Abstract: The present disclosure provides a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes channel members disposed over a substrate, a gate structure engaging the channel members, and an epitaxial feature adjacent the channel members. At least one of the channel members has an end portion in physical contact with an outer portion of the epitaxial feature. The end portion of the at least one of the channel members includes a first dopant of a first concentration. The outer portion of the epitaxial feature includes a second dopant of a second concentration. The first concentration is higher than the second concentration.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: Embodiments of the present disclosure provide a method for forming semiconductor device structures. The method includes forming a fin structure having a stack of semiconductor layers comprising first semiconductor layers and second semiconductor layers alternatingly arranged, forming a sacrificial gate structure over a portion of the fin structure, removing the first and second semiconductor layers in a source/drain region of the fin structure that is not covered by the sacrificial gate structure, forming an epitaxial source/drain feature in the source/drain region, removing portions of the sacrificial gate structure to expose the first and second semiconductor layers, removing portions of the second semiconductor layers so that at least one second semiconductor layer has a width less than a width of each of the first semiconductor layers, forming a conformal gate dielectric layer on exposed first and second semiconductor layers, and forming a gate electrode layer on the conformal gate dielectric layer.

Abstract: A two-point lock includes a casing unit, an adjusting unit and a locking unit. The adjusting unit includes two first adjusting guide plates pivoted to casing unit, and two second adjusting guide plates pivoted to the casing unit. The locking unit includes first and second hook members respectively pivotable between the first adjusting guide plates and between the second adjusting guide plates. The first adjusting guide plates are operable to adjust an extent by which the first hook member extends out of the casing unit. The second adjusting guide plates are operable to adjust an extent by which the second hook member extends out of the casing unit.

Abstract: A two-point lock includes a casing unit, an adjusting unit and a locking unit. The adjusting unit includes two first adjusting guide plates pivoted to casing unit, and two second adjusting guide plates pivoted to the casing unit. The locking unit includes first and second hook members respectively pivotable between the first adjusting guide plates and between the second adjusting guide plates. The first adjusting guide plates are operable to adjust an extent by which the first hook member extends out of the casing unit. The second adjusting guide plates are operable to adjust an extent by which the second hook member extends out of the casing unit.

Abstract: A magnetic locking apparatus has a body and an engaging mount. The body has a casing, a bolt and a driving device. The bolt is retractably mounted in the casing and has a connecting section, an engaging section and at least one magnetic element. The driving device is mounted in the casing and has a handle mount. The engaging mount faces the casing and the bolt and has a locking hole and at least one magnetic element mounted at two sides of the locking hole to attract the at least one magnetic element of the bolt.

Abstract: A lock assembly has a body, a latching device, a linking device and a locking mechanism. The linking device is connected to and driven by the latching device. The locking mechanism is moveably mounted in the body and has a bolt base, a pushing element, a lever element and a locking bolt. The bolt base is mounted slidably in the body. The locking bolt is slidably mounted on the bolt base and is driven to retract into or completely extends out from the body with the transmission of the pushing element and the lever element.

Abstract: A magnetic locking apparatus has a body and an engaging mount. The body has a casing, a bolt and a driving device. The bolt is retractably mounted in the casing and has a connecting section, an engaging section and at least one magnetic element. The driving device is mounted in the casing and has a handle mount. The engaging mount faces the casing and the bolt and has a locking hole and at least one magnetic element mounted at two sides of the locking hole to attract the at least one magnetic element of the bolt.

Abstract: A lock assembly has a body, a latching device, a linking device and a locking mechanism. The linking device is connected to and driven by the latching device. The locking mechanism is moveably mounted in the body and has a bolt base, a pushing element, a lever element and a locking bolt. The bolt base is mounted slidably in the body. The locking bolt is slidably mounted on the bolt base and is driven to retract into or completely extends out from the body with the transmission of the pushing element and the lever element.

Abstract: A frameless glass door clamp has a clamping member, a base cover and a cap cover. The clamp member has a base side surface and a cap side surface. The base cover is mounted on the base side surface and has a panel, multiple flanges, a tapered face and multiple rounded outer edges. The cap cover is mounted on the cap side surface and has a panel, a multiple flanges, a tapered face and multiple rounded outer edges. Because the outer edges of the base and cap covers are rounded, the frameless glass door clamp is much less likely to injure people or damage objects and is easier to manufacture.

Abstract: A roller assembly for a frameless sliding glass door has a bracket, a roller and at least one fastening device. The bracket is attached to the frameless sliding glass door and a track and has at least one elongated hole, an adjustment hole and a set screw. The at least one elongated hole is formed through the bracket near the lower end. The adjustment hole is formed through the lower edge of the bracket and communicates with the elongated hole in the lower end of the bracket. The set screw is threaded and corresponds with the adjustment hole. The roller is rotatable connected to the rear surface of the bracket in the upper end and mounted on the track. The fastening device is connected to the bracket and the frameless sliding glass door through the elongated hole and the corresponding through hole.

Abstract: A roller assembly for a frameless sliding glass door has a bracket, a roller and at least one fastening device. The bracket is attached to the frameless sliding glass door and a track and has at least one elongated hole, an adjustment hole and a set screw. The at least one elongated hole is formed through the bracket near the lower end. The adjustment hole is formed through the lower edge of the bracket and communicates with the elongated hole in the lower end of the bracket. The set screw is threaded and corresponds with the adjustment hole. The roller is rotatable connected to the rear surface of the bracket in the upper end and mounted on the track. The fastening device is connected to the bracket and the frameless sliding glass door through the elongated hole and the corresponding through hole.

Abstract: A frameless glass door clamp has a clamping member, a base cover and a cap cover. The clamp member has a base side surface and a cap side surface. The base cover is mounted on the base side surface and has a panel, multiple flanges, a tapered face and multiple rounded outer edges. The cap cover is mounted on the cap side surface and has a panel, a multiple flanges, a tapered face and multiple rounded outer edges. Because the outer edges of the base and cap covers are rounded, the frameless glass door clamp is much less likely to injure people or damage objects and is easier to manufacture.

Abstract: A wafer retainer is disclosed to be fastened to the inner surface of the door panel of a wafer carrier without making openings in the inner surface of the door panel, the wafer retainer having at least one frame bar, retaining portions and positioning elements respectively extended from the at least one frame bar for fastening to respective locating elements at the inner surface of the door panel and retaining portions at the lateral sidewall of a recessed area, and a plurality of spring arms respectively extended from the at least one frame bar at different elevations and adapted to hold a corresponding storage wafer in the wafer carrier, each spring arm having a smoothly arched top end adapted to contact one point of the corresponding storage wafer to minimize friction.

Abstract: A wafer retainer is disclosed to be fastened to the inner surface of the door panel of a wafer carrier without making openings in the inner surface of the door panel, the wafer retainer having at least one frame bar, retaining portions and positioning elements respectively extended from the at least one frame bar for fastening to respective locating elements at the inner surface of the door panel and retaining portions at the lateral sidewall of a recessed area, and a plurality of spring arms respectively extended from the at least one frame bar at different elevations and adapted to hold a corresponding storage wafer in the wafer carrier, each spring arm having a smoothly arched top end adapted to contact one point of the corresponding storage wafer to minimize friction.