Patents by Inventor Chih-Lung Hsiao
Chih-Lung Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335751Abstract: The present invention provides an auxiliary film comprising a body and a plurality of microstructures formed on a first surface of the body, the microstructures include a concave-convex appearance on the first surface, and the microstructures have two ends extending to the periphery of the first surface respectively. When the auxiliary film is attached to a pre-protected surface of a substrate, the microstructures and the surface of the substrate form several open air channels to increase the separation efficiency of the main body from the substrate and reduce the overall process time.Type: ApplicationFiled: April 14, 2023Publication date: October 19, 2023Inventors: SZU-NAN YANG, CHEN-CHI WU, HUNG-LIANG HSU, CHIH-YUAN LIN, CHIH-LUNG HSIAO, MING-YUEH HSU
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Patent number: 8332984Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.Type: GrantFiled: December 29, 2007Date of Patent: December 18, 2012Assignee: Zhen Ding Technology Co., Ltd.Inventors: Tso-Hung Yeh, Hung-Yi Chang, Chih-Lung Hsiao, Cheng-Hsien Lin
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Publication number: 20120175249Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.Type: ApplicationFiled: March 16, 2012Publication date: July 12, 2012Applicant: Zhen Ding Technology Co., Ltd.Inventors: TSO-HUNG YEH, HUNG-YI CHANG, CHIH-LUNG HSIAO
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Patent number: 8141512Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.Type: GrantFiled: December 29, 2007Date of Patent: March 27, 2012Assignee: Zhen Ding Technology Co., Ltd.Inventors: Tso-Hung Yeh, Hung-Yi Chang, Chih-Lung Hsiao
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Publication number: 20090056624Abstract: An exemplary fluid circulating system includes a return pipe, a reservoir, a suction pipe, a supply pipe, a circulating pump, and a processing device. The reservoir is configured for containing a work fluid. The processing device is configured for processing a semi-finished printed circuit board using the work fluid. The circulating pump is configured for transferring the work fluid from the reservoir to the processing device. The suction pipe and the supply pipe are respectively coupled to an inlet and the outlet of the circulating pump. An inner diameter of the suction pipe is larger than that of the supply pipe. The return pipe is coupled to the processing device for delivering the work fluid from the processing device to the reservoir. The fluid circulating system can improve quality of the circulated work fluid.Type: ApplicationFiled: March 10, 2008Publication date: March 5, 2009Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: CHIH-KANG YANG, HUNG-YI CHANG, CHIH-LUNG HSIAO, TUNG-YAO KUO
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Publication number: 20090039053Abstract: An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and chromium. A patterned photoresist layer is formed on the copper layer with portions of the copper layer are exposed from the photoresist pattern layer. Exposed portions of the copper layer are removed using a copper etchant to form a number of electrical traces, thereby exposing portions of the intermediate layer from the patterned photoresist layer. Exposed portions of the intermediate layer are removed using a chromium-nickel etchant. The method can prevent a bottom of each of electrical traces from enlarging, thereby improving quality of printed circuit board.Type: ApplicationFiled: December 26, 2007Publication date: February 12, 2009Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: TSO-HUNG YEH, CHIH-LUNG HSIAO, HUNG-YI CHANG
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Publication number: 20090025582Abstract: An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board.Type: ApplicationFiled: December 7, 2007Publication date: January 29, 2009Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: TSO-HUNG YEH, CHIH-KANG YANG, HUNG-YI CHANG, CHIH-LUNG HSIAO
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Publication number: 20090013929Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.Type: ApplicationFiled: December 29, 2007Publication date: January 15, 2009Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: TSO-HUNG YEH, HUNG-YI CHANG, CHIH-LUNG HSIAO
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Publication number: 20090014031Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.Type: ApplicationFiled: December 29, 2007Publication date: January 15, 2009Applicant: FOXCONN ADVANCED TECHNOLOGY INC.Inventors: TSO-HUNG YEH, HUNG-YI CHANG, CHIH-LUNG HSIAO, CHENG-HSIEN LIN