Patents by Inventor Chih-Li Liu
Chih-Li Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145398Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.Type: ApplicationFiled: December 8, 2022Publication date: May 2, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Cheng-Liang HSU, Wan-Rou CHEN, Hsin-Yin CHANG, Tsung-Li LIN, Hsiu-Jung LI, Chiu-Lien LI, Fu-Quan XU, Yi-Wen LIU, Chih-Chieh SUN
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Publication number: 20240096867Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Charles Chew-Yuen YOUNG, Chih-Liang CHEN, Chih-Ming LAI, Jiann-Tyng TZENG, Shun-Li CHEN, Kam-Tou SIO, Shih-Wei PENG, Chun-Kuang CHEN, Ru-Gun LIU
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Publication number: 20240088307Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 11929318Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.Type: GrantFiled: May 10, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
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Patent number: 9138972Abstract: An assembling machine for assembling an elongated module into a tubular body includes a holding assembly disposed on a base for holding the tubular body, a conveying assembly slidably connected to the base and having a cantilever for holding the elongated module and adapted to extend into the tubular body through a first opening thereof with the elongated module partially protruding from a second opening thereof, and a dispenser positioned between the cantilever and the holding assembly for dispensing adhesive on a joint surface of the elongated module. The holding assembly is adapted to drive the tubular body to move to a pressed position, so that an inner surface of the tubular body is pressed against the joint surface of the elongated module.Type: GrantFiled: September 10, 2013Date of Patent: September 22, 2015Assignees: Lite-on Electronics (Guangzhou) Limited, Lite-on Technology Corp.Inventors: Chih-Li Liu, Jen-Min Huang
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Patent number: 8693182Abstract: A fixing mechanism for storage device includes a frame, and a detent component. One sidewall of the frame has a latch member. The detent component is movably disposed on the sidewall of the frame, and has a pressing component and an operating component. The operating component is disposed with at least one stop block. When the operating component is moved relative to the frame to a press position, the pressing component pushes the latch member to engage with the storage device, the stop block is embedded in the frame, and the detent component is held in the press position. Accordingly, the storage device may be fixed to the frame rapidly without using any screw, the operating procedure is dramatically simplified, and the space occupied by the fixing mechanism and the manufacturing cost are reduced.Type: GrantFiled: August 31, 2011Date of Patent: April 8, 2014Assignees: Lite-On Electronic (Guangzhou) Limited, Lite-On Technology CorporationInventors: Po-Hsiu Kuo, Chih-Li Liu, Yung-Lung Liu, Chuan-Chieh Tseng
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Publication number: 20140069569Abstract: An assembling machine for assembling an elongated module into a tubular body includes a holding assembly disposed on a base for holding the tubular body, a conveying assembly slidably connected to the base and having a cantilever for holding the elongated module and adapted to extend into the tubular body through a first opening thereof with the elongated module partially protruding from a second opening thereof, and a dispenser positioned between the cantilever and the holding assembly for dispensing adhesive on a joint surface of the elongated module. The holding assembly is adapted to drive the tubular body to move to a pressed position, so that an inner surface of the tubular body is pressed against the joint surface of the elongated module.Type: ApplicationFiled: September 10, 2013Publication date: March 13, 2014Applicants: LITE-ON TECHNOLOGY CORP., LITE-ON ELECTRONICS (GUANGZHOU) LIMITEDInventors: CHIH-LI LIU, JEN-MIN HUANG
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Patent number: 8584999Abstract: This invention relates to a retaining mechanism adapted for securing a data storage device having sides formed with a plurality of mounting holes. The retaining mechanism includes a securing structure and a retainer. The securing structure includes a wall body, an accommodating hole formed through the wall body, and a pair of elastic arms extending from the wall body into the accommodating hole. Each elastic arm has a fixed end connected to the corresponding inner surface of the accommodating hole and a free end extending inclined and downwardly toward a bottom of the accommodating hole. The retainer has one end engaging one of the mounting holes in the data storage device and the other end pressed by the elastic arms, and is secured in the securing structure. The retaining mechanism can be used as a snap-in bracket or a frame for quick replacement of the data storage device.Type: GrantFiled: December 29, 2011Date of Patent: November 19, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Chih-Li Liu, Yung-Lung Liu
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Patent number: 8562082Abstract: A fixing mechanism of housing includes a housing and a fixing assembly. The housing has a first wall and a second wall connected adjacently. The first wall has an assembling portion with an assembling hole projected thereon. The second wall has a buckling tab. The fixing assembly includes a knob and a locking piece. The knob has an operating portion, connected to a mounting arm, disposed on the assembling portion. The locking piece has a base disposed on the inner side of the assembling portion, a hooking arm extended from the base, and an elastic portion. The mounting arm penetrates through the assembling hole in securing to the base. The elastic portion is connected to the hooking arm and the first wall on respective ends. The free end of the hooking arm has a claw portion selectively engaged with the buckling tab of the second wall.Type: GrantFiled: June 30, 2011Date of Patent: October 22, 2013Assignees: Lite-On Electronics (Guangzhou) Limited, Lite-On Technology CorporationInventors: Chih-Li Liu, Yung-Lung Liu, Chuan-Chieh Tseng
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Publication number: 20130048813Abstract: This invention relates to a retaining mechanism adapted for securing a data storage device having sides formed with a plurality of mounting holes. The retaining mechanism includes a securing structure and a retainer. The securing structure includes a wall body, an accommodating hole formed through the wall body, and a pair of elastic arms extending from the wall body into the accommodating hole. Each elastic arm has a fixed end connected to the corresponding inner surface of the accommodating hole and a free end extending inclined and downwardly toward a bottom of the accommodating hole. The retainer has one end engaging one of the mounting holes in the data storage device and the other end pressed by the elastic arms, and is secured in the securing structure. The retaining mechanism can be used as a snap-in bracket or a frame for quick replacement of the data storage device.Type: ApplicationFiled: December 29, 2011Publication date: February 28, 2013Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: CHIH-LI LIU, YUNG-LUNG LIU
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Publication number: 20120212113Abstract: A fixing mechanism of housing includes a housing and a fixing assembly. The housing has a first wall and a second wall connected adjacently. The first wall has an assembling portion with an assembling hole projected thereon. The second wall has a buckling tab. The fixing assembly includes a knob and a locking piece. The knob has an operating portion, connected to a mounting arm, disposed on the assembling portion. The locking piece has a base disposed on the inner side of the assembling portion, a hooking arm extended from the base, and an elastic portion. The mounting arm penetrates through the assembling hole in securing to the base. The elastic portion is connected to the hooking arm and the first wall on respective ends. The free end of the hooking arm has a claw portion selectively engaged with the buckling tab of the second wall.Type: ApplicationFiled: June 30, 2011Publication date: August 23, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventors: CHIH-LI LIU, YUNG-LUNG LIU, CHUAN-CHIEH TSENG
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Publication number: 20120074279Abstract: A fixing mechanism for storage device includes a frame, and a detent component. One sidewall of the frame has a latch member. The detent component is movably disposed on the sidewall of the frame, and has a pressing component and an operating component. The operating component is disposed with at least one stop block. When the operating component is moved relative to the frame to a press position, the pressing component pushes the latch member to engage with the storage device, the stop block is embedded in the frame, and the detent component is held in the press position. Accordingly, the storage device may be fixed to the frame rapidly without using any screw, the operating procedure is dramatically simplified, and the space occupied by the fixing mechanism and the manufacturing cost are reduced.Type: ApplicationFiled: August 31, 2011Publication date: March 29, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GZ) CO., LTD.Inventors: Po-Hsiu Kuo, Chih-Li Liu, Yung-Lung Liu, Chuan-Chieh Tseng