted.

Abstract: A dynamic pressure controlling footwear is disclosed and includes a main body, a control box and plural dynamic pressure controlling components. The main body includes a vamp disposed on an airbag. The control box includes a microprocessor and is disposed on a top surface region of the vamp. Each dynamic pressure controlling component is positioned on the airbag and includes an actuating pump and a pressure sensor packaged on a substrate by a semiconductor process. The substrate is positioned on the airbag and electrically connected to the microprocessor of the control box through a conductor. The actuating pump is in fluid communication with the airbag for inflating the airbag. The pressure sensor detects an inner pressure of the airbag to generate a pressure information. The microprocessor enables or disables the actuating pump according to the pressure information, so that the inner pressure of the airbag is adjusted.