Abstract: A dock and an operation method therefor are provided. The dock is suitable for propping up a mobile communication device. The dock includes an audio-receiving circuit, a rotating module, a communication circuit, and a controller circuit. The controller circuit is coupled to the audio-receiving circuit, the rotating module, and the communication circuit. The controller circuit transmits at least one of a plurality of audio signals generated by the audio-receiving circuit to the mobile communication device through the communication circuit, and determines an audio direction of an audio source according to the plurality of audio signals. The controller circuit controls the rotating module to rotate according to the audio direction, so as to bring the mobile communication device face toward the audio source.

Abstract: A dock and an operation method therefor are provided. The dock is suitable for propping up a mobile communication device. The dock includes an audio-receiving circuit, a rotating module, a communication circuit, and a controller circuit. The controller circuit is coupled to the audio-receiving circuit, the rotating module, and the communication circuit. The controller circuit transmits at least one of a plurality of audio signals generated by the audio-receiving circuit to the mobile communication device through the communication circuit, and determines an audio direction of an audio source according to the plurality of audio signals. The controller circuit controls the rotating module to rotate according to the audio direction, so as to bring the mobile communication device face toward the audio source.

Abstract: A hub device and corresponding method include a first chip having at least a first upstream port and a plurality of first downstream ports, a second chip, having at least a second upstream port and at least one second downstream port; and an external memory device, storing firmware data corresponding to the first chip and the second chip. One one of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub, and the first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.

Abstract: A hub device and corresponding method include a first chip having at least a first upstream port and a plurality of first downstream ports, a second chip, having at least a second upstream port and at least one second downstream port; and an external memory device, storing firmware data corresponding to the first chip and the second chip. One one of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub, and the first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.

Abstract: A hub device includes a first chip, a second chip and an external memory device. The first chip includes at least a first upstream port and multiple first downstream ports. The second chip includes at least a second upstream port and multiple second downstream ports. The external memory device stores firmware data corresponding to the first chip and the second chip. One of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub. The first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.

Abstract: An integrated circuit design for differential variable capacitors uses an integration method to integrate an integrated circuit having differential variable capacitors as a whole, and takes the parasitic effect into consideration for the manufacturing process to lower the circuit inaccuracy and reduce the chip size effectively. Such arrangement lowers the manufacturing cost, identifies the quality of loading quality of the overall variable capacitance during the manufacture, and further controls the quality of loading capacity of the overall variable capacitance effectively. Furthermore, this invention does not need to reposition for the symmetrical position of the coils, and thus giving a very precise positioning to reduce the level of difficulty for the manufacture.

Abstract: An electronic apparatus including a substrate, a baseband component and an electronic assembly is disclosed. The substrate has a first surface and a second surface opposite to the first surface. The baseband component is disposed on the first surface and electrically connected to the substrate. The electronic assembly includes an integrated passive device and a radio frequency component. The integrated passive device is disposed on the second surface and electrically connected to the substrate. The radio frequency component is disposed on the integrated passive device and electrically connected to the integrated passive device.

Abstract: Improved voltage controlled oscillator (VCO) circuits are disclosed. A symmetrical voltage controlled oscillator (VCO) system according to the embodiments of the present invention comprises a frequency tuning circuit containing one or more varactors for receiving a predetermined tuning signal and a frequency tuning bias signal for altering capacitances of the varactors, a modulation circuit coupled in parallel with the frequency tuning circuit containing one or more varactors for modulating one or more outputs, and a core circuit coupled in a parallel with the tuning circuit and the modulation circuit for providing an oscillation mechanism, wherein the core circuit has an inductance module coupled in a parallel fashion with the frequency tuning circuit and the modulation circuit, wherein circuit elements of the VCO system are symmetrically arranged for increasing oscillation efficiency thereof and the varactors are tuned to deliver the output at an output frequency.

Abstract: A layout structure of electrostatic discharge (ESD) protection circuit cooperated with an ESD protection device includes a first electrically conductive layer and a second electrically conductive layer. The first electrically conductive layer is disposed on the ESD protection device and electrically connected to the ESD protection device. The second electrically conductive layer is disposed on the first electrically conductive layer and electrically connected to the first electrically conductive layer. A width or a projection area of the second electrically conductive layer is less than that of the first electrically conductive layer.

Abstract: A layout structure of electrostatic discharge (ESD) protection circuit cooperated with an ESD protection device includes a first electrically conductive layer and a second electrically conductive layer. The first electrically conductive layer is disposed on the ESD protection device and electrically connected to the ESD protection device. The second electrically conductive layer is disposed on the first electrically conductive layer and electrically connected to the first electrically conductive layer. A width or a projection area of the second electrically conductive layer is less than that of the first electrically conductive layer.

Abstract: A system is provided to improve frequency stability and system linearity in voltage controlled oscillators.

Abstract: The invention is directed to an electric device featuring a ground shield structure. The electric device at lease comprises a plurality of first ground cells and a plurality of second ground cells. The first ground cells are distributed on a ground surface, wherein the first ground cell has at least one first outward section and at least one first inward section. The second ground cells are distributed on the ground surface, wherein the second ground cell has at least one second outward section and one second outward section of one second ground cell is compactly and complementarily embraced by one first inward section of one adjacent first ground cell.

Abstract: An integrated circuit design for differential variable capacitors uses an integration method to integrate an integrated circuit having differential variable capacitors as a whole, and takes the parasitic effect into consideration for the manufacturing process to lower the circuit inaccuracy and reduce the chip size effectively. Such arrangement lowers the manufacturing cost, identifies the quality of loading quality of the overall variable capacitance during the manufacture, and further controls the quality of loading capacity of the overall variable capacitance effectively. Furthermore, this invention does not need to reposition for the symmetrical position of the coils, and thus giving a very precise positioning to reduce the level of difficulty for the manufacture.

Abstract: A VCO system embodying the features of the present invention includes a frequency tuning circuit, a modulation circuit coupled in a parallel fashion with the frequency tuning circuit, a band tuning circuit coupled with the frequency tuning circuit in a parallel fashion having at least one switching circuit, a core circuit coupled with the frequency tuning circuit, the modulation circuit, and the band tuning circuit, wherein upon asserting a switching signal and upon adjusting a frequency turning signal, a frequency tuning bias signal, and a band tuning signal, the switching circuit is enabled for configuring the band tuning circuit to join the frequency tuning circuit for adjusting a predetermined output frequency based on a total inductance and a total capacitance provided by the core circuit, the frequency tuning circuit, the modulation circuit and the band tuning circuit.

Abstract: A VCO system embodying the features of the present invention includes a frequency tuning circuit, a modulation circuit coupled in a parallel fashion with the frequency tuning circuit, a band tuning circuit coupled with the frequency tuning circuit in a parallel fashion having at least one switching circuit, a core circuit coupled with the frequency tuning circuit, the modulation circuit, and the band tuning circuit, wherein upon asserting a switching signal and upon adjusting a frequency turning signal, a frequency tuning bias signal, and a band tuning signal, the switching circuit is enabled for configuring the band tuning circuit to join the frequency tuning circuit for adjusting a predetermined output frequency based on a total inductance and a total capacitance provided by the core circuit, the frequency tuning circuit, the modulation circuit and the band tuning circuit.

Abstract: Improved voltage controlled oscillator (VCO) circuits are disclosed. A symmetrical voltage controlled oscillator (VCO) system according to the embodiments of the present invention comprises a frequency tuning circuit containing one or more varactors for receiving a predetermined tuning signal and a frequency tuning bias signal for altering capacitances of the varactors, a modulation circuit coupled in parallel with the frequency tuning circuit containing one or more varactors for modulating one or more outputs, and a core circuit coupled in a parallel with the tuning circuit and the modulation circuit for providing an oscillation mechanism, wherein the core circuit has an inductance module coupled in a parallel fashion with the frequency tuning circuit and the modulation circuit, wherein circuit elements of the VCO system are symmetrically arranged for increasing oscillation efficiency thereof and the varactors are tuned to deliver the output at an output frequency.

Abstract: A system is provided to improve frequency stability and system linearity in voltage controlled oscillators.

Abstract: A ground shield structure is suitable for use in a circuit structure. The ground shield structure has a plurality of ground cells that are arranged on a ground plane periodically, compactly and complementarily. The slots between the ground cells are used to reduce the eddy current generated on the ground shield structure. The ground shield structure increases the slow-wave factor to slow the waves so that the area of the circuit layout can be decreased. Besides, the ground shield structure can reduce the energy loss of the inner circuit of the circuit structure and can increase the quantities of inductance and capacitance in per unit area thereon.