Abstract: An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.

Abstract: An anti-vibration and heat dissipation structure for a memory socket includes a circuit board, a heat dissipation pad, and a heat dissipation shell. The circuit board includes memory sockets for insertions of memory modules. The heat dissipation pads are disposed on upper and lower surfaces of memory modules, respectively, to upwardly conduct heat, generated by the memory modules to the topmost heat dissipation pad via a stack structure of the memory modules and the heat dissipation pads. The heat dissipation shell comprises a maintenance window, and a cover board disposed on the maintenance window and having a bottom surface abutted with the topmost heat dissipation pad, to form a vertical position-limiting and anti-vibration structure to conduct heat to the heat dissipation shell via the cover board for dissipation, and easy maintenance of the memory modules via the maintenance window is also achieved.

Abstract: A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° C., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.

Abstract: A memory heater and heating air arrangement includes circuit module including circuit board, a plurality of memory modules mounted at the circuit board, memory heat sink wrapped around each memory module and locating member mounted at the circuit board around the memory modules, heating aid including flat heat-transfer base panel bonded to top side of the memory heat sinks, mounting structure located at the border of the flat heat-transfer panel and affixed to the locating member to secure the heating aid to the circuit module, and a heater attached to a top surface of the flat heat-transfer base panel of the heating aid and controllable by the circuit module to emit heat to the memory modules via the heating aid, enabling the memory modules to work under a cold environment. Subject to the functioning of the heating aid, one single heater is sufficient to heat the memories, saving the cost.

Abstract: A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° C., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.

Abstract: A memory heater and heating air arrangement includes circuit module including circuit board, a plurality of memory modules mounted at the circuit board, memory heat sink wrapped around each memory module and locating member mounted at the circuit board around the memory modules, heating aid including flat heat-transfer base panel bonded to top side of the memory heat sinks, mounting structure located at the border of the flat heat-transfer panel and affixed to the locating member to secure the heating aid to the circuit module, and a heater attached to a top surface of the flat heat-transfer base panel of the heating aid and controllable by the circuit module to emit heat to the memory modules via the heating aid, enabling the memory modules to work under a cold environment. Subject to the functioning of the heating aid, one single heater is sufficient to heat the memories, saving the cost.

Abstract: An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

Abstract: An adjustable heat sink assembly includes a thermo-conductive bottom panel having a flat contact face protruded from the bottom wall thereof, elevation-adjustment fasteners mounted in the thermo-conductive bottom panels and fastened to a circuit board and vertically adjusted to keep the flat contact face in positive contact with a heat source at the circuit board, a thermo-conductive top panel, pitch-adjustment fasteners joining the thermo-conductive bottom panel and the thermo-conductive top panel and adjustable to control the distance between the thermo-conductive bottom panel and the thermo-conductive top panel and to keep the thermo-conductive top panel in positive contact with the housing, face panel or radiation fin of the electronic apparatus using the circuit board, and heat pipes connected between the thermo-conductive bottom panel and the thermo-conductive top panel.

Abstract: A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation.

Abstract: The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.

Abstract: A stacked heat-transfer interface structure for dissipating heat from a circuit board is disclosed to include a heat plate affixed to the circuit board, and relatively thinner first heat transfer devices and relatively thicker second heat transfer devices respectively attached to first and second heat generating electronic devices of the circuit board that have different heights for transferring heat from the first and second heat generating electronic devices of the circuit board to the heat plate for dissipation.

Abstract: The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.

Abstract: A laminated heat-transfer interface used in a cooler module to dissipate heat from heat generating devices of a circuit board is disclosed to include a heat plate affixed to the circuit board, first heat-transfer sheet members of high Kelvin value and low heat resistance material respectively attached to the heat generating devices of the circuit board, second heat-transfer sheet members of elastically deformable low Kelvin value and high heat resistance material having the characteristic of transferring heat energy in vertical direction respectively bonded to the heat plate, and flat heat-transfer blocks having the characteristic of transferring heat energy evenly in horizontal direction and vertical direction respectively sandwiched between the first heat-transfer sheet members and the second heat-transfer sheet members.

Abstract: A grounding spring plate mounting structure includes a metal grounding spring plate mounted on each track inside a case for blade server to secure and ground a computer motherboard blade. The metal grounding spring plate has a flat base fitted into a recessed portion of the track, two channel-like mounting frames disposed at two sides of the flat base and respectively mounted on two parallel rails of the track and defining with the flat base a guide passage for receiving the inserted computer motherboard blade, and two clamping spring arms respectively extending from the channel-like mounting frames and suspending in the guide passage for clamping the inserted computer motherboard blade from two opposite sides and constituting with the inserted computer motherboard blade a grounding loop.

Abstract: An ATCA locking lever mounting structure installed in a motherboard blade formed of a motherboard and a face panel and inserted into a machine case of a server system is disclosed to included a grounding plate fixedly provided at the motherboard near a through hole on the face panel, and a locking lever pivoted to a pivot device at the motherboard and turnable about the pivot device between the locking position where the locking lever locks the motherboard blade to the machine case of the server system and connects the grounding plate to the machine case to have the motherboard be grounded, and the unlocking position where the motherboard blade is unlocked from the machine case.

Abstract: An ATCA locking lever mounting structure installed in a motherboard blade formed of a motherboard and a face panel and inserted into a machine case of a server system is disclosed to included a grounding plate fixedly provided at the motherboard near a through hole on the face panel, and a locking lever pivoted to a pivot device at the motherboard and turnable about the pivot device between the locking position where the locking lever locks the motherboard blade to the machine case of the server system and connects the grounding plate to the machine case to have the motherboard be grounded, and the unlocking position where the motherboard blade is unlocked from the machine case.

Abstract: A grounding spring plate mounting structure includes a metal grounding spring plate mounted on each track inside a case for blade server to secure and ground a computer motherboard blade. The metal grounding spring plate has a flat base fitted into a recessed portion of the track, two channel-like mounting frames disposed at two sides of the flat base and respectively mounted on two parallel rails of the track and defining with the flat base a guide passage for receiving the inserted computer motherboard blade, and two clamping spring arms respectively extending from the channel-like mounting frames and suspending in the guide passage for clamping the inserted computer motherboard blade from two opposite sides and constituting with the inserted computer motherboard blade a grounding loop.

Abstract: An elastic earthing plate for a server case is provided. The elastic earthing plate comprises two buckling portions formed on two sides thereof for respectively buckling to corresponding sidewalls of tracks for positioning. Each buckling portion comprises an extended arm at a distal end thereof for clamping a base plate to avoid displacement or shock occurring during the sliding of the base plate in the track, and thereby secure the base plate in the case. Thus, it is not only possible to form a reliable earthing loop between the base plate and the arm but also to position the base plate between the two arms of the elastic earthing plate to substantially ensure the earthing effect. The assembly and disassembly of the elastic earthing plate may also be easily implemented.