Patents by Inventor Chih-Pin Yao

Chih-Pin Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150107869
    Abstract: A block for electrical bonding and grounding made by punching and bending a metal sheet is provided. The block for electrical bonding and grounding has a fixing section formed on its bottom end and a connecting section formed uprightly on one side of the fixing section. The fixing section has a ground portion formed thereon by bending a cut portion into a U-shape portion, and the ground portion has a ground wire passage for passing through of a ground wire. The ground wire passage has a shrunk neck portion provided for limiting the ground wire. A threaded hole is provided correspondingly such that a fastening screw can be threaded through the threaded hole to clamp the ground wire securely in position. The overall manufacturing process is easier, more convenient and quicker so that the overall cost is lowered.
    Type: Application
    Filed: October 23, 2014
    Publication date: April 23, 2015
    Inventors: CHIH-PIN YAO, CHUN-YI LI, WEN-LIANG TU, CHIH-CHUNG YANG
  • Patent number: 7749026
    Abstract: This invention relates to an isolator. Primarily, an insulation cover is inserted by a connector being disposed with a plug-in unit. At least one iron core is disposed around a tube at the other end of a connector. A front cover is connected with a fixing seat having a first space and a second space in which first and second ring capacitors are respectively received. An insulation sleeve is arranged between the first and second ring capacitors. One end of each ring capacitor is disposed with a circular spring correspondingly. The other end of the fixing seat is connected to an outer tube, the outer end of which is arranged with a terminal portion with a plug-in unit mounted therein. Thereby the simplified structure of the isolator with an isolated ground effect improves the impedance matching and has properties of better bandwidth flatness, lower insertion loss, and better return loss.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: July 6, 2010
    Assignee: Soontai Tech Co., Ltd.
    Inventors: Chun-Yi Li, Chih-Pin Yao
  • Publication number: 20090291591
    Abstract: A wave filter includes a shell, a wave filter circuit board in the shell, a cover secured over a holding room of the shell, and a grounding component interposed between the circuit board and the cover; the shell has several detainment gaps on an upper end of its surrounding wall; the circuit board has several grounding holes; the cover has several joining protrusions on its periphery, and is joined on the shell with the joining protrusions being tightly embedded in corresponding detainment gaps on the shell; the grounding component has several grounding terminals, which are embedded in corresponding grounding holes of the circuit board; the grounding component has several joining protrusions on a periphery, which are embedded in corresponding detainment gaps; thus, the circuit board will be directly grounded through the grounding component and the shell after assembly without applying solder between the circuit board and the shell.
    Type: Application
    Filed: May 20, 2008
    Publication date: November 26, 2009
    Inventors: Shun-Ho Chung, Chih-Pin Yao