Abstract: A liquid crystal polymer, composition, liquid crystal polymer film, laminated material and method of forming liquid crystal polymer film are provided. The liquid crystal polymer includes a first repeating unit, a second repeating unit, a third repeating unit, a fourth repeating unit, and a fifth repeating unit. The first repeating unit has a structure of Formula (I), the second repeating unit has a structure of Formula (II), the third repeating unit has a structure of Formula (III), the fourth repeating unit has a structure of Formula (IV), and the fifth repeating unit has a structure of Formula (V), a structure of Formula (VI), or a structure of Formula (VII) wherein A1, A2, A3, A4, X1, Z1, R1, R2, R3 and Q are as defined in the specification.

Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.

Abstract: The present disclosure discloses a method for recycling all types of lithium batteries. First, the lithium battery waste is acid-leached to obtain a solution containing most of metal ions. After filtering, the solution is separated from the remaining solids, and then the obtained solution is subjected to separate precipitation many times. After separately adjusting the pH value of the solution many times, adding precipitants with a high selectivity ratio, and matching with filtration and separation reaction, all ions in the lithium battery waste are sequentially precipitated in forms of iron phosphate (FePO4), aluminum hydroxide (Al(OH)3), manganese oxide (MnO2), dicobalt trioxide (cobalt oxide, Co2O3), nickel hydroxide (Ni(OH)2), and lithium carbonate (Li2CO3).

Abstract: A liquid crystal polymer, composition, liquid crystal polymer film, laminated material and method of forming liquid crystal polymer film are provided. The liquid crystal polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a fourth repeating unit. The first repeating unit has a structure of Formula (I), the second repeating unit has a structure of Formula (II), the third repeating unit has a structure of Formula (III), and the fourth repeating unit has a structure of Formula (IV), a structure of Formula (V) or a structure of Formula (VI) wherein A1, A2, A3, Z1, R1, R2, R3 and Q are as defined in the specification.

Abstract: An aiming system includes a positioner, an aiming device, and a processor. The positioner has a function of acquiring spatial information, and the aiming device is connected to the positioner, and the processor is connected to the positioner or the aiming device. A method of using the aiming system is also provided. Surgical guidance is more intuitive by directly combining the positioner with the aiming device.

Abstract: A manufacture method of a deodorization fiber includes: a mixing step including mixing zirconium phosphate and a first dispersant including an amine-group compound in a solvent to form a mixture; a grinding step including grinding the mixture until a D90 particle size of zirconium phosphate is 0.1 ?m to 1.5 ?m to form a grinded mixture; a heating and stirring step including heating and stirring the grinded mixture to uniformly distribute zirconium phosphate and the first dispersant in the solvent to form a deodorant; a blending and pelletizing step including blending and pelletizing the deodorant and polyester to form a fiber masterbatch; and a melt spinning step including melt spinning the fiber masterbatch to form the deodorization fiber. A deodorization fiber is further provided.

Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.

Abstract: A resin film is provided. When the resin film is characterized by Fourier transform infrared spectroscopy (FTIR), the Fourier transform infrared spectrum of the resin film has a signal intensity A from 2205 cm?1 to 2322 cm?1 and a signal intensity B from 1472 cm?1 to 1523 cm?1, and 0.70?A/B?1.95.

Abstract: A device includes a fin extending from a substrate, a gate stack over and along sidewalls of the fin, a gate spacer along a sidewall of the gate stack, and an epitaxial source/drain region in the fin and adjacent the gate spacer. The epitaxial source/drain region includes a first epitaxial layer on the fin, the first epitaxial layer including silicon, germanium, and arsenic, and a second epitaxial layer on the first epitaxial layer, the second epitaxial layer including silicon and phosphorus, the first epitaxial layer separating the second epitaxial layer from the fin. The epitaxial source/drain region further includes a third epitaxial layer on the second epitaxial layer, the third epitaxial layer including silicon, germanium, and phosphorus.

Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: A circuit includes an operational amplifier including an inverting input terminal capacitively coupled to each of an OTP cell array and an NVM cell array and first and second output terminals, an ADC coupled to the first and second output terminals, thereby configured to receive a differential output voltage from the operational amplifier, and a comparator coupled to the ADC and configured to output a data bit responsive to a digital output signal received from the ADC. The circuit is configured to cause the operational amplifier to generate the differential output voltage based on each of a current received from an OTP cell of the OTP cell array and a voltage received from an NVM cell of the NVM cell array.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: The present disclosure relates to a body fluid collection device (1), the body fluid collection device (1) comprises a tube body (10), wherein the tube body (10) is used to contain the collected body fluid and is provided with an opened end (12); a tube plug (20), wherein the tube plug (20) is configured to be able to hermetically close the opened end (12) of the tube body (10); and a filter (30), wherein the filter (30) is arranged in the tube body (10) for filtering out specific components from a body fluid to be collected, wherein the filter (30) is configured to be capable of being attached to the tube plug (20) at the open end, and the tube plug (20) is hermetically connected to the filter (30).

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A Wireless Interface Device and System (WIDS) is used as a bridge device for transmitting, translating, transporting and/or transforming a first emergency aid seeking signal to a second emergency aid seeking signal recognizable by a smart voice commendable device (e.g., AMAZON® ECHO®). The first emergency aid seeking signal can be generated from a Personal Emergency Response Systems (PERS), a fall sensor (e.g., a senior fall sensor), home security monitoring device, or any other emergency aid requesting devices.

Abstract: A circuit is provided and includes first to second switching units, a sensing unit, and first to second capacitive units. The first switching unit and the second switching unit are alternately turned on in response to, respectively, a first control signal and a second control signal that have different voltage levels. First terminals of the first and second switching units are coupled to each other. A sensing unit generates a sensing voltage, in response to light, at the first terminals of the first and second switching units. The first capacitive unit generates a first voltage, in response to the sensing voltage, at a second terminal of the first switching unit. The second capacitive unit generates a second voltage, in response to the generating the sensing voltage, at a second terminal of the second switching unit.

Abstract: A method of generating an integrated circuit (IC) layout diagram includes obtaining a grid of intersecting first and second pluralities of tracks corresponding to adjacent metal layers, determining that first and second pitches of the respective first and second pluralities of tracks conform to a first rule, applying a via positioning pattern to the grid whereby via regions are restricted to alternating diagonal grid lines, positioning via regions at some or all of the grid intersections of the alternating diagonal grid lines, and generating the IC layout diagram including the via regions positioned along the alternating diagonal grid lines.

Abstract: This application is directed to a display assistant device that acts as a voice-activated user interface device. The display assistant device includes a base, a screen and a speaker. The base is configured for sitting on a surface. The screen has a rear surface and is supported by the base at the rear surface. A bottom edge of the screen is configured to be held above the surface by a predefined height, and the base is substantially hidden behind the screen from a front view of the display assistant device. The speaker is concealed inside the base and configured to project sound substantially towards the front view of the display assistant device.

Abstract: The present disclosure relates to methods, apparatuses, and computer programs for processing computed tomography images. Precise segmentation of the left atrium (LA) in computed tomography (CT) images constitutes a crucial preparatory step for catheter ablation in atrial fibrillation (AF). We aim to apply deep convolutional neural networks (DCNNs) to automate the LA detection/segmentation procedure and create a three-dimensional (3D) geometries. The deep learning provides an efficient and accurate way for automatic contouring and LA volume calculation based on the construction of the 3D LA geometry. Non-pulmonary vein (NPV) trigger has been reported as an important predictor of recurrence post atrial fibrillation (AF) ablation. Elimination of NPV triggers can reduce the post-ablation AF recurrence. The deep learning was applied in pre-ablation pulmonary vein computed tomography (PVCT) geometric slices to create a prediction model for NPV triggers in patients with paroxysmal atrial fibrillation (PAF).