Patents by Inventor Chih-Pin Lin

Chih-Pin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147718
    Abstract: Some embodiments of the present application are directed towards an integrated circuit (IC). The integrated circuit includes a semiconductor substrate including a logic region and a memory cell region. A logic device is arranged on the logic region. A memory device is arranged on the memory cell region. An isolation structure extends into a top surface of the semiconductor substrate, and laterally separates the logic region from the memory cell region. The isolation structure includes dielectric material and has an uppermost surface and a slanted upper surface extending from the uppermost surface to an edge of the isolation structure proximate to memory cell region.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 2, 2024
    Inventors: Meng-Han Lin, Chih-Ren Hsieh, Chen-Chin Liu, Chih-Pin Huang
  • Patent number: 11972562
    Abstract: A method for determining a plant growth curve includes obtaining color images and depth images of a plant to be detected at different time points, performing alignment processing on each color image and each depth image to obtain an alignment image, detecting the color image through a pre-trained target detection model to obtain a target bounding box, calculating an area ratio of the target bounding box in the color image, determining a depth value of all pixel points in the target boundary frame according to the aligned image, performing denoising processing on each depth value to obtain a target depth value, generating a first growth curve of the plant to be detected according to the target depth values and corresponding time points, and generating a second growth curve of the plant to be detected according to the area ratios and the corresponding time points.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: April 30, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chih-Te Lu, Chin-Pin Kuo, Tzu-Chen Lin
  • Patent number: 11954875
    Abstract: A method for determining a height of a plant, an electronic device, and a storage medium are disclosed. In the method, a target image is obtained by mapping an obtained color image with an obtained depth image. The electronic device processes the color image by using a pre-trained mobilenet-ssd network, obtains a detection box appearance of the plant, and extracts target contours of the plant to be detected from the detection box. The electronic device determines a depth value of each of pixel points in the target contour according to the target image. Target depth values are obtained by performing a de-noising on depth values of the pixel points, and a height of the plant to be detected is determined according to the target depth value. The method improves accuracy of height determination of a plant.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: April 9, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Tzu-Chen Lin, Chih-Te Lu, Chin-Pin Kuo
  • Publication number: 20240113061
    Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Chi-Han CHEN, Chang-Yu LIN, Jr-Wei LIN, Chih-Pin HUNG
  • Publication number: 20240105521
    Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate having a base, a first fin, and a second fin over the base. The method includes forming a first trench in the base and between the first fin and the second fin. The method includes forming an isolation layer over the base and in the first trench. The first fin and the second fin are partially in the isolation layer. The method includes forming a first gate stack over the first fin and the isolation layer. The method includes forming a second gate stack over the second fin and the isolation layer. The method includes removing a bottom portion of the base. The isolation layer passes through the base after the bottom portion of the base is removed.
    Type: Application
    Filed: February 9, 2023
    Publication date: March 28, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Da-Zhi ZHANG, Chung-Pin HUANG, Po-Nien CHEN, Hsiao-Han LIU, Jhon-Jhy LIAW, Chih-Yung LIN
  • Patent number: 11923310
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Hsien-Pin Hu, Wen-Hsin Wei
  • Publication number: 20200095779
    Abstract: A substrate and a raised floor formed by using the same; the substrate is provided on a support stand and can be used to mount at least one plate thereon, and the substrate has at least one first region and at least one second region thereon. The first region has a shape of a long strip, the second region and the first region are adjacently provided along a first direction, and the second region forms a misalignment with the first region along a second direction perpendicular to the first direction, such that the first region and the second region form a segment difference in the second direction; when a plurality of substrates are adjacently arranged, the plate is enabled to form mutually crossed patterns on the substrate.
    Type: Application
    Filed: June 27, 2019
    Publication date: March 26, 2020
    Inventor: Chih-Pin LIN
  • Patent number: 9827814
    Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: November 28, 2017
    Assignee: ICHIA TECHNOLOGIES, INC.
    Inventors: Chih-Hao Hsu, Chung-Hsin Yang, Chih-Pin Lin, Shih-Fu Yu, Wei-Tsen Yen
  • Publication number: 20170297386
    Abstract: A carrier module of a tire pressure monitoring device includes a plastic carrier and a metallic tube. The plastic carrier has a trough and a tube extended from a bottom portion of the trough. The trough has an airflow channel penetratingly formed on the bottom portion thereof, and the trough is in air communication with the tube by the airflow channel The metallic tube is seamlessly formed on an inner surface of the tube of the plastic carrier. The metallic tube has an inner screw thread formed on an inner surface thereof for detachably screwing to a nozzle of a tire. Thus, by seamlessly forming the metallic tube on the inner surface of the tube of the plastic carrier, the tire pressure monitoring device of the instant disclosure has a better airproof effect and a longer service life.
    Type: Application
    Filed: April 18, 2016
    Publication date: October 19, 2017
    Inventors: CHIH-HAO HSU, CHUNG-HSIN YANG, CHIH-PIN LIN, SHIH-FU YU, WEI-TSEN YEN
  • Publication number: 20170013101
    Abstract: A waterproof housing without any screwing structure includes a top waterproof module, a waterproof gasket disposed on the top waterproof module, and a bottom waterproof module detachably combined with the top waterproof module. The top waterproof module has a top case, a transparent plate, and a resilient film. The top case has a touch-control window and a fingerprint hole, the transparent plate is fixed on the inner surface of the top case and entirely shields the touch-control window, and the resilient film is fixed between the inner surface of the top case and the transparent plate to shield the fingerprint hole. When a smart phone is received in the waterproof housing, the resilient film can be pressed to trigger the fingerprint function of the smart phone. The top and bottom waterproof modules are combined with each other to compress the waterproof gasket.
    Type: Application
    Filed: July 7, 2015
    Publication date: January 12, 2017
    Inventors: MING-SHAN CHEN, SHIH-FU YU, CHIH-PIN LIN, CHIH-HAO HSU
  • Patent number: 9070895
    Abstract: There is provided an OLED package including a substrate, a lighting component, a compound barrier layer, a moisture absorption zone and an inorganic barrier layer. The lighting component is formed on the substrate. The compound barrier layer completely seals the lighting component configured to block moisture and oxygen. The moisture absorption zone is formed on the substrate surrounding the compound barrier layer and is not formed upon the lighting component. The inorganic barrier layer completely seals the compound barrier layer and the moisture absorption zone configured to block moisture and oxygen.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: June 30, 2015
    Assignee: Hannstar Display Corp.
    Inventor: Chih-Pin Lin
  • Publication number: 20150002787
    Abstract: A photovoltaic mobile device includes a backlight module and a liquid crystal display panel. The backlight module includes a plurality of light sources, a photovoltaic substrate, and a light guide plate. The light sources are disposed at a side of the light guide plate, and the light guide plate is disposed above the photovoltaic substrate. The liquid crystal display panel is disposed on the light guide plate. The photovoltaic substrate includes a plurality of strip type photovoltaic components.
    Type: Application
    Filed: February 5, 2014
    Publication date: January 1, 2015
    Applicant: HannStar Display Corporation
    Inventors: Chia-Shin WENG, Wei-Ren LO, Chao-Jung CHEN, Chien-Liang KUO, Chih-Pin LIN
  • Patent number: 8804076
    Abstract: The present invention provides a liquid crystal display device including a liquid crystal panel. The liquid crystal panel has a plurality of pixel regions, and the liquid crystal panel includes a first substrate, a second substrate, a liquid crystal layer, and a light-absorbing layer. The second substrate and the first substrate are disposed opposite to each other, and the liquid crystal layer is disposed between the first substrate and the second substrate. The light-absorbing layer is disposed between the first substrate and the second substrate in the pixel regions, and the light-absorbing layer is configured to absorb a light having a wavelength within a range between 380 nm and 560 nm.
    Type: Grant
    Filed: June 26, 2012
    Date of Patent: August 12, 2014
    Assignee: HannStar Display Corp.
    Inventors: Chih-Pin Lin, Chao-Hui Wu
  • Publication number: 20130240848
    Abstract: There is provided an OLED package including a substrate, a lighting component, a compound barrier layer, a moisture absorption zone and an inorganic barrier layer. The lighting component is formed on the substrate. The compound barrier layer completely seals the lighting component configured to block moisture and oxygen. The moisture absorption zone is formed on the substrate surrounding the compound barrier layer and is not formed upon the lighting component. The inorganic barrier layer completely seals the compound barrier layer and the moisture absorption zone configured to block moisture and oxygen.
    Type: Application
    Filed: February 19, 2013
    Publication date: September 19, 2013
    Applicant: HANNSTAR DISPLAY CORP.
    Inventor: CHIH-PIN LIN
  • Publication number: 20130063683
    Abstract: The present invention provides a liquid crystal display device including a liquid crystal panel. The liquid crystal panel has a plurality of pixel regions, and the liquid crystal panel includes a first substrate, a second substrate, a liquid crystal layer, and a light-absorbing layer. The second substrate and the first substrate are disposed opposite to each other, and the liquid crystal layer is disposed between the first substrate and the second substrate. The light-absorbing layer is disposed between the first substrate and the second substrate in the pixel regions, and the light-absorbing layer is configured to absorb a light having a wavelength within a range between 380 nm and 560 nm.
    Type: Application
    Filed: June 26, 2012
    Publication date: March 14, 2013
    Inventors: Chih-Pin Lin, Chao-Hui Wu