Abstract: An electronic device includes a first housing, a second housing, an antenna module and a conductive elastomer. The second housing is connected to the first housing. The antenna module includes a circuit board. The circuit board has a first surface and a second surface opposite to each other. The first surface faces the first housing and is provided with an antenna pattern. The antenna pattern includes a radiating portion and a grounding portion. The conductive elastomer is located between the antenna module and the first housing. One end of the conductive elastomer is connected to the grounding portion, and the other end of the conductive elastomer is connected to the grounding plane of the first housing.

Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.

Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.