Abstract: A method for fabricating an integrated circuit device is provided. The method includes depositing a first dielectric layer; depositing a second dielectric layer over the first dielectric layer; etching a trench opening in the second dielectric layer, wherein the trench opening exposes a first sidewall of the second dielectric layer and a second sidewall of the second dielectric layer, the first sidewall of the second dielectric layer extends substantially along a first direction, and the second sidewall of the second dielectric layer extends substantially along a second direction different from the first direction in a top view; forming a via etch stop layer on the first sidewall of the second dielectric layer, wherein the second sidewall of the second dielectric layer is free from coverage by the via etch stop layer; forming a conductive line in the trench opening; and forming a conductive via over the conductive line.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A functional testing device includes a substrate, an input/output module, a plurality of functional testing modules, a baseboard management control module and a power module. The input/output module is disposed on the substrate and configured to receive a test script. The plurality of functional testing modules are pluggably disposed on the substrate. The baseboard management control module is disposed on the substrate and connected to the input/output module and the plurality of functional testing modules, the baseboard management control module is configured to control the plurality of functional testing modules output a plurality of testing signals according to the test script. The power module is disposed on the substrate and configured to receive and transmit power to the plurality of functional testing modules and the baseboard management control module.

Abstract: A functional testing device includes a substrate, a plurality of connection ports, an input/output module, a main control module and a power module. The plurality of connection ports are disposed on the substrate. The input/output module is disposed on the substrate and configured to receive at least one test script. The main control module is disposed on the substrate and connected to the plurality of connection ports, the main control module is configured to output a plurality of testing signals to at least one of the plurality of connection ports according to the at least one test script. The power module is disposed on the substrate and configured to receive and transmit power to the main control module.

Abstract: A functional testing method, adapted to a device under test, includes, by a main control chip, performing: requesting a test script according to identification information of the device under test from a database server, wherein the test script comprises a plurality of testing items of different types, and testing the device under test according to the test script.

Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A non-contact motion detection method, a motion detection device and an emergency detection method are provided. The non-contact motion detection method includes: receiving a reflection signal from a field to obtain a raw data signal; determining that a first event occurs in the field according to an energy value of the raw data signal, and providing a first alarm; determining that a second event occurs in the field according to an energy distribution of the reflection signal; and in case of determining that the second event occurs, providing a second alarm corresponding to the second event according to the energy value of the raw data signal.

Abstract: A non-contact motion detection method, a motion detection device and an emergency detection method are provided. The non-contact motion detection method includes: receiving a reflection signal from a field to obtain a raw data signal; determining that a first event occurs in the field according to an energy value of the raw data signal, and providing a first alarm; determining that a second event occurs in the field according to an energy distribution of the reflection signal; and in case of determining that the second event occurs, providing a second alarm corresponding to the second event according to the energy value of the raw data signal.

Abstract: A tuner module including a first carrier, a tuner, a second carrier, a tuner connector, a digital modulator, a digital decoder, an analog decoder and a display unit is provided. The tuner is disposed on the first carrier for tuning the frequency to receive a source signal to generate a digital or an analog video signal. The tuner outputs the digital or the analog video signal via the tuner connector. The digital modulator receives the digital video signal via the tuner connector to output a transport stream. The digital decoder controls the display to display frames. The analog decoder receives an analog video signal via the tuner connector to generate a decoded signal. The display unit receives the decoded signal for controlling the display to display frames. The tuner connector, the digital modulator, the digital decoder, the analog decoder and the display unit are disposed on the second carrier.

Abstract: A turner module including a first carrier, a turner, a second carrier, a turner connector, a digital modulator, a digital decoder, an analog decoder and a display unit is provided. The turner is disposed on the first carrier for tuning the frequency to receive a source signal to generate a digital or an analog video signal. The turner outputs the digital or the analog video signal via the turner connector. The digital modulator receives the digital video signal via the turner connector to output a transport stream. The digital decoder controls the display to display frames. The analog decoder receives an analog video signal via the turner connector to generate a decoded signal. The display unit receives the decoded signal for controlling the display to display frames. The turner connector, the digital modulator, the digital decoder, the analog decoder and the display unit are disposed on the second carrier.

Abstract: Support structure for a projector. The projector includes an optical engine, a lens sleeve and a support structure. The lens sleeve has an end connected to the optical engine, like a cantilever beam. The support structure supports the lens sleeve in such a manner that the lens sleeve can be rotated.

Abstract: The present invention provides an optical system. The optical system includes a first optical apparatus, a second optical apparatus, and a thrust member. A side of the first optical apparatus has a rest. The second optical apparatus is disposed between the first optical apparatus and the thrust member. With the optical system, the second optical apparatus is pressed against the rest by means of the force of the thrust member to keep the relative position between the first optical apparatus and the second optical apparatus stable.

Abstract: The present invention provides an optical system. The optical system includes a first optical apparatus, a second optical apparatus, and a thrust member. A side of the first optical apparatus has a rest. The second optical apparatus is disposed between the first optical apparatus and the thrust member. With the optical system, the second optical apparatus is pressed against the rest by means of the force of the thrust member to keep the relative position between the first optical apparatus and the second optical apparatus stable.

Abstract: Support structure for a projector. The projector includes an optical engine, a lens sleeve and a support structure. The lens sleeve has an end connected to the optical engine, like a cantilever beam. The support structure supports the lens sleeve in such a manner that the lens sleeve can be rotated.