Patents by Inventor Chih Mou Huang

Chih Mou Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit structure and method of forming the same
    Patent number: 8736015
    Abstract: An embodiment is an integrated circuit (IC) structure. The structure comprises a deep n well in a substrate, a first pickup device in the deep n well, a first signal device in the deep n well, a dissipation device in the substrate, a second signal device in the substrate, a first electrical path between the first pickup device and the dissipation device, and a second electrical path between the first signal device and the second signal device. The dissipation device is outside of the deep n well, and the second signal device is outside of the deep n well. A highest point of the first electrical path is lower than a highest point of the second electrical path.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: May 27, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Jen Tsai, Chih-Fu Chang, Chih-Kang Chuang, Yee-Ren Wuang, David Yen, Yuan-Jen Liao, Shih-Che Fang, Hung-Che Hsueh, Chih Mou Huang
  • Integrated Circuit Structure and Method of Forming the Same
    Publication number: 20130075856
    Abstract: An embodiment is an integrated circuit (IC) structure. The structure comprises a deep n well in a substrate, a first pickup device in the deep n well, a first signal device in the deep n well, a dissipation device in the substrate, a second signal device in the substrate, a first electrical path between the first pickup device and the dissipation device, and a second electrical path between the first signal device and the second signal device. The dissipation device is outside of the deep n well, and the second signal device is outside of the deep n well. A highest point of the first electrical path is lower than a highest point of the second electrical path.
    Type: Application
    Filed: September 27, 2011
    Publication date: March 28, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Jen Tsai, Chih-Fu Chang, Chih-Kang Chuang, Yee-Ren Wuang, David Yen, Yuan-Jen Liao, Shih-Che Fang, Hung-Che Hsueh, Chih Mou Huang