Abstract: A SRAM device includes a substrate, at least one two-transistor static random access memory (2T-SRAM), an inner dielectric layer, a plurality of contacts, an inter-layer dielectric (ILD) layer, a plurality of vias, and a conductive line. The 2T-SRAM is disposed on the substrate, the inner dielectric layer covers the 2T-SRAM, and the contacts are disposed in the inner dielectric layer and coupled to the 2T-SRAM. The ILD layer covers the inner dielectric layer and the contacts, and the vias are disposed in the ILD layer and respectively coupled to the 2T-SRAM trough the corresponding contacts. The conductive line is disposed on the ILD layer and connects with the plurality of vias, wherein the thickness of the conductive line is less than or equal to one-tenth of the thickness of the via such that it can significantly reduce the coupling effect compared with the traditional bit line.

Abstract: A SRAM device includes a substrate, at least one two-transistor static random access memory (2T-SRAM), an inner dielectric layer, a plurality of contacts, an inter-layer dielectric (ILD) layer, a plurality of vias, and a conductive line. The 2T-SRAM is disposed on the substrate, the inner dielectric layer covers the 2T-SRAM, and the contacts are disposed in the inner dielectric layer and coupled to the 2T-SRAM. The ILD layer covers the inner dielectric layer and the contacts, and the vias are disposed in the ILD layer and respectively coupled to the 2T-SRAM trough the corresponding contacts. The conductive line is disposed on the ILD layer and connects with the plurality of vias, wherein the thickness of the conductive line is less than or equal to one-tenth of the thickness of the via such that it can significantly reduce the coupling effect compared with the traditional bit line.

Abstract: A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided.

Abstract: An exemplary heat pipe includes a tube, a first wick structure and a second wick structure received in the tube, and working liquid filling the tube. The first wick structure is disposed in an evaporating section of the tube. The second wick structure is located between the first wick structure, and supports the first wick structure partially contacting an inner face of the evaporating section of the tube. The first wick structure defines a gap between two opposite ends thereof. The second wick structure extends from the evaporating section through an adiabatic section to a condensing section of the tube.

Abstract: A thermal module adapted for dissipating heat of an electronic component includes a heat pipe; and two mounting flakes mounted on the heat pipe. The mounting flakes are configured for mounting the thermal module on a circuit board on which the electronic component is mounted. Each of the mounting flakes is formed integrally as a single piece. The mounting flake includes a fixing body and two mounting arms formed at two opposite ends of the fixing body. The fixing body is directly bonded on the heat pipe. The mounting arms extend beyond the heat pipe and define through holes therein for extension of fasteners.

Abstract: An electronic device includes printed circuit board having an electronic component and a heat dissipation module mounted the printed circuit board. The heat dissipation module includes a base with a heat absorbing plate and two elastic pieces extending from the heat absorbing plate. The heat absorbing plate thermally engages on the electronic component. The elastic pieces are fixed on the printed circuit board. The base is made of one of copper-nickel-silicon alloy, beryllium copper, a titanium copper or phosphor bronze.

Abstract: An exemplary heat dissipation device includes a conductive plate and a fastener. The fastener includes a fastening element and a spring coiled around the fastening element. The fastening element includes a pole portion, a head portion, and an engaging portion. The conductive plate has a through hole defined therein. An inner face defining the through hole includes a first face and a second face which have different curvatures. A flange protrudes from a circumference of the pole portion adjacent to the engaging portion. The structure of the flange matches the configuration of the through hole. After the flange extends through the through hole from a side of the conductive plate, the flange is rotated an angle and buckled at another opposite side of the conductive plate. The spring is compressed between the head portion and the conductive plate.

Abstract: A heat dissipating apparatus includes a centrifugal fan, a heat sink and a heat pipe. The centrifugal fan includes a frame and an air outlet defined on the frame. The heat sink is arranged adjacent to the air outlet of the centrifugal fan. The heat pipe includes an evaporation section and a condensation section extending from the evaporation section. The condensation section is connected to the heat sink. The evaporation section is for absorbing heat from a first and second heat generating component. The frame includes an elastic plate abutting to the evaporation section of the heat pipe and applying a force to the evaporation section of the heat pipe. An electronic device equipped with the heat dissipating apparatus is also provided.

Abstract: A clip device includes a clip module and a workpiece. The clip module includes a screw and a spring. The screw includes a screw head and a screw rod extends from the screw head. The spring includes a bent portion. The spring is placed around the screw rod, and the bent portion is away from the screw head. The workpiece includes a through hole corresponding to the screw rod and a receiving portion. The bent portion of the spring is engaged in the receiving portion. The screw rod extends through the through hole to fix the workpiece on a predetermined position.

Abstract: A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing member (52), a plurality of tube members (53) being in fluid communication with the housing member, and a fin member (54) maintained in thermal contact with the tube members. The vapor conduit and the liquid conduit are each connected between the evaporator and the condenser. The vapor conduit conveys the vapor generated in the evaporator to the tube members of the condenser. The vapor turns into condensate in the tube members upon releasing the heat to the fin member. The condensate is conveyed back to the evaporator by the liquid conduit.

Abstract: A heat exchange module (1) includes a fan duct, an evaporator (22), a condenser (26) and an electric fan (50). The fan duct includes a lower portion (10) and an upper portion (30). The lower portion cooperates with the upper portion to define therebetween an air passage (90). The evaporator contains therein a working fluid. The condenser is in fluid communication with the evaporator. The evaporator and the condenser are received in the air passage defined by the fan duct. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component (70) and the vapor turns into condensate upon releasing the heat to the condenser. The electric fan is attached to the fan duct. The electric fan produces an airflow flowing through the air passage for removing the heat away from the condenser.

Abstract: A rotary total heat exchange apparatus includes at least an air-providing member, a first air passage and a second air passage, a sensible heat exchanger (21), and a total heat exchange wheel (1). The air-providing member provides a first airflow from outdoors and a second airflow from indoors into the rotary total heat exchange apparatus. The first and second air passages isolate from each other for guiding the first and second airflows respectively passing through. The sensible heat exchanger spans across the first and second air passages simultaneously for conducting a sensible heat exchange between the first and second airflows. The total heat exchange wheel is capable of rotating through the first and second air passages for conducting a total heat exchange between the first and second airflows.

Abstract: A spreading device (10) includes an injector (14) and a spreading tube (16) connected with the injector. The injector contains therein a viscous thermal medium material for being spread on a surface of a cooling device for electronic components. The spreading tube defines therein at least one outlet hole (164) for release of the thermal medium material contained in the injector. The spreading device further includes means formed on the spreading tube for evenly distributing the material released through the outlet hole of the spreading tube over an entire area of the surface to be applied with the thermal medium material.

Abstract: A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator contains therein a working fluid. The working fluid in the evaporator evaporates into vapor after absorbing heat, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The condenser defines therein a chamber, and a plurality of heat-exchange pins is provided inside the chamber for effectively exchanging heat with the vapor entering into the condenser.

Abstract: A liquid cooling system (100) for removing heat from a heat-generating component is disclosed. The liquid cooling system includes a heat-absorbing member (20), a heat-dissipating member (30), a pump (50) and a mounting mechanism (10, 60). The heat-absorbing member defines therein a fluid flow channel (26) for passage of a coolant. The pump is in fluid communication with the heat-absorbing member and the heat-dissipating member for driving the coolant to circulate between the heat-absorbing member and the heat-dissipating member. The mounting mechanism includes a bottom portion (10) and a top portion (60) cooperating with the bottom portion to define therebetween a receiving space. The heat-absorbing member, heat-dissipating member and pump are received in the receiving space and are mounted to the mounting mechanism.

Abstract: A cooling device for multiple heat generating components is disclosed, which includes an evaporator (1), a condenser (3), a vapor conduit (6), a liquid conduit (5) and a diffluent member (19). The evaporator includes at least two cooling members (15) for thermally contacting the multiple heat-generating components, respectively. Each of the cooling members defines therein a fluid flow channel (22) for passage of a refrigerant fluid. The vapor and liquid conduits each are connected between the cooling member and the condenser. The diffluent member is in fluid communication with the liquid conduit and the fluid flow channel of each of the cooling members. The diffluent member functions to evenly distribute the refrigerant fluid into the cooling members so as to maintain the same heat removal capacity for the cooling members.

Abstract: A mounting assembly (30) for mounting an evaporator (21) of a refrigeration system (20) to an electronic component (10) includes a housing member (31) and a clamping member (32). The housing member defines a through hole (33) with the electronic component located therein. The evaporator is received in the through hole and located in axial alignment with the electronic component. The evaporator defines therein a fluid flow channel (25) for passage of a refrigerant fluid. The refrigeration system is in fluid communication with the fluid flow channel of the evaporator to supply refrigerant fluid thereto. The clamping member is attached to the housing member and has an abutting portion (84) integrally formed therefrom for exerting an uniform force to the evaporator to maintain the evaporator in thermal contact with the electronic component.

Abstract: A heat exchange module (1) includes a fan duct, an evaporator (22), a condenser (26) and an electric fan (50). The fan duct includes a lower portion (10) and an upper portion (30). The lower portion cooperates with the upper portion to define therebetween an air passage (90). The evaporator contains therein a working fluid. The condenser is in fluid communication with the evaporator. The evaporator and the condenser are received in the air passage defined by the fan duct. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component (70) and the vapor turns into condensate upon releasing the heat to the condenser. The electric fan is attached to the fan duct. The electric fan produces an airflow flowing through the air passage for removing the heat away from the condenser.

Abstract: A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator contains therein a working fluid. The working fluid in the evaporator evaporates into vapor after absorbing heat, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The condenser defines therein a chamber, and a plurality of heat-exchange pins is provided inside the chamber for effectively exchanging heat with the vapor entering into the condenser.

Abstract: A loop-type heat exchange device (10) includes an evaporator (20), a vapor conduit (30), a condenser (50) and a liquid conduit (70). The evaporator contains therein a working fluid. The working fluid turns into vapor in the evaporator upon receiving heat from a heat-generating component. The condenser includes a housing member (52), a plurality of tube members (53) being in fluid communication with the housing member, and a fin member (54) maintained in thermal contact with the tube members. The vapor conduit and the liquid conduit are each connected between the evaporator and the condenser. The vapor conduit conveys the vapor generated in the evaporator to the tube members of the condenser. The vapor turns into condensate in the tube members upon releasing the heat to the fin member. The condensate is conveyed back to the evaporator by the liquid conduit.