Abstract: A manufacturing method of an electronic device includes that a chip package is mounted on a circuit board. And an exposed surface of the chip package is bombarded with plasma to clean the surface. The manufacturing method of the electronic device of the application can effectively clean the chip package without reducing the reliability of the electronic device.

Abstract: The invention provides an expansion card adapted for a motherboard, in which the motherboard includes a first slot, and the first slot is located at a surface of the motherboard. The expansion card includes a circuit board, a heat-dissipating module and a supporter. The circuit board includes a connecting interface configured for being inserted into the first slot of the motherboard. The heat-dissipating module is disposed at a side of the circuit board and has a bottom surface. When the expansion card is inserted into the first slot, the supporter is disposed at the bottom surface of the heat-dissipating module so that the bottom surface of the heat-dissipating module is substantially parallel to the surface of the motherboard.

Abstract: The invention provides an expansion card adapted for a motherboard, in which the motherboard includes a first slot, and the first slot is located at a surface of the motherboard. The expansion card includes a circuit board, a heat-dissipating module and a supporter. The circuit board includes a connecting interface configured for being inserted into the first slot of the motherboard. The heat-dissipating module is disposed at a side of the circuit board and has a bottom surface. When the expansion card is inserted into the first slot, the supporter is disposed at the bottom surface of the heat-dissipating module so that the bottom surface of the heat-dissipating module is substantially parallel to the surface of the motherboard.

Abstract: A hinge module is described. A T-shaped frame is pivotally connected with a base portion at one end such that the T-shaped frame rotates around a first axis relative to the base portion. A pair of connection members are pivotally connected with the other two opposite ends of the T-shaped frame such that the pair of connection members rotates around a second axis relative to the T-shaped frame, wherein the second axis is perpendicular to the first axis, and led through a cavity of the T-shaped frame. A U-shaped casing is manual-detachably connected with the T-shaped frame to fully cover a cavity of the T-shaped frame.

Abstract: A hinge module is described. A T-shaped frame is pivotally connected with a base portion at one end such that the T-shaped frame rotates around a first axis relative to the base portion. A pair of connection members are pivotally connected with the other two opposite ends of the T-shaped frame such that the pair of connection members rotates around a second axis relative to the T-shaped frame, wherein the second axis is perpendicular to the first axis, and led through a cavity of the T-shaped frame. A U-shaped casing is manual-detachably connected with the T-shaped frame to fully cover a cavity of the T-shaped frame.

Abstract: The present invention is to provide a cable strain-relief member for a PC fan, comprising a pressing part, two locking parts at both ends of the pressing part, and two releasing parts at the two joint portions between the pressing part and the locking parts. Accordingly, the strain-relief member can be set at a rib of the fan frame to firmly bind lead wires on the rib of the fan frame to prevent from being swung left and right, or being shaken up and down, to be loosened by an external force. Besides, the strain-relief member can be released for easy maintenance and packing of the fan according to the actual need.