Patents by Inventor Chih-Min Tseng
Chih-Min Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11338472Abstract: A cutting apparatus is provided. The cutting apparatus includes a processing chamber, a chuck table, a transferring mechanism, and a cleaning member. The chuck table is disposed in the processing chamber and configured to hold a workpiece on a chuck surface of the chuck table during a cutting process. The transferring mechanism is configured to transfer the workpiece to the chuck surface before the cutting process or transfer the workpiece away from the chuck surface after the cutting process. The cleaning member is disposed in the processing chamber, and is configured to move across and clean the chuck surface, driven by the transferring mechanism.Type: GrantFiled: June 15, 2020Date of Patent: May 24, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventor: Chih-Min Tseng
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Publication number: 20200307022Abstract: A cutting apparatus is provided. The cutting apparatus includes a processing chamber, a chuck table, a transferring mechanism, and a cleaning member. The chuck table is disposed in the processing chamber and configured to hold a workpiece on a chuck surface of the chuck table during a cutting process. The transferring mechanism is configured to transfer the workpiece to the chuck surface before the cutting process or transfer the workpiece away from the chuck surface after the cutting process. The cleaning member is disposed in the processing chamber, and is configured to move across and clean the chuck surface, driven by the transferring mechanism.Type: ApplicationFiled: June 15, 2020Publication date: October 1, 2020Inventor: Chih-Min TSENG
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Patent number: 10695952Abstract: A cutting apparatus is provided. The cutting apparatus includes a processing chamber, a chuck table, a transferring mechanism, and a cleaning member. The chuck table is disposed in the processing chamber and configured to hold a workpiece on a chuck surface of the chuck table. The transferring mechanism is configured to transfer the workpiece to the chuck surface or transfer the workpiece away from the chuck surface. The cleaning member, which is disposed in the processing chamber, is configured to move across and clean the chuck surface before the workpiece is transferred to the chuck table and/or after the workpiece is transferred away from the chuck table.Type: GrantFiled: September 19, 2018Date of Patent: June 30, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventor: Chih-Min Tseng
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Publication number: 20200086527Abstract: A cutting apparatus is provided. The cutting apparatus includes a processing chamber, a chuck table, a transferring mechanism, and a cleaning member. The chuck table is disposed in the processing chamber and configured to hold a workpiece on a chuck surface of the chuck table. The transferring mechanism is configured to transfer the workpiece to the chuck surface or transfer the workpiece away from the chuck surface. The cleaning member, which is disposed in the processing chamber, is configured to move across and clean the chuck surface before the workpiece is transferred to the chuck table and/or after the workpiece is transferred away from the chuck table.Type: ApplicationFiled: September 19, 2018Publication date: March 19, 2020Inventor: Chih-Min TSENG
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Patent number: 9664355Abstract: This invention discloses an LED lamp with an external light source, including a tube, an LED light source plate. The LED light source plate includes a strip base and a plurality of LED illuminants. The lamp has a strip through hole along the length direction of the lamp. The strip base is fixed to the external circumference surface of the lamp, the plurality of LED illuminants are placed between the two side surfaces of the strip through hole. Preferably, the lamp is a circular glass lamp, the strip through hole is on the top of the lamp. Furthermore, the inner surface of the lamp is covered with a diffusion layer. The present invention is beneficial for automatic production and reducing the cost. At the same time, the LED light has a good diffusion and the waste heat is easy to dissipate.Type: GrantFiled: October 13, 2015Date of Patent: May 30, 2017Assignee: Kaistar Lighting (Xiamen) Co., ltdInventors: Chih Min Tseng, Yung-Yi Chuang
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Publication number: 20160230940Abstract: This invention discloses an LED lamp with an external light source, including a tube, an LED light source plate. The LED light source plate includes a strip base and a plurality of LED illuminants. The lamp has a strip through hole along the length. direction of the lamp. The strip base is fixed to the external circumference surface of the lamp, the plurality of LED illuminants are placed between the two side surfaces of the strip through hole. Preferably, the lamp is a circular glass lamp, the strip through hole is on the top of the lamp. Furthermore, the inner surface of the lamp is covered with a diffusion layer. The present invention is beneficial for automatic production and reducing the cost. At the same time, the LED light has a good diffusion and the waste heat is easy to dissipate.Type: ApplicationFiled: October 13, 2015Publication date: August 11, 2016Applicant: Kaistar Lighting (Xiamen) Co.,ltdInventors: Chih Min Tseng, Yung-Yi Chuang
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Patent number: 7781140Abstract: A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.Type: GrantFiled: August 17, 2006Date of Patent: August 24, 2010Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chih-Min Tseng, Hsiu-Mei Yu, Wen-Hsiang Tseng, Chia-Jen Cheng, Yu-Lung Feng, Tung-Wen Hsieh
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Publication number: 20080044756Abstract: A method for removing dry film resist (DFR) from a fine pitch solder bump array on a semiconductor wafer provides for pre-soaking the wafer in a chemical bath then turbulently exposing the wafer to a chemical solution, both steps taking place in batch processing with the wafers processed in a vertical position. The wafers are then individually processed through a chemical spinning operation in which a chemical solution is dispensed from a spray nozzle while motion such as spinning is imparted the horizontally disposed wafer. The spin speed of the chemical spraying process may then be increased to accelerate physical removal of residue. Deionized water rinsing and spin-drying provide a solder bump array void of any DFR or other residuals.Type: ApplicationFiled: August 17, 2006Publication date: February 21, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Min Tseng, Hsiu-Mei Yu, Wen-Hsiang Tseng, Chia-Jen Cheng, Y. L. Feng, Tung-Wen Hsieh
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Publication number: 20050130437Abstract: In accordance with the objectives of the invention a new method and apparatus is provided for the removal of by-products resulting from a dry-film removal process. The conventional method and apparatus for controlling a dry-film removal process is extended by the addition of a Dry-Film Remove Pre-Filter System, which significantly enhances the capability of filtering a dry-film removal solution.Type: ApplicationFiled: December 16, 2003Publication date: June 16, 2005Inventors: Chih-Min Tseng, Chien-Hsun Peng, Szu-Yao Wang, Chun-Yen Lo