Patents by Inventor Chih-Ming Liu

Chih-Ming Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230352368
    Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.
    Type: Application
    Filed: April 27, 2022
    Publication date: November 2, 2023
    Applicants: Advanced Semiconductor Engineering, Inc., Universal Scientific Industrial (Shanghai) Co., Ltd.
    Inventors: Chih-Ming LIU, Yung-Fa CHEN, Hung Cheng CHANG
  • Patent number: 10877616
    Abstract: A sensing method of a touch sensing antenna of a touch device and a touch sensing antenna structure of a touch device, which provide a wire-free electromagnetic touch antenna circuit having a tandem line and a plurality of branch lines on a touchpad. The tandem line is disposed on the touchpad, the branch lines are respectively connected to the tandem line, and each of the branch lines is connected to a controller. The controller is set to make two of the branch lines with a regular interval to form a loop, then, all combinations of two of the branch lines that can form the loop are formed once within a cycle time, and complete one scan of the touchpad; then the touchpad is repeatedly scanned repeatedly through the mentioned cycle time so that the touch pen can be interpreted at any time and at any point of the touchpad.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: December 29, 2020
    Inventor: Chih-Ming Liu
  • Publication number: 20200150803
    Abstract: The present invention provides a touch panel with multipoint array sensing antenna, comprising: a panel, including a layout area; multiple sensing antenna sets, distributed in a rectangular array in aforesaid layout area, wherein each sensing antenna set comprises at least one receiving antenna unit and at least one transmitting antenna unit, which are assembled in a range of area, and the receiving antenna unit is capable of receiving an antenna signal from the transmitting antenna unit; and a touch device, made of a material weakening or amplifying the antenna signal; when the touch device moves to a range where anyone of multiple sensing antenna sets is capable of receiving or transmitting the antenna signal, the antenna signal received by the receiving antenna unit changes, and the touch device corresponded to a position of the panel is able to be judged by an antenna signal change in the position.
    Type: Application
    Filed: October 28, 2019
    Publication date: May 14, 2020
    Inventor: Chih-Ming LIU
  • Publication number: 20180335886
    Abstract: A sensing method of a touch sensing antenna of a touch device and a touch sensing antenna structure of a touch device, which provide a wire-free electromagnetic touch antenna circuit having a tandem line and a plurality of branch lines on a touchpad. The tandem line is disposed on the touchpad, the branch lines are respectively connected to the tandem line, and each of the branch lines is connected to a controller. The controller is set to make two of the branch lines with a regular interval to form a loop, then, all combinations of two of the branch lines that can form the loop are formed once within a cycle time, and complete one scan of the touchpad; then the touchpad is repeatedly scanned repeatedly through the mentioned cycle time so that the touch pen can be interpreted at any time and at any point of the touchpad.
    Type: Application
    Filed: May 11, 2018
    Publication date: November 22, 2018
    Inventor: Chih-Ming LIU
  • Patent number: 9618415
    Abstract: A pressure sensor package includes a substrate providing a connection port, a support member mounted on the substrate by compression molding and having a gap cut through opposing top and bottom walls thereof to expose the connection port, a sensor chip mounted on the support member and electrically connected to the connection port, an encapsulating cover covered on the support member and defining therein an accommodation chamber that accommodates the sensor chip and a through hole that is disposed in communication with the accommodation chamber for the passing of an external signal therethrough to the sensor chip. Thus, the support member steadily carries the sensor chip and isolates stress arising from the external environment, thereby reducing stress interference with the sensor chip and enhancing the overall performance of the pressure sensor package.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: April 11, 2017
    Assignees: LINGSEN PRECISION INDUSTRIES, LTD., UNISENSE TECHNOLOGY CO., LTD.
    Inventors: Ming-Te Tu, Chao-Wei Yu, Chih-Ming Liu
  • Publication number: 20160116359
    Abstract: A pressure sensor package includes a substrate providing a connection port, a support member mounted on the substrate by compression molding and having a gap cut through opposing top and bottom walls thereof to expose the connection port, a sensor chip mounted on the support member and electrically connected to the connection port, an encapsulating cover covered on the support member and defining therein an accommodation chamber that accommodates the sensor chip and a through hole that is disposed in communication with the accommodation chamber for the passing of an external signal therethrough to the sensor chip. Thus, the support member steadily carries the sensor chip and isolates stress arising from the external environment, thereby reducing stress interference with the sensor chip and enhancing the overall performance of the pressure sensor package.
    Type: Application
    Filed: February 9, 2015
    Publication date: April 28, 2016
    Inventors: Ming-Te TU, Chao-Wei YU, Chih-Ming LIU
  • Publication number: 20100276214
    Abstract: A tablet of a battery-free wireless pointing device has a battery-free wireless pointing device and a tablet. The wireless pointing device includes a power supply circuit and a sensing circuit. The tablet includes a signal processing unit, a first antenna loop, and a second antenna loop. The sensing circuit receives electric energy generated by the power supply and generates a sensing signal. The second antenna loop receives the sensing signal. The signal processing circuit generates a frequency signal and determines a current coordinate position of the pointing device according to the sensing signal.
    Type: Application
    Filed: June 29, 2009
    Publication date: November 4, 2010
    Applicant: KYE SYSTEMS CORP.
    Inventors: Chih-Min Liu, Chih-Ming Liu
  • Patent number: 7316264
    Abstract: A heat pipe includes a tubular member, a capillary wick, and a liquid. The tubular member has a plurality of capillary ditches formed on an internal sidewall thereof. The capillary wick is disposed on the internal sidewall of the tubular member and located on openings of the capillary ditches for covering and sealing the ditches. The liquid is contained inside the tubular member. The capillary wick and ditches provide the liquid with larger cross-sectional area for the capillary action to enhance guidance of the liquid and to further enhance the thermally conductive efficiency.
    Type: Grant
    Filed: August 12, 2005
    Date of Patent: January 8, 2008
    Assignee: Tai-Sol Electronics Co., Ltd.
    Inventors: Yaw-Huey Lai, Chih Ming Liu
  • Publication number: 20060176678
    Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.
    Type: Application
    Filed: March 15, 2006
    Publication date: August 10, 2006
    Inventors: Wen-Yen Lin, Tsan-Nan Chien, Yu Liu, Chih-Ming Liu
  • Publication number: 20040205281
    Abstract: A front side bus module is disclosed. The front side bus module includes a high density interconnection substrate and a plurality of high speed devices, wherein the high speed devices are disposed on the high density interconnection substrate and electrically connected therethrough.
    Type: Application
    Filed: April 5, 2004
    Publication date: October 14, 2004
    Inventors: Wen-Yen Lin, Tsan-Nan Chien, Yu Liu, Chih-Ming Liu
  • Patent number: 6366143
    Abstract: A data communication network is provided having a first communication device that includes a plurality of ports, and a control coupled to the ports and having a plurality of outputs extending from the control, with each of the outputs indicative of the status of one of the ports. The network further includes a power shut-off and recovery circuit coupled to the first communication device, and having a first signal detection circuit coupled to the ports for detecting activity on each port and for generating a first signal indicative of the activity, and a second signal detection circuit coupled to the outputs for detecting activity on each port and for generating a second signal indicative of the activity. The power shut-off and recovery circuit further includes a power control circuit that is coupled to the first and second signal detection circuits for receiving the first and second signals, respectively, and for selectively asserting an ENABLE signal based on either the first signal or the second signal.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: April 2, 2002
    Assignee: KYE Systems Corp.
    Inventors: Chih-Ming Liu, Chien-Hsin Tsai
  • Patent number: 5936442
    Abstract: A power shut-off and recovery circuit for data communication devices is provided. The power shut-off and recovery circuit has a power control circuit for polling a plurality of ports. The power control circuit determines how many of the ports are in an operational mode and compares the number of active ports to a predetermined number of ports. If the number of active ports is less than the predetermined number of ports, the power control circuit de-asserts an ENABLE signal. If the number of active ports is greater than or equal to the predetermined number of ports, the power control circuit asserts the ENABLE signal. A source transfer circuit is provided for selectively disengaging the data communication device from a power source in response to the ENABLE signal. The power control circuit re-polls all the ports and updates the ENABLE signal accordingly.
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: August 10, 1999
    Assignee: Kye Systems Corp.
    Inventors: Chih-Ming Liu, Chien-Hsin Tsai