Abstract: A control circuit includes a first control unit, a power unit, a driver unit, a second control unit, a power source, a first switch, a pull-up element and a second switch. The first control unit is used to detect whether a configuration channel line has a predetermined divided voltage and generate a control signal accordingly. The power unit is coupled to the configuration channel line and a power line for supplying power to the driver unit. The driver unit is used to enable or disable a light emitting unit according to the control signal. The second control unit is used to detect whether the configuration channel line has the predetermined divided voltage and control the first switch and the second switch accordingly. The first switch is coupled between a power source and the configuration channel line. The second switch is coupled between the pull-up element and the configuration channel line.

Abstract: A power circuit and a method thereof are provided. The method includes: determining, by a power controller, a first signal is to be transmitted in the continuous mode or the burst mode; when the first signal is to be transmitted in the continuous mode, activating, by a power controller, a continuous mode converter; when activated, converting, by the continuous mode converter, a first voltage down to a second voltage and supplying the second voltage to the first power amplifier; when the first signal is to be transmitted in the burst mode, activating, by a power controller, a burst mode converter; when activated and the first power amplifier is inactive, receiving, by a burst mode converter, a first current to accumulate a burst energy; and when activated and the first power amplifier is active, supplying, by the burst mode converter, the burst energy to the first power amplifier.

Abstract: The present invention relates to a donepezil transdermal patch comprising a backing layer and a pressure sensitive adhesive matrix layer, wherein the pressure sensitive adhesive matrix layer comprises donepezil free base and an acrylic pressure sensitive adhesive agent selected from the group consisting of a copolymer of 2-ethylhexyl acrylate and vinyl acetate and a copolymer of 2-ethylhexyl acrylate, vinyl acetate, and hydroxyl-containing monomers, and wherein 2-ethylhexyl acrylate is present in an amount of about 65% to about 75%, vinyl acetate is present in an amount of about 25% to about 35%, and the hydroxyl-containing monomers are in an amount of about 0% to about 10%, based on the total weight of the copolymer.

Abstract: The invention relates to a controlled-release formulation for preventing and/or treating sleep disorders comprising Zaleplon or a pharmaceutically acceptable salt thereof in immediate release form and Zolpidem or a pharmaceutically acceptable salt thereof in sustained release form, wherein Zaleplon or a pharmaceutically acceptable salt thereof and Zolpidem or a pharmaceutically acceptable salt thereof are released in two phases where the first phase is a immediate release phase of Zaleplon or a pharmaceutically acceptable salt thereof and the second phase is a sustained release phase of Zolpidem or a pharmaceutically acceptable salt thereof.

Abstract: A shower head includes a case having a chamber with an opening, and a cover is slidably engaged with the opening and has multiple holes. The cover has an inner space defined therein, and a brush unit is rotatably located in the inner space and the chamber. The brush unit includes multiple blades, and each blade has brushes connected thereto. The brush unit rotates by the water flow so as to brush the inner surface of the chamber.

Abstract: A water filter assembly includes an upper cover body, a lower base, and a plurality of filter cores. The upper cover body is formed with a connector extending downwards. The connector is to be connected to a filter core set, which includes the filter cores connected together and has output and input hoses. The lower base has a chamber for accommodating the filter core set and has a cover portion connected to the upper cover body. Positioning members are formed on the output and input hoses at suitable positions. Notches are formed on two sides of the cover portion of the lower base so that the positioning members may engage with the notches.

Abstract: A portable water filtering assembly includes a soft bag which is composed of a first part and a second part. At least one holding member is connected to an inside of at least one of the first and second parts so as to hold a water filtering device. The water filtering device is connected with an inlet tube and an outlet tube. Two pouches are respectively connected with the first and second parts so as to receive the inlet tube and the outlet tube. Each of the first and second parts has an opening in a side thereof and the opening communicates with the pouch corresponding thereto. A door pivotably closes the opening and the inlet and outlet tubes can extend from the openings when in use.

Abstract: A portable water filtering assembly includes a soft bag which is composed of a first part and a second part. At least one holding member is connected to an inside of at least one of the first and second parts so as to hold a water filtering device. The water filtering device is connected with an inlet tube and an outlet tube. Two pouches are respectively connected with the first and second parts so as to receive the inlet tube and the outlet tube. Each of the first and second parts has an opening in a side thereof and the opening communicates with the pouch corresponding thereto. A door pivotably closes the opening and the inlet and outlet tubes can extend from the openings when in use.

Abstract: A method for monitoring an ion implanter is disclosed. In one embodiment, the method comprises providing a wafer, forming a barrier layer on the surface of the wafer wherein the barrier layer has a substantial blocking effect on ion implantation, performing an ion implantation process to the wafer, performing a thermal treatment process, removing the barrier layer, and measuring a physical property of the wafer. The measured physical property of the wafer can be used to ascertain the status of the ion implanter. For instance, the measured physical property can be used to determine whether the ion implanter has problems when the energy or concentration of the implanted ions is changed.

Abstract: In a fan housing, a surrounding wall extends uprightly from an inner surface of a base wall that is formed with a wire hole. A power wire, which is coupled to a fan motor mounted on the inner surface, extends through the wire hole. A wire-positioning unit includes a first positioning groove formed in an outer surface of the base wall and extending from the wire hole to the surrounding wall, a second positioning groove formed in an outer surrounding surface of the surrounding wall and extending from the first positioning groove such that the power wire extends along the first and second positioning grooves, a first anchoring member for anchoring the power wire in the first positioning groove, and a second anchoring member for anchoring the power wire in the second positioning groove.

Abstract: A method for monitoring an ion implanter is disclosed. In one embodiment, the method comprises providing a wafer, forming a barrier layer on the surface of the wafer wherein the barrier layer has a substantial blocking effect on ion implantation, performing an ion implantation process to the wafer, performing a thermal treatment process, removing the barrier layer, and measuring a physical property of the wafer. The measured physical property of the wafer can be used to ascertain the status of the ion implanter. For instance, the measured physical property can be used to determine whether the ion implanter has problems when the energy or concentration of the implanted ions is changed.

Abstract: In a fan housing, a surrounding wall extends uprightly from an inner surface of a base wall that is formed with a wire hole. A power wire, which is coupled to a fan motor mounted on the inner surface, extends through the wire hole. A wire-positioning unit includes a first positioning groove formed in an outer surface of the base wall and extending from the wire hole to the surrounding wall, a second positioning groove formed in an outer surrounding surface of the surrounding wall and extending from the first positioning groove such that the power wire extends along the first and second positioning grooves, a first anchoring member for anchoring the power wire in the first positioning groove, and a second anchoring member for anchoring the power wire in the second positioning groove.

Abstract: The invention provides a method for forming a dielectric layer in a semiconductor device by using etch stop layers, and a semiconductor structure formed by the method. The method in accordance with the invention comprises: providing a semiconductor substrate having raised portions and recessed portions; forming a first etch stop layer covering the raised portions and the recessed portions; forming a dielectric layer covering an upper surface of the first etch stop layer, wherein the dielectric layer has a thickness substantially smaller than that of each of the raised portions; forming a second etch stop layer covering the dielectric layer; and performing a planarizing step for polishing the second etch stop layer and the dielectric layer until exposing the first etch stop layer on an upper surface of the raised portions, and remaining a plurality of remaining portions of the second etch stop layer on the planarized surface, and remaining the dielectric layer between raised portions.

Abstract: The invention provides a method for forming a dielectric layer in a semiconductor device by using etch stop layers, and a semiconductor structure formed by the method. The method in accordance with the invention comprises: providing a semiconductor substrate having raised portions and recessed portions; forming a first etch stop layer covering the raised portions and the recessed portions; forming a dielectric layer covering an upper surface of the first etch stop layer, wherein the dielectric layer has a thickness substantially smaller than that of each of the raised portions; forming a second etch stop layer covering the dielectric layer; and performing a planarizing step for polishing the second etch stop layer and the dielectric layer until exposing the first etch stop layer on an upper surface of the raised portions, and remaining a plurality of remaining portions of the second etch stop layer on the planarized surface, and remaining the dielectric layer between raised portions.