Abstract: A method includes forming a dummy pattern over test region of a substrate; forming an interlayer dielectric (ILD) layer laterally surrounding the dummy pattern; removing the dummy pattern to form an opening; forming a dielectric layer in the opening; performing a first testing process on the dielectric layer; performing an annealing process to the dielectric layer; and performing a second testing process on the annealed dielectric layer.

Abstract: A projection device including a light source module, an optical engine module and a projection lens is provided. The optical engine module includes a casing, a heat-conducting base, a heat pipe, a light valve and a thermal conductive layer. The casing has an opening. The heat-conducting base has an assembly opening, wherein the heat-conducting base is disposed on the casing, and the assembly opening is aligned with the opening of the casing. The heat pipe is connected to the heat-conducting base and disposed on the heat-conducting base. The light valve is disposed on the heat-conducting base corresponding to the assembly opening. The light valve is thermally coupled to the heat-conducting base through the thermal conductive layer. The light valve has a first stepped surface and a second stepped surface, and the thermal conductive layer covers at least a part of the first stepped surface and the second stepped surface.

Abstract: Highly purified polyvinyl alcohol (PVA) which meets the standard of pharmaceutical grade is provided. The PVA has of less than 0.1 wt % of residual methanol, less than 0.1 wt % of residual methyl acetate, and less than 0.3 wt % of residual sodium acetate. A method for obtaining highly purified PVA is further provided.

Abstract: An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 ?m. Based on the total sum of the texture coefficients of a (111) surface, a (200) surface, a (220) surface and a (311) surface of the electrolytic copper foil, the sum of the texture coefficients of the (220) surface and the (311) surface of the electrolytic copper foil is greater than 60%.

Abstract: An electrolytic copper foil, which is particularly suitable for the application of a lithium ion secondary battery, has a shiny side and a matte side with a roughness of less than 2 ?m. Based on the total sum of the texture coefficients of a (111) surface, a (200) surface, a (220) surface and a (311) surface of the electrolytic copper foil, the sum of the texture coefficients of the (220) surface and the (311) surface of the electrolytic copper foil is greater than 60%.

Abstract: The present invention relates to a process for preparing nicotinic acid, which comprises directly subjecting a mixture of 3-methylpyridine, oxygen, and water to a vapor phase oxidation in the presence of a catalyst consisting of, as active ingredients, vanadium oxide (V2O5) and transition metal oxide both of which are supported on a carrier, to give the nicotinic acid, wherein crystal size of the active ingredients on the surface of the carrier is controlled in a range of from 40 to 200 nm through use of transition metal oxide. The present invention further relates to a catalyst used in the oxidation. In the method according to the present invention, the nicotinic acid can be obtained in a higher conversion and a higher selectivity. Therefore, the manufacturing cost can be reduced.

Abstract: A copper electroplating composition for integrated circuit interconnection is proposed, including a copper salt, an inorganic acid containing same anion as the copper salt, a suppressing agent and a polishing agent. This electroplating composition helps deposit copper into fine trenches with a high aspect ratio on a substrate, so as to form a surface-flat and void-free plated copper layer over the substrate by electroplating. It can therefore reduce the usage of polishing slurry and polishing time in a subsequent chemical mechanical polishing process, and also improve surface planarity of the copper later after being polished.