Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: A movement-orbit sensing system is provided for collecting movement-orbits of sensing points of an object under detection, which comprises sensors, a host a comparison unit, and a determination unit. The sensors are used for outputting sensed signals and multi-dimensional coordinate value. The host comprises units for generating a multi-dimensional coordinate signal and sensed values, and a movement-obit architecture unit is used for architecting the movement-orbit of each sensing point according to the multi-dimensional coordinate signal and sensed values. The comparison unit is used for comparing the movement-orbit of the object under detection with a standard movement-orbit information, thereby obtaining an offset value. The determination unit is used for determining whether the offset value is greater than a preset value. If the offset value is greater than the preset value, the movement-orbit of at least one of the sensing points is determined to be erroneous.

Abstract: A retaining structure and a server structure having the same are provided herein. The retaining structure is used for retaining a circuit board on a chassis in the server structure. The circuit board includes a first connection portion and a second connection portion for respectively mating with a first connector and a second connector. The retaining structure includes a plurality of side walls commonly defining a channel for accommodating a region of the circuit board, a backstop section located within the channel and abutting against a protrusion of the circuit board for buffering a mating force applied from the second connection portion to the first connection portion, and a damping snapper located on one of said side was for damping the retaining structure to the chassis.

Abstract: A 3D model component comparing system and method thereof are provided. The 3D model component comparing system includes a model-capturing unit, a processing unit, and a message-prompting unit. The model-capturing unit obtains a first model and a second model in a model design interface. The processing unit compares a plurality of components of the first model and a plurality of components of the second model to obtain a plurality of components which have different names, and analyzes them to determine whether the plurality of components which have different names have identical component data correspondingly or not. The message-prompting unit outputs a renaming prompting message if the plurality of components, which have different names, have identical component data correspondingly. Thus the design error rate is reduced.

Abstract: A movement-trace sensing system is disclosed which is applied on an object under detection with a plurality of sensing points. The sensing system comprises a plurality of sensors and a host. The sensors are used to respectively sense the movement of the sensing points to generate a plurality of corresponding multi-dimensional coordinate values. The host comprises a sensing unit, a mensuration database, a selecting unit, a pattern constructing unit, a calculating unit, and a dynamic-pattern database. The calculating unit derives movement traces of the sensing points under at least one of dynamic-movement modes according to a specific second static pattern dedicated to the object under detection and multi-dimensional messages corresponding to the sensing points, and further generates a specific mobile pattern corresponding to the object.

Abstract: A programmable CAD system suited for preventing interference between components and a chassis, and a method thereof are provided. The method comprises the following steps of: automatically obtaining a protruding length of a pin tail of a component outwardly protruded from a circuit board, by a first arithmetic unit; obtaining a distance, between a chassis and a surface of the circuit board corresponding to a location where the component is disposed, from a component information unit, obtaining an interference value according to the protruding length and the distance, by a second arithmetic unit; and determining whether the interference value is greater than zero, by a determine unit. If the interference value is greater than zero, the component is determined to be interfering with the chassis; and if not, the component is determined not to be interfering with the chassis.

Abstract: A 3D model component comparing system and method thereof are provided. The 3D model component comparing system includes a model-capturing unit, a processing unit, and a message-prompting unit. The model-capturing unit obtains a first model and a second model in a model design interface. The processing unit determines whether a plurality of component data of a plurality of components in components, which have the same component names, between the first model and the second model are all accordingly identical. The message-prompting unit outputs a renaming prompting message if the plurality of component data of the plurality of components in the components which have the same component names between the first model and the second model are not all accordingly identical. Thus design error rate is reduced.

Abstract: A 3D model component comparing system and method thereof are provided. The 3D model component comparing system includes a capturing unit, a setting unit, a processing unit and a prompting unit. The capturing unit acquires a first model and a second model. The setting unit sets a 3D absolute coordinate into the first model and the second model. The processing unit compares a plurality of components between the first model and the second model in the 3D absolute coordinate and determines whether coordinate values of the plurality of components which have the same component names between the first model and the second model are not identical. The prompting unit outputs a prompting message if the coordinate values of the plurality of components, which have the same component names, between the first model and the second model are not identical. Thus design error rate is reduced.

Abstract: A method for verifying design changes of components based on a CAD platform is utilized to graphically show differences between previous and current versions of a 3D component. The method includes the following steps performed by a computer: sequentially comparing a plurality of design features of the previous and current versions of the 3D component; distinguishing a feature difference and showing it in a list on a page; altering a filename of the previous version; assembling the 3D component of the previous version whose filename is altered and the 3D component of the current versions in a single assembly to form a 3D drawing; and generating a link corresponding to the feature difference, so that the corresponding feature can be displayed on the 3D drawing when clicking on the feature difference on the page. A CAD system is also provided.

Abstract: A method for detecting interference in spatial structure is provided. The method includes the following steps. A circuit board is obtained, wherein the circuit board has set a first height limit, and parts of the coordinate areas have set a plurality of second height limits respectively. The second height limits are lower than the first height limit. A Keep-out area is established according to the second height limits of the coordinate areas and the first height limit. The corresponding height of each coordinate area in a substrate-boarded space is compared according to the keep-out area to simulate and determine whether the circuit board is interfered in the substrate-boarded space. Thus, users can immediately check whether interference or clashed in space occurs between the circuit board and the substrate-boarded space.

Abstract: A method and a system for checking a bill of material (BOM) are provided. Firstly, a transforming unit transforms an initial configuration list of a product into a BOM. Next, a model number corresponding to the product is chosen from an input unit. Then, the product is pictorialized by a pictorializing unit according to the model number and the BOM to generate and display a virtual machine of the product on a display unit. Lastly, the displayed virtual machine provides users to determine that the BOM is correct or not.

Abstract: A component data collecting system and method applicable to a process of collecting product required component data that comply with approved regulation. The system includes a verifying module, a collecting module, a database, an examining module, a system integrating unit and a management unit. The verifying module verifies the identity of a component supplier. After verification, the component supplier inputs component data through the collecting module and the component data is temporarily stored in a data register. An examining module determines whether the component data comply with the required regulation by comparing it with predetermined examination standard.