Abstract: A heat dissipation device includes a heat sink, a centrifugal fan, and a fixing member. The centrifugal fan is enclosed and attached to a heat sink by a fixing member. Air sucked into the centrifugal fan takes away from the heat sink the accumulated heat from an electrical component of an electronic device.

Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.

Abstract: A transformable computing device has a detachable first part with a main central processing unit (CPU), a second part having an display and a secondary CPU, and a detachable third part having a graphical processing unit (GPU). The main CPU can work with the secondary CPU via parallel processing means when the first part is connected to the second part; and the display of the second part can run on the GPU when the third part is connected to the second part.

Abstract: An air duct mounted to a fan having an end board includes a top board which defines an opening, through which the fan is extended. Two opposite blocking members extend up from the top board at opposite first sides of the opening. Two opposite limiting members extend up from the top board at opposite second sides of the opening. Each blocking member includes a tab to block a top of the end board of the fan. Each limiting member includes a projection to abut a bottom of the end board of the fan.

Abstract: A heat dissipation module includes a heat sink. A plurality of grooves are defined in a bottom surface of the heat sink, a heat pipe is accommodated in each groove of the heat sink, and a heat conducting pad made of phase change material is adhered to the bottom surface of the heat sink to cover the grooves and the heat pipes. The heat conducting pad is a solid material at an ambient room temperature. When heated to a temperature higher than a transition temperature of the heat conducting pad, the heat conducting pad softens to fill spaces between the heat conducting pad, the heat sink, and the heat pipes.

Abstract: The present invention relates to a electronic device carrier comprising: a fixed part, set the side of the bed or the seat of transport; and a carring part, configured with one or several fixed components or notches, could be fixed on the door or fixed on the transport by said fixed part, and could be integrated with said fixed part. With above said design and structure, users could put the electronic device on the carrying part so that they could watch video and visit the internet while they are on the bed or in the car, get the better using of the time and space.

Abstract: A phase adjusting system includes a controlled element, a multi-phase pulse-width modulation (PWM) controller comprising default and non-default phases, and a microprogrammed control unit (MCU). The PWM controller provides phases to the controlled element. The MCU is connected to the controlled element via the multi-phase PWM controller. The MCU detects the work voltage level of the controlled element and controls the multi-phase PWM controller to provide a corresponding number of phases to the controlled element. The MCU determines whether work time of the default phases of the multi-phase PWM controller is greater than a predetermined value in response to the MCU being initialized. The default phases are changed to non-default phases and a corresponding number of the plurality of non-default phases are changed to default phases in response to the work time of the plurality of default phases of the multi-phase PWM controller being greater than the predetermined value.

Abstract: A motherboard includes a mounting area, a plurality of first mounting holes, and a plurality of second mounting holes. The mounting area is configured to support an electronic component. The plurality of first mounting holes is defined in the motherboard around the mounting area to bound a first area, and configured to mount a first type of fan. The plurality of second mounting holes is defined in the motherboard around the mounting area to bound a second area, and configured to mount a second type of fan. The first and second areas are concentric with the mounting area, and each of the plurality of second mounting holes is located adjacent to a corresponding one of the plurality of first mounting holes.

Abstract: A motherboard includes a mounting area, a number of first mounting holes, and a plurality of second mounting holes. The mounting area is configured to support an electronic component. The first mounting holes are configured to mate with a first fan. The second mounting holes are configured to mate with a second fan having a greater size than the first fan. The first and second mounting holes are located surrounding an exterior of the mounting area, a first distance between each of the first mounting holes and a center point of the mounting area is longer than a second distance between one of the second mounting holes and the center point of the mounting area. The first and second fans are configured to cool the electronic component.