Patents by Inventor CHIH-KAI CHENG
CHIH-KAI CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084813Abstract: A fan includes a fan hub and multiple blades. At least one blade includes a blade body and two extended blade portions. The two extended blade portions are connected to a first edge and a second edge on the blade body. The first edge and the second edge are opposite to sides of the blade body. In a top view, at least one of the two extended blade portions has a first width that is adjacent to the fan hub, and a second width that is away from the fan hub. The second width is larger than the first width. The second width and the first width are connected by a continuous surface. The width of the continuous surface increases away from the first width.Type: ApplicationFiled: December 19, 2022Publication date: March 14, 2024Inventors: Yi-Lun CHENG, Chih Kai YANG
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Patent number: 11923310Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.Type: GrantFiled: August 9, 2021Date of Patent: March 5, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
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Publication number: 20230347388Abstract: Cleaning tools for cleaning the pull cable of an ingot puller apparatus and methods for cleaning the pull cable are disclosed. The cleaning tool includes a chamber for receiving the pull cable. Pressurized fluid is discharged through one or more nozzles to detach debris from the pull cable. The fluid and debris are collected in an exhaust plenum of the cleaning tool and are expelled through an exhaust tube. The cleaning tool includes one or more guides that guide the cleaning tool in an upper segment of the ingot puller apparatus.Type: ApplicationFiled: April 14, 2023Publication date: November 2, 2023Inventors: Chin-Hung Ho, Chih-Kai Cheng, Chen-Yi Lin, Feng-Chien Tsai, Tung-Hsiao Li, YoungGil Jeong, Jin Yong Uhm
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Publication number: 20210375769Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.Type: ApplicationFiled: August 9, 2021Publication date: December 2, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Kai CHENG, Tsung-Shu LIN, Tsung-Yu CHEN, Hsien-Pin HU, Wen-Hsin WEI
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Publication number: 20210272875Abstract: In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.Type: ApplicationFiled: May 17, 2021Publication date: September 2, 2021Inventors: Yuan Sheng Chiu, Chih-Kai Cheng, Tsung-Shu Lin
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Patent number: 11088079Abstract: A package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.Type: GrantFiled: June 27, 2019Date of Patent: August 10, 2021Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
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Patent number: 11011451Abstract: In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.Type: GrantFiled: April 4, 2019Date of Patent: May 18, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yuan Sheng Chiu, Chih-Kai Cheng, Tsung-Shu Lin
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Publication number: 20200411440Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Kai CHENG, Tsung-Shu LIN, Tsung-Yu CHEN, Hsien-Pin HU, Wen-Hsin WEI
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Publication number: 20200185304Abstract: In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.Type: ApplicationFiled: April 4, 2019Publication date: June 11, 2020Inventors: Yuan Sheng Chiu, Chih-Kai Cheng, Tsung-Shu Lin
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Publication number: 20180166715Abstract: The present invention provides a fuel cell system and a startup and shutdown method therefor for avoiding carbon corrosion. The fuel cell system includes at least one fuel cell reaction module with at least one anode chamber to contain an anode reaction fluid. The method includes steps of: (a) executing a shutdown mode, (b) conducting and connecting a first load to the fuel cell reaction module so as to consume the anode reaction fluid remained in the anode chamber, (c) providing a buffer fluid to the anode chamber and disconnecting the first load from the anode chamber; (d) maintaining the fuel cell system shutdown, (e) executing a startup mode, (f) providing the anode reaction fluid to the anode chamber, and (g) conducting and connecting a second load to the fuel cell reaction module and maintaining the fuel cell system operated continuously.Type: ApplicationFiled: June 12, 2017Publication date: June 14, 2018Inventors: Jefferson YS Yang, Fang-Bor Weng, Chih-Kai Cheng, Tzu-Wei Kuo
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Patent number: 9711478Abstract: A semiconductor device with an anti-pad peeling structure is disclosed. The semiconductor device includes: a semiconductor substrate including a Through Substrate Via (TSV); a dielectric layer on the semiconductor substrate and including a plurality of recesses therein; and a pad above the semiconductor substrate to cover a portion of the dielectric layer and extend to the recesses; wherein the pad extends to the plurality of recesses, and a plurality of contact points are confined in the recesses between the pad and the conductive layer, and each of the contact points is at least partially excluded from a boundary of the TSV when being seen from a top-down perspective.Type: GrantFiled: October 19, 2015Date of Patent: July 18, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chih-Kai Cheng, Cheng-Chieh Hsieh, Shih-Wen Huang
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Publication number: 20170110429Abstract: A semiconductor device with an anti-pad peeling structure is disclosed. The semiconductor device includes: a semiconductor substrate including a Through Substrate Via (TSV); a dielectric layer on the semiconductor substrate and including a plurality of recesses therein; and a pad above the semiconductor substrate to cover a portion of the dielectric layer and extend to the recesses; wherein the pad extends to the plurality of recesses, and a plurality of contact points are confined in the recesses between the pad and the conductive layer, and each of the contact points is at least partially excluded from a boundary of the TSV when being seen from a top-down perspective.Type: ApplicationFiled: October 19, 2015Publication date: April 20, 2017Inventors: CHIH-KAI CHENG, CHENG-CHIEH HSIEH, SHIH-WEN HUANG