Abstract: Wafer bowing induced by deep trench capacitors is ameliorated by structures formed on the reverse side of the wafer. The structures on the reverse side include tensile films. The films can be formed within trenches on the back side of the wafer, which enhances their effect. In some embodiments, the wafers are used to form 3D-IC devices. In some embodiments, the 3D-IC device includes a high voltage or high power circuit.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor structure, a dielectric layer, a metal-semiconductor compound film and a cover layer. The semiconductor structure has an upper surface and a lateral surface. The dielectric layer encloses the lateral surface of the semiconductor structure and exposes the upper surface of the semiconductor structure. The metal-semiconductor compound film is on the semiconductor structure, wherein the dielectric layer exposes a portion of a surface of the metal-semiconductor compound film. The cover layer encloses the portion of the surface of the metal-semiconductor compound film exposed by the dielectric layer, and exposes the dielectric layer.

Abstract: Provided herein are compositions and methods of treating liver cancer by novel anticancer agents.

Abstract: An equalizer tuning method for a memory storage device is provided according to an exemplary embodiment of the disclosure. The method includes: receiving a first signal; modulating the first signal by a first modulation circuit according to a first type parameter and modulating the first signal by a second modulation circuit according to a second type parameter; detecting a signal eye-width value and a signal eye-height value of the modulated first signal; and adjusting the first type parameter according to the detected signal eye-width value and adjusting the second type parameter according to the detected signal eye-height value.

Abstract: The present disclosure provides a packaging method, including: providing a first semiconductor substrate; forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate includes a first bonding metal layer and a second bonding metal layer; providing a second semiconductor substrate having a bonding region, wherein the bonding region of the second semiconductor substrate includes a third bonding layer; and bonding the first semiconductor substrate to the second semiconductor substrate by bringing the bonding region of the first semiconductor substrate in contact with the bonding region of the second semiconductor substrate; wherein the first and third bonding metal layers include copper (Cu), and the second bonding metal layer includes Tin (Sn). An associated packaging structure is also disclosed.

Abstract: In some embodiments, a rack system is configured to comprise a removable fan system. The fan system enables thermal management of the rack system. The removable fan system includes a replaceable fan tray that can be assembled in the rack system by engaging a connecting mechanism and connecting a connecting cable. The fan tray is engaged with the connecting mechanism to be securely attached to the rack system. The fan tray is connected to a bus bar to receive power or necessary data to be operated. The fan tray can be disassembled from the rack system while the bus remains active, and enables access to the server or the rack system. The replaceable fan tray enables easy replacement of the fan system and access to the rear side of the rack system.

Abstract: A rack system for a server includes a number of server units, which includes first to the third sets of server units, voltage converter, first to third power supply circuits. The voltage converter receives and converters a three-phase alternating current (AC) power signal to provide first to third single-phase power signals. The first to the third sets of power supply circuits respectively provides firs to third direct current (DC) power signals according to the first to the third single-phase power signals. The first set to the third set of server units is respectively powered by first to the third DC power signals or respectively powered by first part, second part, and third part of the first to the third DC power signals.

Abstract: Some embodiments relate to an integrated circuit (IC) disposed on a silicon substrate, which includes a well region having a first conductivity type. A dielectric layer is arranged over an upper surface of the silicon substrate, and extends over outer edges of the well region and includes an opening that leaves an inner portion of the well region exposed. An epitaxial pillar of SiGe or Ge extends upward from the inner portion of the well region. The epitaxial pillar includes a lower epitaxial region having the first conductivity type and an upper epitaxial region having a second conductivity type, which is opposite the first conductivity type. A dielectric sidewall structure surrounds the epitaxial pillar and has a bottom surface that rests on an upper surface of the dielectric layer.

Abstract: A human body positioning method, a human body positioning system, and a positioning server are provided, adapted for positioning a human body in a specific space. Best routing paths between a positioning server and a target wireless device among wireless devices are sought according to communication quality of the wireless devices. A device positioning result is estimated according to the best routing paths. A wireless network topology formed by operating wireless devices is established. Voxels of a 3D space image are transmitted into the wireless network topology, and the human body is detected according to the voxels based on serving the operating wireless devices as a neuron of a neural network architecture associated with a body detecting model. When the human body is detected, the human body is positioned at the device positioning result.

Abstract: A method of manufacturing a photomask includes at least the following steps. First, a phase shift layer and a hard mask layer are formed on a light transmitting substrate. A predetermined mask pattern is split into a first pattern and a second pattern. A series of processes is performed so that the hard mask layer and the phase shift layer have the first pattern and the second pattern. The series of processes includes at least the following steps. First, a first exposure process for transferring the first pattern is performed. Thereafter, a second exposure process for transferring the second pattern is performed. The first exposure process and the second exposure process are executed by different machines.

Abstract: A storage device lifetime monitoring system for monitoring lifetimes of storage devices and a storage device lifetime monitoring method thereof are provided. The method includes collecting operation activity information corresponding to the storage devices; storing multiple training data having the operation activity information and corresponding operation lifetime values; constructing a storage device lifetime predicting model according to the operation activity information and the corresponding operation lifetime values of the training data; inputting the operation activity information of the storage devices into the storage device lifetime predicting model to generate a predicted lifetime value corresponding to each of the storage devices; and re-constructing the storage device lifetime predicting model according to operation activity information and predicted lifetime value of each storage device. Thereby, the lifetime of storage devices can be accurately predicted.

Abstract: Some embodiments relate to an integrated circuit (IC) disposed on a silicon substrate, which includes a well region having a first conductivity type. A dielectric layer is arranged over an upper surface of the silicon substrate, and extends over outer edges of the well region and includes an opening that leaves an inner portion of the well region exposed. An epitaxial pillar of SiGe or Ge extends upward from the inner portion of the well region. The epitaxial pillar includes a lower epitaxial region having the first conductivity type and an upper epitaxial region having a second conductivity type, which is opposite the first conductivity type. A dielectric sidewall structure surrounds the epitaxial pillar and has a bottom surface that rests on an upper surface of the dielectric layer.

Abstract: A method, a system and a server for self-healing of an electronic apparatus are provided. In the method, the components installed in the electronic apparatus are sequentially called and checked to update each component. Then, a self-diagnosis is executed on the electronic apparatus to produce a diagnosis result and the diagnosis result is sent to a server. The server analyzes the diagnosis result, accordingly sets at least one policy for healing the electronic apparatus and sends the at least one policy back to the electronic apparatus. The electronic apparatus transforms the policy into at least one rule adapted for itself and performs the self-healing according to the rules.

Abstract: A monitoring method based on Internet of things (IoT), a fog computing terminal and an Internet of things system are provided. The fog computing terminal downloads an application package from a cloud server, downloads a general model from the cloud server through the application package, sets one or more IoT devices to a device group to receive a plurality of sensing data from the device group, and executes an incremental learning based on the sensing data and the general model to obtain an incrementally learning model for controlling the device group by the incrementally learning model.

Abstract: Provided is an eyewear lens, including a lens substrate and an optical interference coating; the lens substrate is comprised of an optical material, and the optical interference coating is bonded to the lens substrate and is stacked by the composition of high and low reflectivity materials. A predefined reflective appearance color will be formed by light getting through the optical interference coating. The lens substrate contains another filter on one side surface or both side surfaces or inside the lens substrate which is complementary to the light after penetrating the optical interference coating such that the overall transmittance light tone remain neutral balance. The overall transmittance light spectrum has three pass-bands corresponding to the maximum response of the human eye cone cells, and the relatively high transmittance values of each pass-band center are approximately at 450 nm, 530 nm and 610 nm. The FWHM of each pass-band is between 3 nm and 50 nm.

Abstract: Provided is an eyewear lens, including a lens substrate and an optical interference coating. The lens substrate is comprised of an optical material, and the optical interference coating is combined with the lens substrate and is stacked by the composition of high and low reflectivity materials. A predefined reflective appearance color will be formed by light getting through the optical interference coating. The lens substrate contains another filter on one side surface or both side surfaces or inside the lens substrate which is complementary to the light after penetrating the optical interference coating such that the overall transmittance light color remains neutral balance. Moreover, the overall transmittance spectrum of a lens uniformly filters the reflected visible light of objects. As such, a stylish reflective appearance color lens having neutral balance perspective visual tone and most colorful rendering effect of watching the scenery is achieved.

Abstract: A method of fabricating a photomask includes providing a blank mask; removing a portion of the resist layer to form a patterned resist layer exposing a portion of the cooling layer; patterning the cooling layer by using the patterned resist layer as an etching mask; patterning the opaque layer; and removing the patterned resist layer and the patterned cooling layer. The blank mask includes a light-transmitting substrate and an opaque layer, a cooling layer, and a resist layer sequentially stacked thereon, wherein the cooling layer has a thermal conductivity ranging between 160 and 5000 and an effective atomic number ranging between 5 and 14.

Abstract: A protection method, which releases an attack of a malware to a network interface controller (NIC) system, includes processing a microbatching operation in a plurality of session channels at at least an operational period according to at least one input information, to generate a plurality of session-specific NIC patterns of the plurality of session channels; and merging the plurality of session-specific NIC patterns to generate an application-specific NIC pattern at an application layer, so as to dispose a script information corresponding to the application-specific NIC pattern in the NICs for releasing the attack of the malware, wherein the microbatching operation is processed to generate a plurality of independent subset-specific NIC pattern in each session channel, so as to generate the session-specific NIC pattern corresponding to each session channel.

Abstract: A method, a system and a server for self-healing of an electronic apparatus are provided. In the method, the components installed in the electronic apparatus are sequentially called and checked to update each component. Then, a self-diagnosis is executed on the electronic apparatus to produce a diagnosis result and the diagnosis result is sent to a server. The server analyzes the diagnosis result, accordingly sets at least one policy for healing the electronic apparatus and sends the at least one policy back to the electronic apparatus. The electronic apparatus transforms the policy into at least one rule adapted for itself and performs the self-healing according to the rules.

Abstract: A server device includes a tray having a lug, a hard disk unit removably disposed on the tray, and a handle pivotally connected to two opposite sides of the hard disk unit. The lug is formed with a slot thereon to define two inner edges opposite to each other. The handle is provided with a protrusion arranged in the slot. When the handle is rotated towards one end of the hard disk unit, the protrusion is rotated along with the handle to contact and push one of the inner edges of the lug, such that the hard disk unit is restrained by the tray after the hard disk unit is slid in relative to the tray.