Patents by Inventor Chih-Shun CHU

Chih-Shun CHU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer charging electromagnetic inspection tool and method of using
    Patent number: 9423359
    Abstract: An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: August 23, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Sung Kuo, Chiun-Chieh Su, Chih-Shun Chu, To-Yu Chen
  • WAFER CHARGING ELECTROMAGNETIC INSPECTION TOOL AND METHOD OF USING
    Publication number: 20150002835
    Abstract: An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.
    Type: Application
    Filed: June 26, 2013
    Publication date: January 1, 2015
    Inventors: Ming-Sung KUO, Chiun-Chieh SU, Chih-Shun CHU, To-Yu CHEN