Abstract: A method includes: generating a contaminant distribution map by sampling an environment of a cleanroom; selecting a first fabrication tool of the cleanroom by comparing the contaminant distribution map with at least one diffusion image in a first database; comparing parameters of the first fabrication tool against process utility information in a second database; and when the parameters are consistent with the process utility information, taking at least one action. The one action may include moving a cleaning tool to a location associated with a contaminant concentration of the contaminant distribution map; turning on a fan of the cleaning tool; stopping pod transit to the first fabrication tool; or halting production by the first fabrication tool.

Abstract: A semiconductor fabrication building is provided. The semiconductor fabrication building includes an ambient control surrounding and a makeup air handling unit configured to supply clean air to the ambient control surrounding. The makeup air handling unit includes a housing having an air inlet and an air outlet. The makeup air handling unit also includes a first filtration module positioned in the housing. The first filtration module includes a number of hollow fibers configured to guide air to flow from the air inlet to the air outlet. A porous layer is formed at an inner wall of each of the hollow fibers to filter airborne molecular contamination (AMC) having a selected size.

Abstract: A semiconductor fabrication building is provided. The semiconductor fabrication building includes an ambient control surrounding and a makeup air handling unit configured to supply clean air to the ambient control surrounding. The makeup air handling unit includes a housing having an air inlet and an air outlet. The makeup air handling unit also includes a first filtration module positioned in the housing. The first filtration module includes a number of hollow fibers configured to guide air to flow from the air inlet to the air outlet. A porous layer is formed at an inner wall of each of the hollow fibers to filter airborne molecular contamination (AMC) having a selected size.

Abstract: A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

Abstract: A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

Abstract: A method of monitoring a semiconductor fabrication facility and a semiconductor fabrication facility are provided. The method includes collecting an ambient air in a clean room through a plurality of gas lines with their gas inlets arranged at a plurality of sampling positions in the clean room. The method also includes measuring a parameter of the ambient air by a plurality of metrology devices which are connected to the gas lines. At least two of the sampling positions are measured simultaneously. The method further includes issuing a warning when the parameter detected by the metrology devices is outside a range of acceptable values.

Abstract: A method for fast starting up a television display function and a television system are provided. In the method, when a television device is powered on, the television system operated in the television device performs a hardware initialization and a fast start-up procedure. In the fast start-up procedure, a set of picture-quality parameters is loaded to the television system from a storage circuit. Display parameters of the television device are configured according to the picture-quality parameters, accordingly, a display of the television device starts to display a picture. The picture can be produced from image signals received through an external source such as a high-definition multimedia interface (HDMI) or a Display Port, a type-C interface, or other sources of the television device. The picture-quality parameters are collected and stored in the storage circuit during operation of the television system after the operating system booting procedure is completed.

Abstract: A method of monitoring a semiconductor fabrication facility and a semiconductor fabrication facility are provided. The method includes collecting an ambient air in a clean room through a plurality of gas lines with their gas inlets arranged at a plurality of sampling positions in the clean room. The method also includes measuring a parameter of the ambient air by a plurality of metrology devices which are connected to the gas lines. At least two of the sampling positions are measured simultaneously. The method further includes issuing a warning when the parameter detected by the metrology devices is outside a range of acceptable values.

Abstract: Systems and methods for removing impurities from exhaust gases produced by semiconductor processing tools, e.g., such as a wet bench, utilize cooled scrubbing fluids and non-random structured packing materials to achieve and enhance removal of acid or alkaline components in the exhaust gas along with an enhanced removal of volatile organic components in the exhaust gas. Removal efficiencies of the acid or alkaline components of greater than 90% and removal efficiencies of the volatile organic components of greater than 70% are described.

Abstract: A method of monitoring a semiconductor fabrication facility and a semiconductor fabrication facility are provided. The method includes collecting an ambient air in a clean room through a plurality of gas lines with their gas inlets arranged at a plurality of sampling positions in the clean room. The method also includes measuring a parameter of the ambient air by a plurality of metrology devices which are connected to the gas lines. At least two of the sampling positions are measured simultaneously. The method further includes issuing a warning when the parameter detected by the metrology devices is outside a range of acceptable values.

Abstract: A semiconductor fabrication building is provided. The semiconductor fabrication building includes an ambient control surrounding and a makeup air handling unit configured to supply clean air to the ambient control surrounding. The makeup air handling unit includes a housing having an air inlet and an air outlet. The makeup air handling unit also includes a first filtration module positioned in the housing. The first filtration module includes a number of hollow fibers configured to guide air to flow from the air inlet to the air outlet. A porous layer is formed at an inner wall of each of the hollow fibers to filter airborne molecular contamination (AMC) having a selected size.

Abstract: A system includes a semiconductor apparatus configured to process a workpiece, a mist generator configured to generate a mist and a particle separator configured to receive an exhaust gas generated by the semiconductor apparatus. The particle separator includes a first fan, wherein the first fan includes a plurality of blades. Each of the plurality of blades includes holes allowing the exhaust gas and the mist to pass through.

Abstract: A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

Abstract: A method includes: generating a contaminant distribution map by sampling an environment of a cleanroom; selecting a first fabrication tool of the cleanroom by comparing the contaminant distribution map with at least one diffusion image in a first database; comparing parameters of the first fabrication tool against process utility information in a second database; and when the parameters are consistent with the process utility information, taking at least one action. The one action may include moving a cleaning tool to a location associated with a contaminant concentration of the contaminant distribution map; turning on a fan of the cleaning tool; stopping pod transit to the first fabrication tool; or halting production by the first fabrication tool.

Abstract: The present disclosure provides a method for securely updating firmware components, which is used in connection with an electronic device including a universal serial bus human interface device interface. The method includes: downloading a deformed patch executable file by the electronic device, wherein the deformed patch executable file is deformed from a patch executable file including a plurality of binary files, and each of the binary files is configured with an address reference label; and executing the deformed patch executable file and verifying whether a digital signature of the deformed patch executable file is authorized or not. If the digital signature of the deformed patch executable file is authorized, providing an update tool for updating the corresponding firmware component. If the digital signature of the deformed patch executable file is not authorized, prompting that the digital signature is unauthorized.

Abstract: The present disclosure provides a method for securely updating firmware components, which is used in connection with an electronic device including a universal serial bus human interface device interface. The method includes: downloading a deformed patch executable file by the electronic device, wherein the deformed patch executable file is deformed from a patch executable file including a plurality of binary files, and each of the binary files is configured with an address reference label; and executing the deformed patch executable file and verifying whether a digital signature of the deformed patch executable file is authorized or not. If the digital signature of the deformed patch executable file is authorized, providing an update tool for updating the corresponding firmware component. If the digital signature of the deformed patch executable file is not authorized, prompting that the digital signature is unauthorized.

Abstract: A docking device operates in an active mode or a passive mode. The docking device includes a path control module, a processing module and a switch. The processing module is connected to the switch, and the switch is connected between the path control module and the processing module. The path control module is configured to receive a signal from a host device. When the path control module does not receive the signal from the host device, the docking device operates in the active mode, and the processing module is connected to a plurality of function modules through the switch. When the path control module receives the signal from the host device, the docking device operates in the passive mode, and the path control module is connected to the function modules through the switch.

Abstract: A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross.

Abstract: A board includes a first magnetic conductive plate and a second magnetic conductive plate. The first magnetic conductive plate has a first magnetic conductive direction. The second magnetic conductive plate overlaps with the first magnetic conductive plate. The second magnetic conductive plate has a second magnetic conductive direction. The first magnetic conductive direction and the second magnetic conductive direction cross.

Abstract: Disclosed is a USB docking station and a control method thereof. The USB docking station comprises a micro controller, a first signal multiplexer and a second signal multiplexer, a video signal processor, and a video signal converter. The first signal multiplexer chooses and outputs a first video signal from a first data signal output from a first electronic device. The second signal multiplexer chooses and outputs a second video signal from a second data signal output from a second electronic device. According to a first control signal from the first electronic device or a second control signal from the second electronic device, the micro controller controls the video signal processor to process the first video signal or the second video signal. The video signal converter converts the processed first video signal or the processed second video signal to a video output signal for displaying.