Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a barrier layer on the buffer layer; forming a hard mask on the barrier layer; performing an implantation process through the hard mask to form a doped region in the barrier layer and the buffer layer; removing the hard mask and the barrier layer to form a first trench; forming a gate dielectric layer on the hard mask and into the first trench; forming a gate electrode on the gate dielectric layer; and forming a source electrode and a drain electrode adjacent to two sides of the gate electrode.

Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of: forming a buffer layer on a substrate; forming a first barrier layer on the buffer layer, forming a second barrier layer on the first barrier layer, forming a first hard mask on the second barrier layer, removing the first hard mask and the second barrier layer to form a recess; and forming a p-type semiconductor layer in the recess.

Abstract: The present disclosure describes a patterning process for a strap region in a memory cell for the removal of material between polysilicon lines. The patterning process includes depositing a first hard mask layer in a divot formed on a top portion of a polysilicon layer interposed between a first polysilicon gate structure and a second polysilicon gate; depositing a second hard mask layer on the first hard mask layer. The patterning process also includes performing a first etch to remove the second hard mask layer and a portion of the second hard mask layer from the divot; performing a second etch to remove the second hard mask layer from the divot; and performing a third etch to remove the polysilicon layer not covered by the first and second hard mask layers to form a separation between the first polysilicon gate structure and the second polysilicon structure.

Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.

Abstract: A face identification module includes a substrate. The substrate has a first plane face. On the first place face are disposed a first lens assembly, a second lens assembly, an infrared LED assembly and an image processor, which are respectively electrically connected with the substrate. The infrared LED assembly includes a first infrared LED and a second infrared LED. The first infrared LED and the second infrared LED are adjacently disposed on left and right sides of the second lens assembly. In the face identification module, the video function and the face identification function are integrated to save arrangement space and achieve a multiplex face identification module.

Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.

Abstract: An LED lamp includes a frame, a power module, an envelope, an LED module, two holders, and a waterproof connecter. The frame includes a tube having an electrical section and a reflector. The power module is received in the electrical section. The envelope is engaged with the reflector to cooperatively define an optical section. The LED module is received in the optical section and electrically connects with the power module. The holders are mounted at two ends of the frame to prevent external hydrosphere from entering the LED lamp. Each of the holders includes a first cover and a second cover. The first covers engage with opposite ends of the electrical section. The second covers engage with opposite ends of the optical section. The waterproof connecter is coupled to one of the first covers.

Abstract: An LED lamp includes a frame, a power module, an envelope, an LED module, two holders, and a waterproof connecter. The frame includes a tube having an electrical section and a reflector. The power module is received in the electrical section. The envelope is engaged with the reflector to cooperatively define an optical section. The LED module is received in the optical section and electrically connects with the power module. The holders are mounted at two ends of the frame to prevent external hydrosphere from entering the LED lamp. Each of the holders includes a first cover and a second cover. The first covers engage with opposite ends of the electrical section. The second covers engage with opposite ends of the optical section. The waterproof connecter is coupled to one of the first covers.