Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: A semiconductor device comprises a fin structure disposed over a substrate; a gate structure disposed over part of the fin structure; a source/drain structure, which includes part of the fin structure not covered by the gate structure; an interlayer dielectric layer formed over the fin structure, the gate structure, and the source/drain structure; a contact hole formed in the interlayer dielectric layer; and a contact material disposed in the contact hole. The fin structure extends in a first direction and includes an upper layer, wherein a part of the upper layer is exposed from an isolation insulating layer. The gate structure extends in a second direction perpendicular to the first direction. The contact material includes a silicon phosphide layer and a metal layer.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: An electric parking stand has a frame (100), a leg assembly (200), and a planetary gear motor (300). The frame (100) has a pair of end plates (110) and a plurality of supporting rods (120) connected between the pair of end plates (110). The leg assembly (200) is pivoted with the respective end plates (110), and the leg assembly (200) has a sector gear (220). The planetary gear motor (300) is fixed to the supporting rods (120) and engaged with the sector gear (220). Thereby, the preassembled electric parking stand could be installed onto a motor cycle by screwing the respective end plates (110) to the motor cycle.

Abstract: A blank tire pressure monitoring device includes a housing having an air valve at one end and connection terminals at an opposite end, a circuit board mounted in the housing and carrying a pressure sensor, a temperature sensor, an acceleration sensor, an analog-digital converter electrically connected with the pressure sensor, the temperature sensor and the acceleration sensor, a general purpose I/O terminal unit electrically connected with the connection terminals of the housing; an embedded microcontroller module electrically connected with the general purpose I/O terminal unit and the analog-digital converter and having built therein a flash memory, a microcontroller core and a special-function register controller, a LF receiver electrically connected to the embedded microcontroller module, and a transmitter electrically connected to the embedded microcontroller module; and a method is still also disclosed for setting up a blank tire pressure monitoring device.

Abstract: The invention provides a surface mount technology process for an advanced quad flat no-lead package process and a stencil used therewith. The surface mount technology process for an advanced quad flat no-lead package includes providing a printed circuit board. A stencil with first openings is mounted over the printed circuit board. A solder paste is printed passing the first openings to form first solder paste patterns. The stencil is taken off. A component placement process is performed to place the advanced quad flat no-lead package comprising a die pad on the printed circuit board, wherein the first solder paste patterns contact a lower surface of the die pad, and an area ratio of the first openings to the lower surface of the die pad is between 1:2 and 1:10. A reflow process is performed to melt the first solder paste patterns to surround a sidewall of the die pad.

Abstract: A blank tire pressure monitoring device includes a housing having an air valve at one end and connection terminals at an opposite end, a circuit board mounted in the housing and carrying a pressure sensor, a temperature sensor, an acceleration sensor, an analog-digital converter electrically connected with the pressure sensor, the temperature sensor and the acceleration sensor, a general purpose I/O terminal unit electrically connected with the connection terminals of the housing; an embedded microcontroller module electrically connected with the general purpose I/O terminal unit and the analog-digital converter and having built therein a flash memory, a microcontroller core and a special-function register controller, a LF receiver electrically connected to the embedded microcontroller module, and a transmitter electrically connected to the embedded microcontroller module; and a method is still also disclosed for setting up a blank tire pressure monitoring device.

Abstract: A programmable tire-condition sensor includes a control module, which includes a circuit board carrying a battery, a power switch, a processor, a memory, a pressure sensor, a temperature sensor, an acceleration sensor, a voltage sensor, a transmission interface unit and a connection port, and a flexible shell that has a surface area greater than the circuit board, an uplifted area on the middle, an opening, a switch accommodation hole for accommodating the power switch and a connection port accommodation hole for accommodating the connection port. A vehicle tire is also disclosed having installed therein the programmable tire-condition sensor, and a method is still also disclosed for installing the programmable tire-condition sensor in a vehicle tire.

Abstract: A pre-solder method for a multi-row quad flat no-lead (QFN) packaged chip is provided. Solder paste is applied on at least one pad of the multi-row QFN packaged chip. The multi-row QFN packaged chip is heated, such that the solder paste on the at least one pad of the multi-row QFN packaged chip becomes solid solder before the multi-row QFN packaged chip is mounted on a substrate.

Abstract: An apparatus and method for testing an integrated circuit in a target electronic application, wherein the apparatus includes a socket for receiving the integrated circuit, a modified commercial electronic product which models the target electronic application, and an electrical connection between the socket and the modified commercial electronic product. The method of testing an integrated circuit includes placing an integrated circuit in a socket that is coupled to a circuit board substantially identical to that of a circuit board configured to include the integrated circuit, but which does not include the integrated circuit, and testing the integrated circuit. A method of making such a tester mechanically attaching a socket to a modified commercial electronic product and electrically connecting an integrated circuit and the modified commercial electronic product. This approach allows for cheaper, more comprehensive, and more accurate testing of an integrated circuit.

Abstract: An Internet advertising system is disclosed. A commercial project database stores a commercial, a questionnaire related to the commercial and a predetermined answer to the questionnaire. A user database stores a cellular phone number correlated to a user. A server is arranged to transmit the commercial and the questionnaire related to the commercial to a user equipment used by the user via the Internet network. An inputted answer from the user equipment via the Internet network is received and verified. The server transmits an authentication code via a cellular phone network based on the cellular phone number. An inputted code from the user equipment via the Internet network is verified for consistence.

Abstract: A barbecue grill has a body, a cover and two pivots. The body has a top, an outer surface and two pivotal brackets mounted on two sides of the outer surface. The cover is pivotally connected to the top of the body and has two pivotal tabs. The pivotal tabs are attached to the cover and correspond respectively to the pivotal brackets on the body. Each pivotal tab has an elongated channel defined through the pivotal tab. The pivots extend respectively through the elongated channels in the pivotal tabs and the pivotal brackets on the body to pivotally connect the cover to the body. Accordingly, the cover is easily opened.

Abstract: A method for detecting a tilt or a shift of a wafer on a hot plate is described. A temperature variation of the hot plate is measured directly after the wafer is transferred onto the hot plate. The temperature variation is analyzed to determine whether or not a tilt or a shift of the wafer has occurred.

Abstract: A method for detecting a tilt or a shift of a wafer on a hot plate is described. A temperature variation of the hot plate is measured directly after the wafer is transferred onto the hot plate. The temperature variation is analyzed to determine whether or not a tilt or a shift of the wafer has occurred.

Abstract: A barbecue has a body, a charcoal bracket and at least one food drawer. The body has a front wall with a mouth and multiple vents defined in the front wall, a central cavity and at least one side cavity. The charcoal bracket is received inside the central cavity in the body. The charcoal bracket has a barbecue grill mounted on the charcoal bracket. The at least one food holder is received in the at least one side cavity. When the barbecue is in use, the heat conducting from the charcoal bracket may bake foods inside the food holders.

Abstract: An apparatus and method for testing an integrated circuit in a target electronic application, wherein the apparatus comprises a socket for receiving the integrated circuit, a modified commercial electronic product which models the target electronic application, and an electrical connection between the socket and the modified commercial electronic product. The method of testing an integrated circuit comprises placing an integrated circuit in a socket that is coupled to a circuit board substantially identical to that of a circuit board configured to include the integrated circuit, but which does not include the integrated circuit, and testing the integrated circuit. A method of making such a tester mechanically attaching a socket to a modified commercial electronic product and electrically connencting an integrated circuit and the modified commercial electronic product. This approach allows for cheaper, more comprehensive, and more accurate testing of an integrated circuit.

Abstract: A CDMA system according to an embodiment of the invention employs a technique for power optimized user loading that obtains a desired allocation of different radio configuration calls. The technique takes advantage of the relatively low power requirements of RC3 calls for low load conditions, while increasing the number of RC4 calls for high load conditions. As the load increases, the system determines a target combination of RC3 and RC4 calls based upon the current average power per link measurements for RC3 and RC4 calls, and based upon the power limitations of the system. The technique strives to maximize the capacity of the system while maintaining operation below the overall power limit.

Abstract: A CDMA system according to an embodiment of the invention employs a technique for power optimized user loading that obtains a desired allocation of different radio configuration calls. The technique takes advantage of the relatively low power requirements of RC3 calls for low load conditions, while increasing the number of RC4 calls for high load conditions. As the load increases, the percentage of RC4 calls increases while the percentage of RC3 calls decreases. The technique strives to minimize overall power consumption in the system for all call load conditions, by maximizing the number of RC3 calls at any given time while keeping Walsh code resources available for both new calls and hand-in traffic.