Abstract: A motherboard includes a circuit board and a connector mounted on the circuit board. The connector comprises a socket and a latch pivotally mounted on one end of the socket. The latch comprises a body, a pressing member connected to one side of the body and extending outward from one side of the body to the outside of the socket, exposing an area from a side of the interface card for finger pressing. The supporting member is connected to another side of the body, and when the pressing member is pressed, it drives the body to pivot and causes the pushing portion to lift the interface card, and the supporting member stop the body from pivoting by resting against the circuit board.

Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.

Abstract: The embodiments described herein are directed to a method for reducing fin oxidation during the formation of fin isolation regions. The method includes providing a semiconductor substrate with an n-doped region and a p-doped region formed on a top portion of the semiconductor substrate; epitaxially growing a first layer on the p-doped region; epitaxially growing a second layer different from the first layer on the n-doped region; epitaxially growing a third layer on top surfaces of the first and second layers, where the third layer is thinner than the first and second layers. The method further includes etching the first, second, and third layers to form fin structures on the semiconductor substrate and forming an isolation region between the fin structures.

Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: A circuit board module includes a circuit board body, a connector, a press button, a bracket, and a linkage. The connector includes a base and a rotating button rotatably disposed on the base. The press button is located away from the connector. The bracket includes a first limiting portion. The linkage is located between the rotating button and the press button and includes a second limiting portion corresponding to the first limiting portion, a first segment, and a second segment linked to the first segment. The first segment extends along a first axis and is linked to the rotating button. The second segment extends along a second axis and is linked to the press button. One of the second limiting portion and the first limiting portion extends along the first axis. The first segment is movably disposed on the bracket along the first axis.

Abstract: A computer system, remote control monitoring system, and remote control monitoring method are provided to instantly provide the local display screen of the local computer to the remote computer for remote real-time display. The remote control monitoring system is arranged in the local computer and has a signal receiver and a remote controller. The signal receiver receives the video signal from the processor, executes the signal transforming process to generate the video signal in different standards. The remote controller executes a network compressing process on the transformed video signal to generate the network transportable video data, and transmits the data to the remote computer for displaying the corresponding remote display screen on the remote computer. The present disclosure enables the implementing of the out-of-band remote displaying.

Abstract: A computer system, remote control monitoring system, and remote control monitoring method are provided to instantly provide the local display screen of the local computer to the remote computer for remote real-time display. The remote control monitoring system is arranged in the local computer and has a signal receiver and a remote controller. The signal receiver receives the video signal from the processor, executes the signal transforming process to generate the video signal in different standards. The remote controller executes a network compressing process on the transformed video signal to generate the network transportable video data, and transmits the data to the remote computer for displaying the corresponding remote display screen on the remote computer. The present disclosure enables the implementing of the out-of-band remote displaying.

Abstract: The invention provides a control method for sets of series-parallel-connected LEDs via a single wire. Step 1: providing an LED circuit including a control module and a light-emitting module. The light-emitting module includes LED strings connected to one another in parallel. Each of the LED strings includes a plurality of LED units connected in series to one another, and at least one counter comprising a counter start time different from that of another. Step 2: sending a setting signal by the control module, and allocating one identification code obtained sequentially in time to one of the LED string according to the different counter start times of the LED strings. Step 3: sending a designation signal to the light-emitting module by the control module, such that the LED string with the corresponding identification value is selected and independently controlled by the control module.

Abstract: The invention provides a control method for sets of series-parallel-connected LEDs via a single wire. Step 1: providing an LED circuit including a control module and a light-emitting module. The light-emitting module includes LED strings connected to one another in parallel. Each of the LED strings includes a plurality of LED units connected in series to one another, and at least one counter comprising a counter start time different from that of another. Step 2: sending a setting signal by the control module, and allocating one identification code obtained sequentially in time to one of the LED string according to the different counter start times of the LED strings. Step3: sending a designation signal to the light-emitting module by the control module, such that the LED string with the corresponding identification value is selected and independently controlled by the control module.

Abstract: A method of fabricating a semiconductor structure includes providing a semiconductor substrate, forming a trench in the semiconductor substrate, overfilling the trench with a first semiconductor material, wherein the first semiconductor material does not have a dopant, forming a second semiconductor material on the first semiconductor material, wherein the second semiconductor material contains a dopant, and performing a thermal treatment so that the dopant in the second semiconductor material diffuses into the first semiconductor material to form a doped third semiconductor material in the trench.

Abstract: A method of fabricating a semiconductor structure includes providing a semiconductor substrate, forming a trench in the semiconductor substrate, overfilling the trench with a first semiconductor material, wherein the first semiconductor material does not have a dopant, forming a second semiconductor material on the first semiconductor material, wherein the second semiconductor material contains a dopant, and performing a thermal treatment so that the dopant in the second semiconductor material diffuses into the first semiconductor material to form a doped third semiconductor material in the trench.

Abstract: A method for manufacturing a contact plug is provided. The method includes providing a silicon substrate having at least one opening. A titanium layer is conformably formed in the opening. A first barrier layer is conformably formed on the titanium layer in the opening. A rapid thermal process is performed on the titanium layer and the first barrier layer. After performing the rapid thermal process, a second barrier layer is conformably formed on the first barrier layer in the opening.

Abstract: A method for manufacturing a contact plug is provided. The method includes providing a silicon substrate having at least one opening. A titanium layer is conformably formed in the opening. A first barrier layer is conformably formed on the titanium layer in the opening. A rapid thermal process is performed on the titanium layer and the first barrier layer. After performing the rapid thermal process, a second barrier layer is conformably formed on the first barrier layer in the opening.

Abstract: A method for degrading chlorinated-organic pollutant comprises the steps of providing a chlorinated-organic pollutant contaminated medium having at least one chlorinated-organic pollutant of high concentration; adding a biodegradable surfactant into the chlorinated-organic pollutant contaminated medium to enable the chlorinated-organic pollutant of high concentration to reduce surface tension and increase solubility, and makes the chlorinated-organic pollutant of high concentration dissolve in water easily; adding a persulfate (S2O82?) into the chlorinated-organic pollutant contaminated medium; and adding a slag powder into the chlorinated-organic pollutant contaminated medium to produce a plurality of transition metal ions, and the transition metal ions catalyze the persulfate to generate sulfate radical (SO4?. ) to oxidize the chlorinated-organic pollutant of high concentration of the chlorinated-organic pollutant contaminated medium.

Abstract: A method of producing an edible packaging container is proposed, comprising the steps of: (a) preparing a kneaded batter; (b) forming an oil-layer region on the center portion of one side of the batter and a water-moisturizing region on the periphery of the same side of the batter; (c) folding up the batter by turning the oil-layer region thereof inwardly, and combining the a portion of the batter by machinery to form edges comprising the water-moisturizing region; and (d) cooking the batter by steaming and cutting along the folded lines to form a pocket-shaped container, thereby achieving the goal of mass production of an edible pocket container.