Patents by Inventor Chih-Liang Peng

Chih-Liang Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967596
    Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
  • Publication number: 20240104288
    Abstract: A system for manufacturing an integrated circuit includes a processor coupled to a non-transitory computer readable medium configured to store executable instructions. The processor is configured to execute the instructions for generating a layout design of the integrated circuit that has a set of design rules. The generating of the layout design includes generating a set of gate layout patterns corresponding to fabricating a set of gate structures of the integrated circuit, generating a cut feature layout pattern corresponding to a cut region of a first gate of the set of gate structures of the integrated circuit, generating a first conductive feature layout pattern corresponding to fabricating a first conductive structure of the integrated circuit, and generating a first via layout pattern corresponding to a first via. The cut feature layout pattern overlaps a first gate layout pattern of the set of gate layout patterns.
    Type: Application
    Filed: December 11, 2023
    Publication date: March 28, 2024
    Inventors: Shih-Wei PENG, Chih-Liang CHEN, Charles Chew-Yuen YOUNG, Hui-Zhong ZHUANG, Jiann-Tyng TZENG, Shun Li CHEN, Wei-Cheng LIN
  • Publication number: 20240096867
    Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Charles Chew-Yuen YOUNG, Chih-Liang CHEN, Chih-Ming LAI, Jiann-Tyng TZENG, Shun-Li CHEN, Kam-Tou SIO, Shih-Wei PENG, Chun-Kuang CHEN, Ru-Gun LIU
  • Publication number: 20130192768
    Abstract: A tire changer is provided for mounting/dismounting a tire to/from a wheel rim. The tire changer includes a tire fixing device mounted to a support arm and including a transmission cylinder that is rotatably mounted to the support arm and driven by a power device, a first retention member, a second retention member, and a fastening member. The transmission cylinder receives therein a transmission shaft having an end projecting outside the cylinder and forming a fastening section. The first and second retention members are mounted to the transmission shaft and both form a slope that is set in abutting engagement with an inside surface of a fixing bore formed in the rim. The fastening member is coupled to the fastening section to be positioned against the second retention member to thereby secure the rim between the first and second retention members.
    Type: Application
    Filed: January 31, 2012
    Publication date: August 1, 2013
    Inventor: CHIH-LIANG PENG
  • Patent number: D493499
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: July 27, 2004
    Assignee: Prime Creative International Co., Ltd.
    Inventor: Chih-Liang Peng