Abstract: The present disclosure discloses a method for recycling all types of lithium batteries. First, the lithium battery waste is acid-leached to obtain a solution containing most of metal ions. After filtering, the solution is separated from the remaining solids, and then the obtained solution is subjected to separate precipitation many times. After separately adjusting the pH value of the solution many times, adding precipitants with a high selectivity ratio, and matching with filtration and separation reaction, all ions in the lithium battery waste are sequentially precipitated in forms of iron phosphate (FePO4), aluminum hydroxide (Al(OH)3), manganese oxide (MnO2), dicobalt trioxide (cobalt oxide, Co2O3), nickel hydroxide (Ni(OH)2), and lithium carbonate (Li2CO3).

Abstract: A liquid crystal polymer, composition, liquid crystal polymer film, laminated material and method of forming liquid crystal polymer film are provided. The liquid crystal polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a fourth repeating unit. The first repeating unit has a structure of Formula (I), the second repeating unit has a structure of Formula (II), the third repeating unit has a structure of Formula (III), and the fourth repeating unit has a structure of Formula (IV), a structure of Formula (V) or a structure of Formula (VI) wherein A1, A2, A3, Z1, R1, R2, R3 and Q are as defined in the specification.

Abstract: An aiming system includes a positioner, an aiming device, and a processor. The positioner has a function of acquiring spatial information, and the aiming device is connected to the positioner, and the processor is connected to the positioner or the aiming device. A method of using the aiming system is also provided. Surgical guidance is more intuitive by directly combining the positioner with the aiming device.

Abstract: A resin film is provided. When the resin film is characterized by Fourier transform infrared spectroscopy (FTIR), the Fourier transform infrared spectrum of the resin film has a signal intensity A from 2205 cm?1 to 2322 cm?1 and a signal intensity B from 1472 cm?1 to 1523 cm?1, and 0.70?A/B?1.95.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.

Abstract: A touch panel has a substrate having a display region and a peripheral region, a touch sensing electrode disposed in the display region of the substrate, and a peripheral circuit disposed in the peripheral region of the substrate. The touch sensing electrode is electrically connected to the peripheral circuit, and the touch sensing electrode layer includes a first portion of a patterned metal nanowire layer. The peripheral circuit includes a patterned conductive layer and a second portion of the metal nanowire layer. At least a non-conductive material of the conductive layer is between the peripheral circuit and a second peripheral circuit.

Abstract: A touch panel has a substrate having a display region and a peripheral region, a touch sensing electrode disposed in the display region of the substrate, and a peripheral circuit disposed in the peripheral region of the substrate. The touch sensing electrode is electrically connected to the peripheral circuit, and the touch sensing electrode layer includes a first portion of a patterned metal nanowire layer. The peripheral circuit includes a patterned conductive layer and a second portion of the metal nanowire layer. At least a non-conductive material of the conductive layer is between the peripheral circuit and a second peripheral circuit.

Abstract: A touch panel includes a substrate having a display area and a peripheral area. A peripheral circuit is disposed in the peripheral area. The peripheral circuit comprises at least one bonding pad made of a metal layer. A plurality of touch sensing electrodes is disposed in the display area. The plurality of touch sensing electrodes is made of a metal nanowire layer, a film layer disposed on the metal nanowire layer, and a negative-type photosensitive layer disposed on the film layer. The plurality of touch sensing electrodes is electrically connected to the peripheral circuit.

Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.

Abstract: A contact structure is provided, which includes a substrate, a copper layer, an organic composite protective layer, and a nanosilver layer. The copper layer is disposed over the substrate. The organic composite protective layer is disposed over the copper layer to avoid oxidation of the copper layer, in which the organic composite protective layer forms a monomolecular adsorption layer over a surface of the copper layer. The nanosilver layer is disposed over the organic composite protective layer. A method of manufacturing a contact structure is also provided.

Abstract: A touch panel has a substrate having a display region and a peripheral region, a touch sensing electrode disposed in the display region of the substrate, and a peripheral circuit disposed in the peripheral region of the substrate. The touch sensing electrode is electrically connected to the peripheral circuit, and the touch sensing electrode layer includes a first portion of a patterned metal nanowire layer. The peripheral circuit includes a patterned conductive layer and a second portion of the metal nanowire layer. At least a non-conductive material of the conductive layer is between the peripheral circuit and a second peripheral circuit.

Abstract: A direct patterning method of touch panel is provided. A substrate having a display region and a peripheral region is provided. A periphery circuit having a bonding pad is disposed on the periphery region. A metal nanowire layer made of metal nanowires are disposed on the display region and the peripheral region. A photosensitive pre-cured layer is disposed on the metal nanowire layer. A photolithography process is performed, which includes exposing the pre-cured layer to define a removal area and a reserved area, and removing the pre-cured layer and the metal nanowire layer on the removal area using a developer solution to form a touch-sensing electrode disposed on the display region and to expose the bonding pad disposed on the periphery region. The touch sensing electrode made of the pre-cured layer and the metal nanowire layer is electrically connected to the periphery circuit.

Abstract: A touch panel has a substrate having a display region and a peripheral region, a touch sensing electrode disposed in the display region of the substrate, and a peripheral circuit disposed in the peripheral region of the substrate. The touch sensing electrode is electrically connected to the peripheral circuit, and the touch sensing electrode layer includes a first portion of a patterned metal nanowire layer. The peripheral circuit includes a patterned conductive layer and a second portion of the metal nanowire layer. At least a non-conductive material of the conductive layer is between the peripheral circuit and a second peripheral circuit.

Abstract: A touch panel includes a substrate having a display area and a peripheral area. A peripheral circuit is disposed in the peripheral area. The peripheral circuit comprises at least one bonding pad made of a metal layer. A plurality of touch sensing electrodes is disposed in the display area. The plurality of touch sensing electrodes is made of a metal nanowire layer, a film layer disposed on the metal nanowire layer, and a negative-type photosensitive layer disposed on the film layer. The plurality of touch sensing electrodes is electrically connected to the peripheral circuit.

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.

Abstract: A direct patterning method of touch panel is provided. A substrate having a display region and a peripheral region is provided. A periphery circuit having a bonding pad is disposed on the periphery region. A metal nanowire layer made of metal nanowires are disposed on the display region and the peripheral region. A photosensitive pre-cured layer is disposed on the metal nanowire layer. A photolithography process is performed, which includes exposing the pre-cured layer to define a removal area and a reserved area, and removing the pre-cured layer and the metal nanowire layer on the removal area using a developer solution to form a touch-sensing electrode disposed on the display region and to expose the bonding pad disposed on the periphery region. The touch sensing electrode made of the pre-cured layer and the metal nanowire layer is electrically connected to the periphery circuit.

Abstract: A touch device and a manufacturing method thereof are provided. The touch device includes a base structure and a touch structure. The touch structure includes a touch electrode pattern and a metal trace. The touch electrode pattern is on the base structure. The metal trace is on an edge of the touch electrode pattern. A thickness of the metal trace is 1 ?m-100 ?m. A roughness of the metal trace is 0.1 ?m-90 ?m.