Abstract: A bonded assembly may be formed by: providing a substrate and a semiconductor chip in a low-oxygen ambient having an oxygen partial pressure that is lower than 17 kPa; disposing the semiconductor chip on the substrate; performing a plasma treatment process on a copper-containing surface of a chip bonding pad on the semiconductor chip in the low-oxygen ambient by directing a plasma jet to the chip bonding pad; and attaching a bonding wire to the semiconductor chip and to the substrate such that a first end of the bonding wire is attached to the copper-containing surface and a second end of the bonding wire is attached to a substrate bonding pad on the substrate.

Abstract: A bonded assembly may be formed by providing a wafer comprising at least a first packaging substrate and a second packaging substrate in a low-oxygen ambient; performing a first plasma package-treatment process on the first semiconductor package in the low-oxygen ambient while performing a first substrate-treatment process on the first packaging substrate in a low-oxygen ambient having an oxygen partial pressure that is lower than 17 kPa; and performing a second plasma package-treatment process on the second semiconductor package while performing a second substrate-treatment process on the second packaging substrate and while bonding the first semiconductor package to the first packaging substrate.

Abstract: A bonded assembly may be formed by providing at least a first packaging substrate in a low-oxygen ambient; providing at least a first semiconductor package in the low-oxygen ambient; performing a first plasma package-treatment process on the first semiconductor package in the low-oxygen ambient by directing at least one first plasma jet to first solder material portions bonded to the first semiconductor package; and bringing the first solder material portions onto, or in proximity to, first substrate-side bonding structures located on the first packaging substrate while the at least one first plasma jet is directed to the first solder material portions. The first substrate-side bonding structures are treated with the first plasma jet. The first semiconductor package is bonded to the first packaging substrate while, or after, the first substrate-side bonding structures are treated with the first plasma jet.

Abstract: A testing apparatus includes a circuit board, a probe station and a probe array. The circuit board includes a plurality of contacts. The probe station includes a platform located on the circuit board and used for carrying a device under test (DUT), and a plurality of probe holes formed on the platform and arranged in an array. The probe array includes a plurality of telescopic probes respectively linearly inserted into the probe holes. One end of each of the telescopic probes is contacted with one of the contacts, and the other end thereof is contacted with one of solder balls of the DUT. Each of the probe holes includes an elongated groove penetrating through the platform. Each of the telescopic probes is provided with a fin protruding outwardly and inserting into the elongated groove.

Abstract: An apparatus for ion beam etching is provided. An ion extractor separates a plasma source chamber from a process chamber. A gas inlet provides gas to the plasma source chamber. An RF power system provides RF power to the plasma source chamber. A process gas source and cleaning gas mixture source are connected to the gas inlet.

Abstract: A method for recovering valuable metal elements from a copper-containing metallic material includes steps of: (a) immersing an anode and the copper-containing metallic material serving as a cathode into an electrolyte solution having one of an acidic pH and an alkaline pH; and (b) providing a predetermined voltage to the anode and the cathode such that an electrolysis process conducted under the predetermined voltage on the cathode forms a gaseous film surrounding the cathode, and then the gaseous film is broken down to permit generation of a plasma in the electrolyte solution so as to obtain a solid copper metal or a solid copper oxide that precipitates from the electrolyte solution, and ionic impurities that dissolve in the electrolyte solution.

Abstract: A method for fabricating buried word line of a dynamic random access memory (DRAM) includes the steps of: forming a trench in a substrate; forming a first conductive layer in the trench; forming a second conductive layer on the first conductive layer, in which the second conductive layer above the substrate and the second conductive layer below the substrate comprise different thickness; and forming a third conductive layer on the second conductive layer to fill the trench.

Abstract: The present disclosure relates generally to two part adhesive compositions comprising a resin part including a curable resin selected from multifunctional, hydroxyl di-terminated polymer having alkene segments and epoxide segments in the polymer chain; an epoxy di-terminated block copolymer having siloxane moieties and bisphenol A moieties in the backbone and combination thereof and a hardener part including a curative for the curable resin. When mixed the compositions cure to a form that provides hardness but relatively low bond strength to a substrate and which can be removed from metal and other surfaces easily and simply with little residue.

Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.

Abstract: Disclosed is a two-component curable polymeric system having increased viscosity. One component contains a homogeneous blend of a polyisocyanate and a homopolymer or copolymer of vinyl acetate. This component has a higher viscosity than the polyisocyanate alone, thereby increasing the viscosity of the two-component curable system. The other component of the two-component curable system is a composition containing an isocyanate reactive component. The polyisocyanate and the isocyanate reactive component react together (“cure”) to form a polymer. Typically, but not always, the isocyanate reactive component is a polyol or polyamine that is capable of reacting with the polyisocyanate, thereby forming a polyurethane (polyol) or polyurea (polyamine).

Abstract: Disclosed is a two-component, liquid curable polyurethane adhesive system comprising an isocyanate reactive part A and an isocyanate functional part B. Either or both parts include substantial amounts of sustainable materials. The inventive mixed adhesive compositions are able to effectively bond to a separation membrane of a filtration apparatus. The invention is also directed to a method of bonding filter assembly components using this two-component curable polyurethane adhesive composition and a filter assembly bonded together using this adhesive composition.

Abstract: Commercially available gas filters are too large for mobile form-factor gas sensors. These sensors require filters with planar dimensions in the millimeter range and thicknesses of 1 mm or less and combined with long term and harsh conditions survivability. Furthermore, custom filters made small enough to be applied onto mobile form-factor gas sensors are generally not specific enough to support multi-gas detection. This invention describes a novel structured filter: (1) derived from principles of macroscale gas separation columns, (2) made compact enough to be utilized at millimeter scale and microscale levels, and (3) made compatible with mobile requirements and some methodology for usage in micro gas spectroscopy platforms.

Abstract: Two-part silane modified polymer/free radically curable adhesive systems demonstrating improved strength and percent elongation are provided.

Abstract: Photocurable compositions that have a color change during curing and methods of preparation and use of such compositions. More particularly, the present invention relates to photocurable compositions that that have a color change during curing and are useful for forming topographical features, e.g., spacer features, and/or fold protection coatings on a portion of a membrane surfaces, and particularly on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.

Abstract: Disclosed is a dual UV and reaction curable, two component adhesive comprising both acrylic chemistry and polyurethane chemistry. The UV curable acrylate component provides a fast cure reaction to generate a tack-free surface. The mixed two component polyurethane cures to a reaction product that provides flexibility and chemical resistance. The adhesive is useful as fold protection for spiral filtration modules. When cured on a membrane the adhesive will maintain integrity and adhesion to membrane after treatments of creasing and soaking at high temperature, pressure, and wide pH ranges.

Abstract: Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.

Abstract: Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.

Abstract: An electrochemical gas detector includes an electrochemical cell, a switching circuit, and a drive circuit. The switching circuit is electrically coupled to the electrochemical cell and to the switching circuit. The drive circuit includes a working-electrode terminal, a counter-electrode terminal, and a reference-electrode terminal. The electrochemical cell includes a first electrode, a second electrode, and a third electrode. The switching circuit has a first state in which the first electrode is electrically coupled to the working-electrode terminal, the second electrode is electrically coupled to the counter-electrode terminal, and the third electrode is electrically coupled to the reference-electrode terminal. The switching circuit has a second state in which the first electrode is electrically coupled to the counter-electrode terminal, the second electrode is electrically coupled to the working-electrode terminal, and the third electrode is electrically coupled to the reference-electrode terminal.

Abstract: An electrochemical sensor device that is efficiently and economically produced at the chip level for a variety of applications is disclosed. In some aspects, the device is made on or using a wafer technology whereby a sensor chamber is created by said wafer and a gas port allows for a working electrode of the sensor to detect certain gases. Large scale production is possible using wafer technology where individual sensors are produced from one or more common wafers. Integrated circuits are made in or on the wafers in an integrated way so that the wafers provide the substrate for the integrated circuitry and interconnects as well as providing the definition of the chambers in which the gas sensors are disposed.

Abstract: Disclosed is a two-component curable polymeric system having increased viscosity. One component contains a homogeneous blend of a polyisocyanate and a homopolymer or copolymer of vinyl acetate. This component has a higher viscosity than the polyisocyanate alone, thereby increasing the viscosity of the two-component curable system. The other component of the two-component curable system is a composition containing an isocyanate reactive component. The polyisocyanate and the isocyanate reactive component react together (“cure”) to form a polymer. Typically, but not always, the isocyanate reactive component is a polyol or polyamine that is capable of reacting with the polyisocyanate, thereby forming a polyurethane (polyol) or polyurea (polyamine).