Patents by Inventor Chih Min Lin
Chih Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240146205Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.Type: ApplicationFiled: September 23, 2023Publication date: May 2, 2024Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
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Patent number: 11942396Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.Type: GrantFiled: December 29, 2021Date of Patent: March 26, 2024Assignee: Industrial Technology Research InstituteInventors: Heng-Chieh Chien, Shu-Jung Yang, Yu-Min Lin, Chih-Yao Wang, Yu-Lin Chao
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Publication number: 20240092984Abstract: A resin film is provided. When the resin film is characterized by Fourier transform infrared spectroscopy (FTIR), the Fourier transform infrared spectrum of the resin film has a signal intensity A from 2205 cm?1 to 2322 cm?1 and a signal intensity B from 1472 cm?1 to 1523 cm?1, and 0.70?A/B?1.95.Type: ApplicationFiled: May 24, 2023Publication date: March 21, 2024Inventors: Hsuan-Min LIN, Chih-Fu CHEN, An-Pang TU
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Publication number: 20240071953Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.Type: ApplicationFiled: November 6, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240071954Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.Type: ApplicationFiled: November 9, 2023Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
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Publication number: 20240002762Abstract: A method for accelerating an oxidation rate of food comprises the following steps: providing a food; sensing an oxidation state of the food by a sensing unit; generating a sensing signal by the sensing unit; retrieving a digital signal of a spectrum waveform from a database according to the sensing signal; and transmitting a millimeter-wave analog signal to the food according to the digital signal of the spectrum waveform, where the millimeter-wave analog signal comprises first frequency signals and second frequency signals, and the first frequency signals and the second frequency signals are alternately arranged, and the first and second frequency signals comprise sinusoidal waveforms.Type: ApplicationFiled: September 18, 2023Publication date: January 4, 2024Applicant: Millitronic Co., Ltd.Inventors: Ya-Chung Yu, Chih-Min Lin
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Patent number: 11802262Abstract: The present invention provides a system for accelerating the food oxidation rate, comprising a control unit, a baseband circuit, a radio-frequency circuit and an array of antennas. The control unit is used to generate a digital control signal of a spectrum waveform. The baseband and radio-frequency circuits generate analog signal of millimeter-wave according to the control signal of a spectrum waveform. The baseband circuit and the array of antennas emit the analog signal of millimeter-wave toward the food, wherein the analog signal of millimeter-wave has a plurality of first frequency signals and a plurality of second frequency signals, and the first frequency signals and the second frequency signals are alternately arranged and spaced from each other and comprise a plurality of sinusoidal waveforms.Type: GrantFiled: July 6, 2018Date of Patent: October 31, 2023Assignee: Millitronic Co., Ltd.Inventors: Ya-Chung Yu, Chih-Min Lin
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Publication number: 20230245865Abstract: A processing chamber includes a grid and a first disk. The grid includes a plurality of holes arranged in the processing chamber. The grid partitions the processing chamber into a first chamber in which plasma is generated and a second chamber in which a pedestal is configured to support a substrate. The first disk is arranged in the second chamber. The first disk is movable between the grid and the substrate when supported on the pedestal.Type: ApplicationFiled: May 17, 2022Publication date: August 3, 2023Inventors: Chih-Min LIN, Shuogang HUANG, Seokmin YUN, Chih-Yang CHANG, Chih-Ming CHANG, Shih-Yuan CHENG
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Publication number: 20210292691Abstract: The present invention provides a system for accelerating the food oxidation rate, comprising a control unit, a baseband circuit, a radio-frequency circuit and an array of antennas. The control unit is used to generate a digital control signal of a spectrum waveform. The baseband and radio-frequency circuits generate analog signal of millimeter-wave according to the control signal of a spectrum waveform. The baseband circuit and the array of antennas emit the analog signal of millimeter-wave toward the food, wherein the analog signal of millimeter-wave has a plurality of first frequency signals and a plurality of second frequency signals, and the first frequency signals and the second frequency signals are alternately arranged and spaced from each other and comprise a plurality of sinusoidal waveforms.Type: ApplicationFiled: July 6, 2018Publication date: September 23, 2021Inventors: Ya-Chung Yu, Chih-Min Lin
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Patent number: 10895641Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.Type: GrantFiled: March 25, 2019Date of Patent: January 19, 2021Assignee: Everlight Electronics Co., Ltd.Inventors: Shih-Wen Lai, Yi-Ting Huang, Jing-Hong Lai, Chih-Hao Hsu, Chia-Wei Yang, Chih-Min Lin, Chieh-Yu Kang, Kuang-Mao Lu, Jian-Hong Fan
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Publication number: 20200116860Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.Type: ApplicationFiled: March 25, 2019Publication date: April 16, 2020Applicant: Everlight Electronics Co., Ltd.Inventors: Shih-Wen Lai, Yi-Ting Huang, Jing-Hong Lai, Chih-Hao Hsu, Chia-Wei Yang, Chih-Min Lin, Chieh-Yu Kang, Kuang-Mao Lu, Jian-Hong Fan
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Patent number: 10368460Abstract: A server casing using a sliding apparatus for easy insertion and removal of blade servers includes a chassis and the sliding apparatus. The chassis includes a blocking member. The sliding apparatus includes a first fastening plate, a second parallel fastening plate being mounted to the first fastening plate. A sliding plate is slidably connected to the second fastening plate. The sliding plate is received between first and second fastening plates and there is a locking member with first and second ends. The first end is rotatably connected to the second fastening plate and includes a locking portion, the second end is connected to the sliding plate. The locking portion can move between a locking position, where the locking member is locked by the blocking member, and an unlocking position, where the locking member is unlocked by the blocking member.Type: GrantFiled: May 3, 2018Date of Patent: July 30, 2019Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.Inventors: Tzu-Cheng Yang, Huang-Jyun Lu, Chih-Min Lin
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Publication number: 20190051800Abstract: A light emitting diode (LED) device and a method of manufacturing the LED device aforementioned are provided. The LED device (400) includes a LED chip (430), an encapsulant (440) and a ring-shape barrier (450?). The LED chip has a first surface and a reflection surface, and the encapsulant covers the LED chip. Wherein the reflection surface (450a) is inclined with respect to a side surface (430b) of the LED chip. A light output angle can be effectively adjusted, and the needs to re-design lenses when market demand changes may be reduced.Type: ApplicationFiled: November 9, 2016Publication date: February 14, 2019Applicant: EVERLIGHT ELECTRONICS CO., LTD.Inventors: Chih-Min LIN, Tsung-Lin LU, Wei-Tyng YU, Robert YEH, Chung-Chuan HSIEH, Chun-Min LIN
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Publication number: 20180168727Abstract: The present invention provides an electromagnetic wave therapy device and an immunotherapy method thereof, which sense an ambient temperature and a body temperature of a patient by a sensing unit, thereby generating a sensing signal. A control unit, based on indication information, sensing signals and finding a corresponding spectrum indication signal in the database.Type: ApplicationFiled: December 13, 2017Publication date: June 21, 2018Inventors: CHIH-MIN LIN, YA-CHUNG YU
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Publication number: 20170207375Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.Type: ApplicationFiled: March 31, 2017Publication date: July 20, 2017Inventors: Tsung-Lin Lu, Jen-Hsiung Lai, Yu-Ching Fang, Chih-Min Lin, I-Chun Hung
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Patent number: 9646957Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.Type: GrantFiled: January 13, 2016Date of Patent: May 9, 2017Assignee: Everlight Electronics Co., Ltd.Inventors: Tsung-Lin Lu, Jen-Hsiung Lai, Yu-Ching Fang, Chih-Min Lin, I-Chun Hung
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Publication number: 20160380162Abstract: A light emitting device includes a substrate; an LED chip, disposed on the substrate; and a fluorescent layer. The fluorescent layer is at least partially and conformally coated on the LED chip and the substrate.Type: ApplicationFiled: June 23, 2016Publication date: December 29, 2016Inventors: Chih-Min Lin, Tsung-Lin Lu, Jen-Hsiung Lai, Robert Yeh, I-Chun Hung, Wei-Tyng Yu, Kuang-Mao Lu, Ru-Shi Liu
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Publication number: 20160204090Abstract: A light emitting diode (LED) packaging structure including a metal pad, an electric static discharge (ESD) protection element and an LED chip is provided. The metal pad has a first pad portion having a first top surface with a first concave configured thereon and a second pad portion having a second top surface with a second concave configured thereon. The ESD protection element has two first electrode portions respectively configured in the first concave and the second concave. The LED chip is located above the ESD protection element and has two second electrode portions respectively configured on the first top surface and the second top surface. A frame and a light emitting device having the frame that both include the above LED packaging structure are described herein. A light emitting device having an omni-directional light emitting effect is also described and includes the above LED packaging structure.Type: ApplicationFiled: January 13, 2016Publication date: July 14, 2016Inventors: Tsung-Lin Lu, Jen-Hsiung Lai, Yu-Ching Fang, Chih-Min Lin, I-Chun Hung
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Patent number: 9101071Abstract: A magnetic element (100) includes a board unit (2) including a paddle board (21) having a row of first conductive vias (251) and a row of second conductive vias (252) for insertion of terminals (3), a number of embedded magnetic components (22), and a number of SMDs (surface mount devices) (23) mounted on the paddle board by SMT (surface mount technology). Each embedded magnetic component includes a magnetic core (221) embedded in the paddle board, and a number of PCB (printed circuit board) layout traces (222) disposed in the paddle board. Each PCB layout trace includes a first PCB layout trace (222a) encircling around the magnetic core and connecting with the first conductive via, and a second PCB layout trace (222b) encircling around the magnetic core and connecting with the SMD.Type: GrantFiled: November 22, 2010Date of Patent: August 4, 2015Assignee: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Li-Chun Wu, Yong-Chun Xu, Chao-Tung Huang, Chih-Min Lin, Jian-She Hu, Kuo-Chuan Huang
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Patent number: D906302Type: GrantFiled: June 4, 2018Date of Patent: December 29, 2020Assignee: Millitronic Co., Ltd.Inventors: Ya-Chung Yu, Chih-Min Lin