Patents by Inventor Chih Pan Wei

Chih Pan Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solders
    Publication number: 20030007886
    Abstract: A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
    Type: Application
    Filed: August 17, 2001
    Publication date: January 9, 2003
    Applicant: Quantum Chemical Technologies ( Singapore) Pte Ltd.
    Inventors: Chew Kai Hwa, Chih Pan Wei