Abstract: A display panel adapted to a spherical display device includes a substrate and a plurality of display configuration groups. The display configuration groups are arranged on the substrate along a first direction. Each of the display configuration groups corresponds to a display number and a display pitch. Each of the display configuration groups comprises at least one display row arranged along the first direction. Each of the at least one display row of each of the display configuration groups is arranged along a second direction orthogonal to the first direction according to the corresponding display number and the corresponding display pitch. The display configuration groups include a first configuration group and a second configuration group adjacent to each other, and the display pitch of the first configuration group is different from the display pitch of the second configuration group.

Abstract: A laser welding mechanism includes a main body having a space and two securing devices which are respectively attached to two ends of the body. A linkage assembly includes a bearing and a linkage tube. A refraction mirror unit includes two mirrors connected to the linkage tube of the linkage assembly. A laser unit is pivotally connected to a swinging member which is connected to the linkage tube of the linkage assembly. A drive unit including a motor, a driving gear, and a driven gear. A rotation unit is connected to the swinging member of the laser unit. The laser unit rotates relative to the first workpiece and the second workpiece during welding, ensuring a stable rotation at the joining faces of the two workpieces.

Abstract: A method for processing a curved plastic panel is to first form a hard coating layer, an optical function layer, and a printing layer on a flat plastic substrate, and then cut it into a predetermined shape, and then use a hot pressing and curving device to perform a hot pressing and curving process to the flat plastic substrate in order to make it becoming a curved plastic substrate. The hot pressing and curving device can simultaneously perform hot pressing during the heating process, and has the functions of real-time monitoring of the local temperature and the local curvature forming state, and then feedback to the local heating and curvature forming mechanism for adjustments. The monitoring of temperature and curvature can be divided into multiple stages, which can be monitored stage by stage and adjusted for heating or curvature forming to improve production yield.

Abstract: The present invention discloses a set of novel epigenetic biomarkers for early prediction, treatment response, recurrence and prognosis monitoring of a breast cancer. Aberrant methylation of the genes can be detected in tumor tissues and plasma samples from breast cancer patients but not in normal healthy individual. The present disclosure also discloses primers and probes used herein.

Abstract: An electronic device is provided. The electronic device includes a touch module, a display module, and a control circuit. The display module includes multiple light emitting units. The control circuit is coupled to the touch module and the display module. During a display period, the control circuit provides a first display driving signal to the display module according to image data. During a touch period, the control circuit provides a touch driving signal to the touch module according to the image data. During the touch period, the control circuit provides a second display driving signal to the display module according to the image data. The touch period and the display period do not overlap. The first display driving signal is different from the second display driving signal.

Abstract: A system and method for stealth dicing a semiconductor wafer. The method may include implanting dopant ions to a first depth in the semiconductor wafer through a back side of the semiconductor wafer. The method may further include focusing a laser beam at an inside portion of the wafer through the back surface of the wafer to form a modified layer in material of the semiconductor wafer proximate the first depth. The method may also include fracturing the semiconductor wafer along boundaries defined by the modified layer.

Abstract: A system and method for stealth dicing a semiconductor wafer. The method may include implanting dopant ions to a first depth in the semiconductor wafer through a back side of the semiconductor wafer. The method may further include focusing a laser beam at an inside portion of the wafer through the back surface of the wafer to form a modified layer in material of the semiconductor wafer proximate the first depth. The method may also include fracturing the semiconductor wafer along boundaries defined by the modified layer.

Abstract: A display panel adapted to a spherical display device includes a substrate and a plurality of display configuration groups. The display configuration groups are arranged on the substrate along a first direction. Each of the display configuration groups corresponds to a display number and a display pitch. Each of the display configuration groups comprises at least one display row arranged along the first direction. Each of the at least one display row of each of the display configuration groups is arranged along a second direction orthogonal to the first direction according to the corresponding display number and the corresponding display pitch. The display configuration groups include a first configuration group and a second configuration group adjacent to each other, and the display pitch of the first configuration group is different from the display pitch of the second configuration group.

Abstract: A display apparatus including a carrier and a plurality of pixel units is disclosed. Each pixel unit has a first light-emitting device. The pixel units are provided with a plurality of second light-emitting devices and a plurality of third light-emitting devices, and include a first pixel unit, a second pixel unit, a third pixel unit, and a fourth pixel unit sequentially arranged along a first direction. The first pixel unit and the second pixel unit adjacent to each other share one second light-emitting device and one third light-emitting device. The third pixel unit and the fourth pixel unit adjacent to each other share another second light-emitting device and another third light-emitting device. The second light-emitting devices and the third light-emitting devices are not disposed between two first light-emitting devices of the second pixel unit and third pixel unit adjacent to each other.

Abstract: A battery module including a battery string and a switch is provided. The battery string includes a first battery, a second battery, a third battery, a first metal plate, and a second metal plate. The first battery includes a first positive terminal and a first negative terminal. The second battery includes a second positive terminal and a second negative terminal. The third battery includes a third positive terminal and a third negative terminal. The first metal plate is connected to the first negative terminal and the second positive terminal. The second metal plate is connected to the second negative terminal and the third positive terminal. The switch is connected to the first or second metal plate.

Abstract: A battery module including a battery string and a switch is provided. The battery string includes a first battery, a second battery, a third battery, a first metal plate, and a second metal plate. The first battery includes a first positive terminal and a first negative terminal. The second battery includes a second positive terminal and a second negative terminal. The third battery includes a third positive terminal and a third negative terminal. The first metal plate is connected to the first negative terminal and the second positive terminal. The second metal plate is connected to the second negative terminal and the third positive terminal. The switch is connected to the first or second metal plate.

Abstract: A system and method for stealth dicing a semiconductor wafer. The method may include implanting dopant ions to a first depth in the semiconductor wafer through a back side of the semiconductor wafer. The method may further include focusing a laser beam at an inside portion of the wafer through the back surface of the wafer to form a modified layer in material of the semiconductor wafer proximate the first depth. The method may also include fracturing the semiconductor wafer along boundaries defined by the modified layer.

Abstract: A method that enables building recognition via object detection and geospatial intelligence. The method includes detecting an object in an input image, wherein the object is located within a bounding area and extracting a physical location and a camera pose associated with the input image. The method also includes projecting a location coordinate of at least one entity onto the input image to obtain a projected point for the at least one entity, wherein the at least one entity is selected according to the physical location and camera pose associated with the input image and determining a nearest projected point to the bounding area. Finally, the method includes labeling the object within the bounding area with an entity name of the at least one entity associated with the nearest projected point.

Abstract: A brake system including a base, a driving motor, a cam, a braking pump, a rotating column, and a bearing shaft. The base has an accommodating space. The driving motor is disposed on the base and located in the accommodating space. The cam is pivoted to the driving motor, and the driving motor is adapted to drive the cam to rotate relative to the base. The braking pump is disposed outside the base. The rotating column is rotatably disposed outside the base and connected to the braking pump. The bearing shaft is connected to the rotating column and extended into the accommodating space so as to radially in contact with the cam.

Abstract: A brake system including a base, a driving motor, a cam, a braking pump, a rotating column, and a bearing shaft. The base has an accommodating space. The driving motor is disposed on the base and located in the accommodating space. The cam is pivoted to the driving motor, and the driving motor is adapted to drive the cam to rotate relative to the base. The braking pump is disposed outside the base. The rotating column is rotatably disposed outside the base and connected to the braking pump. The bearing shaft is connected to the rotating column and extended into the accommodating space so as to radially in contact with the cam.

Abstract: A hybrid power brake control system and a control method thereof are provided. The hybrid power brake control system includes a computer, a motor, a connecting rod set, and a pedal brake. The motor is electrically connected with the computer, the connecting rod set includes the first connecting rod and the second connecting rod, the first connecting rod is connected with the motor, the first terminal end of the second connecting rod is connected with the first connecting rod, and the pedal brake is pivotally connected with the second terminal end of the second connecting rod.

Abstract: A backlight module including a substrate, a light source, a porous optical film, and a wavelength conversion optical layer is provided. The light source is located on the substrate. The porous optical film is disposed over the light source and has a plurality of emission structures, and the porous optical film distributes light generated by the light source to be emitted through the emission structures located at different positions of the porous optical film. The porous optical film has a central region and a peripheral region surrounding the central region, the central region is disposed corresponding to the light source, and an area of the central portion is A. The wavelength conversion optical layer is located between the light source and the porous optical film, and a vertical projection area of the wavelength conversion optical film is B, where 0.49?A/B?5.

Abstract: A bicycle trainer includes a base frame including a first pivot connection part, a damper unit mounted at the base frame, a support frame including a locating portion and a second pivot connection part, which is pivotally connected to the first pivot connection part of the base frame for enabling the support frame to be biased relative to the base frame in direction away from or toward the damper unit such that when the support frame is held in an inclined position relative to the base frame, the locating portion and the damper unit can hold a wheel of a bicycle in place, and a non-return unit mounted at the base frame or support frame and adapted to prohibit the support frame from being biased in direction away from the base frame. The invention enables the support frame to be constrained by the non-return unit.

Abstract: A circuit may include a source input for receiving an input voltage, a load output for generating an output voltage, a load switch coupled at its source to the source input and coupled at its drain to the load output which is configured to pass the input voltage to the load output when the load switch is activated, an enable input for receiving an enable voltage which is indicative of whether the load switch is to be activated or deactivated, and a leakage reduction circuit coupled between the enable input and a gate of the load switch, wherein the leakage reduction circuit is configured to electrically couple the gate of the load switch to the source of the load switch such that a source-to-gate voltage is maintained below a threshold voltage for activating the load switch when the enable voltage indicates that the load switch is to be deactivated.

Abstract: A key assembly configured to an electronic device is provided. The key assembly includes a switch component and a flexible button. The switch component is disposed in a case of the electronic device. The flexible button has a pressing portion, a shaft portion, at least one water-resistant portion and an actuating portion. The pressing portion is exposed from the case. The shaft portion connects the pressing portion and the actuating portion, and passes through a through hole of the case. The water-resistant portion is connected to the shaft portion and covers the through hole. The actuating portion is located in the case and aligned to the switch component. When a force is applied to the pressing portion, the pressing portion produces compressive deformation and makes the actuating portion produce expensive deformation to actuate the switch component.