Patents by Inventor Chih-Mei Yu

Chih-Mei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Continuous process for producing solder bumps on electrodes of semiconductor chips
    Patent number: 6153503
    Abstract: A process for producing solder bumps on metal electrodes, such as Al electrodes, of a semiconductor wafer, such as silicon wafer, involves the formation of the under bump metallurgies (UBM) on the electrodes. The solder bumps are then formed on the under bump metallurgies by wave soldering. The under bump metallurgies consist of a diffusion barrier layer formed on the metal electrodes, and a wetting layer formed on the diffusion barrier layer.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: November 28, 2000
    Assignee: National Science Council
    Inventors: Kwang-Lung Lin, Chih-Mei Yu, Wen-Hsiuan Chao