Abstract: A method of selecting a technology for manufacturing an integrated circuit includes designating candidate technologies for manufacturing the integrated circuit; generating design and performance data from the integrated circuit, wherein the design and performance data are generated for each of the candidate technologies; and generating die prices from the integrated circuit, wherein the die prices are generated for each of the candidate technologies.

Abstract: A method is disclosed for aligning wafers independent of the processes to which a wafer is subjected. In prior art, it is found that when aligning wafers from the front or device side, the alignment of the masks vary because of the variations on the topography of the particular layer in process. Since the topography of a layer is influenced by the planarization processes used and by the cumulative effect of the number of underlying features that are disposed on top of each other, severe misalignments can occur causing defective parts. The problem is eliminated by forming alignment marks on the backside of the wafer, and performing alignment with respect to the backside marks by projecting IR energy through an IR transparent stage placed under the backside of the wafer and using an IR microscope. An alignment system capable of performing process independent alignment is also disclosed.

Abstract: The guard ring is a barrier which prevents contaminates from diffusing through a window opening through insulating layers to adjacent semiconductor devices. The guard ring is formed surrounding a window in the insulation layers over a fuse link or an alignment mark. The guard ring is an annular metal ring that penetrates two or more insulating layers and contacts the substrate.

Abstract: A method of forming capacitors comprising polysilicon, polysilicon oxide, metal is described which significantly improves uniformity of capacitance across the silicon integrated circuit wafer and avoids damage to electrical contact regions. A first layer of polysilicon oxide is formed on a polysilicon first capacitor plate. The wafer is then dipped in a buffered oxide etch or subjected to a dry anisotropic etch. The etching conditions the polysilicon layer so that subsequent polysilicon oxide growth is very uniform and controllable. A second polysilicon oxide layer is then formed on the polysilicon first capacitor plate. A layer of silicon nitride is formed on the polysilicon oxide and a second capacitor plate is formed on the layer of silicon nitride completing the capacitor. Improved capacitance uniformity across the wafer is achieved and device damage is avoided.

Abstract: A process which provides for self-aligned contact hole filling leading to complete planarization and low contact resistance at the same time, without the use of additional lithographic masking procedures is described. Further, the resultant conductive plug eliminates spiking problems between aluminum and silicon during a subsequent alloying process. In an embodiment, a selective polysilicon layer is deposited and appropriately doped; a second undoped selective silicon layer is then deposited, followed by a refractory metal layer, These layers are heated to produce a self-aligned refractory metal silicide plug.