Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: A universal electronic document verification system with blockchain includes a management interface, configured to connect at least a blockchain; a document deposit terminal, configured to generate a private key and a blockchain account corresponding to the private key, configured to make public an identification (ID) account having the blockchain account and an ID information of document deposit terminal corresponding to the blockchain account, and to generate an original document hash value according to a specific hash function and an electronic document, so as to generate an issued document according to the private key and the original document hash value; and a document verification terminal, configured to receive the electronic document and the corresponding blockchain transaction number to generate a to-be-checked document hash value according to the specific hash function and the electronic document and to submit the blockchain transaction number to the management interface.

Abstract: A lens module with an optical axis passing therethrough from an object side to an image side includes a lens housing and two lenses disposed in the lens housing. The first lens has a first refactive portion and a first positioning portion encircling the first refractive portion. A first mating structure is formed on the image side surface of the first positioning portion and molded with the first refractive portion as a single integral. The second lens has a second refractive portion and a second positioning portion encircling the second refractive portion. A second mating structure is formed on the object side surface of the second positioning portion and molded with the second refractive portion as a single integral. The mating structures are engaged to align the lenses along the optical axis, and the refractive portions are coaxial with each other and have the axis as the optical axis.

Abstract: A lens module with an optical axis passing therethrough from an object side to an image side includes a lens housing and two lenses disposed in the lens housing. The first lens has a first refract portion and a first positioning portion encircling the first refract portion. A first jointing structure is formed on the image side surface of the first positioning portion and molded with the first refract portion as a single integral. The second lens has a second refract portion and a second positioning portion encircling the second refract portion. A second jointing structure is formed on the object side surface of the second positioning portion and molded with the second refract portion as a single integral. The jointing structures are engaged to align the lenses along the optical axis, and the refract portions are coaxial with each other and have the axis as the optical axis.