Abstract: An optical module includes a base body, a driving device, a phosphor disk. The base body includes a base and a support. The support has a first end portion and a second end portion opposite to each other, and the first end portion is connected to the base. The driving device is disposed at the second end portion of the support. The phosphor disk is connected to the driving device, and the driving device is suitable for driving the phosphor disk to rotate. The heat conduction structure is disposed on the support.

Abstract: A projection device including a light source module, an optical engine module and a projection lens is provided. The optical engine module includes a casing, a heat-conducting base, a heat pipe, a light valve and a thermal conductive layer. The casing has an opening. The heat-conducting base has an assembly opening, wherein the heat-conducting base is disposed on the casing, and the assembly opening is aligned with the opening of the casing. The heat pipe is connected to the heat-conducting base and disposed on the heat-conducting base. The light valve is disposed on the heat-conducting base corresponding to the assembly opening. The light valve is thermally coupled to the heat-conducting base through the thermal conductive layer. The light valve has a first stepped surface and a second stepped surface, and the thermal conductive layer covers at least a part of the first stepped surface and the second stepped surface.

Abstract: A wavelength conversion element and a projector including the wavelength conversion element are provided, which have good heat dissipation performance. The wavelength conversion element includes a turntable, a wavelength conversion layer, and a porous structure. The turntable has a wavelength conversion region and a non-wavelength conversion region, and includes a central axis. The wavelength conversion layer is disposed in the wavelength conversion region of the turntable. The porous structure is disposed in the non-wavelength conversion region of the turntable, and a material of the porous structure includes foamed metal.

Abstract: A heat dissipation module of a projection device includes a heat generating component, a thermoelectric cooling chip, a heat insulating hollow body, a heating element and a control element. The thermoelectric cooling chip has opposite hot and cold ends. The cold end is connected to the heat generating component. The heat insulating hollow body has first and second openings communicating with each other. The thermoelectric cooling chip is disposed in and seals the first opening. The cold end is located in the heat insulating hollow body. The heat generating component is disposed in and seals the second opening. The heating element heats the heat insulating hollow body. The control component is electrically connected to the heating element and determines whether a temperature in the projection device reaches a dew point temperature and drives the heating element to heat the heat insulating hollow body accordingly. An anti-condensation method is also provided.

Abstract: A heat dissipation module for dissipating heat from a heat source of a projection apparatus includes a thermoelectric module, a heat dissipation member, an absorption material, a transmission member and an insulating material. The thermoelectric module is disposed between the heat source and the heat dissipation member and has a cold side and a hot side opposite to each other, where the cold side is for dissipating heat from the heat source, and the hot side contacts with the heat dissipation member. The transmission member has a connection end and an evaporation end, wherein the connection end connects with the absorption material. The insulating material covers the absorption material and the transmission member. A projection apparatus uses the heat dissipation module. The heat dissipation module and the projection apparatus can prevent possibility of condensed moisture flowing into the system to damage electronic devices, and therefore have higher structural reliability.

Abstract: A wavelength conversion module, including a substrate, a wavelength conversion member, and a fixing ring, is provided. The substrate has an annular groove. The wavelength conversion member is disposed in the annular groove of the substrate. The fixing ring is disposed on the substrate and is configured to press on an inner region and an outer region of the annular groove and a portion of the wavelength conversion member to expose another portion of the wavelength conversion member and fix the wavelength conversion member on the substrate. In addition, a projection device, applying the wavelength conversion module, is also provided. The wavelength conversion module of the present invention and the projection device applying the wavelength conversion module have better structural reliability and assembly flexibility.

Abstract: A wavelength conversion element and a projector including the wavelength conversion element are provided, which have good heat dissipation performance. The wavelength conversion element includes a turntable, a wavelength conversion layer, and a porous structure. The turntable has a wavelength conversion region and a non-wavelength conversion region, and includes a central axis. The wavelength conversion layer is disposed in the wavelength conversion region of the turntable. The porous structure is disposed in the non-wavelength conversion region of the turntable, and a material of the porous structure includes foamed metal.

Abstract: A projector comprises a casing, a projection lens module and a light emitting module. The casing comprises a first air inlet and an air outlet. The projection lens module is disposed in the casing and adjacent to the first air inlet. The light emitting module is disposed in the casing and adjacent to the air outlet. The casing comprises a rear cover. The rear cover comprises a second air inlet, the second air inlet corresponds to the light emitting module. A first airflow flows into the casing from the first air inlet to dissipate heat from the projection lens module and the light emitting module, and then flows out of the air outlet. A second airflow flows into the casing from the second air inlet to dissipate heat from the light emitting module, and then flows out of the air outlet.

Abstract: A heat dissipation structure including at least one heat dissipation fin set and at least one heat pipe is provided. The heat dissipation fin set includes at least two heat dissipation fins, each having a side edge and a positioning groove located at the side edge. The side edge of one heat dissipation fin is joined to the side edge of another heat dissipation fin. The positioning groove of one heat dissipation fin is aligned with the positioning groove of another heat dissipation fin to form a positioning perforation. The heat pipe is clamped between the heat dissipation fins and passes through the positioning perforation along an extension axis. On a cross section perpendicular to the extension axis, a cross-sectional width and a cross-sectional thickness of the heat pipe are respectively D1 and D2, where D1 is greater than or equal to D2. A projection device is also provided.

Abstract: A projector comprises a casing, a projection lens module and a light emitting module. The casing comprises a first air inlet and an air outlet. The projection lens module is disposed in the casing and adjacent to the first air inlet. The light emitting module is disposed in the casing and adjacent to the air outlet. The casing comprises a rear cover. The rear cover comprises a second air inlet, the second air inlet corresponds to the light emitting module. A first airflow flows into the casing from the first air inlet to dissipate heat from the projection lens module and the light emitting module, and then flows out of the air outlet. A second airflow flows into the casing from the second air inlet to dissipate heat from the light emitting module, and then flows out of the air outlet.

Abstract: The present invention is directed to a fabrication method of a semiconductor multilayer structure. By utilizing the indium-containing catalyst and/or gallium-containing catalyst, the aluminum migration can be enhanced to increase quality and flatness of the aluminum contained nitride buffer layer. Furthermore, the costs and energy consumption can be reduced too.

Abstract: The present invention is directed to a semiconductor multilayer structure and fabrication method thereof. A semiconductor multilayer structure comprises a silicon substrate, and a plurality of semiconductor layers, wherein at least one of the semiconductor layers is an aluminum contained nitride layer; and an indium-containing catalyst is utilized to enhance migration of aluminum in the aluminum contained nitride layer. A fabrication method is also disclosed here. By utilizing the indium-containing catalyst and/or gallium-containing catalyst, the aluminum migration can be enhanced to increase quality and flatness of the aluminum contained nitride buffer layer. Furthermore, the costs and energy consumption can be reduced too.

Abstract: The present invention provides a semiconductor template, comprising: a substrate; a buffer layer, disposed on a surface of the substrate and comprises a first sub-buffer layer and a second sub-buffer layer sequentially stacked, wherein the buffer layer has irregular cracks such that the top surface of the buffer layer is discontinuous, and the depth of the cracks are greater than or equal to the thickness of the second sub-buffer layer and less than or equal to sum of the thickness of the first sub-buffer and the second sub-buffer layer; and an epitaxial layer, which is a continuous layer and disposed on the buffer layer.