Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.

Abstract: Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.

Abstract: A two-chamber electron impact emission sensor effective for monitoring vapor flux of materials in the presence of interfering species is described. The sensor includes two independent electron excitation regions and one photodetector for monitoring emission from excited species from both chambers. Copper vapor flux from an evaporation source was accurately measured in the presence of interfering H2O vapor, and Ga vapor flux from an evaporation source was accurately monitored in the presence of interfering CO2 gas. The invention permits deposition rates to be monitored using electron-impact emission spectroscopy with significantly improved accuracy in the presence of interfering gases at high partial pressures.

Abstract: A two-chamber electron impact emission sensor effective for monitoring vapor flux of materials in the presence of interfering species is described. The sensor includes two independent electron excitation regions and one photodetector for monitoring emission from excited species from both chambers. Copper vapor flux from an evaporation source was accurately measured in the presence of interfering H2O vapor, and Ga vapor flux from an evaporation source was accurately monitored in the presence of interfering CO2 gas. The invention permits deposition rates to be monitored using electron-impact emission spectroscopy with significantly improved accuracy in the presence of interfering gases at high partial pressures.

Abstract: A device that eliminates the baseline instability of Atomic Absorption Spectroscopy monitors by utilizing a dual-source, dual-beam optical configuration. The source of one beam, the measuring beam, is light emission from a hollow cathode lamp which is used to determine the atomic vapor density by conventional atomic absorption principles. The second source, the calibration beam, is an emission which has negligible absorption by the atomic vapor, and passes through the same optical path as the measuring beam. For each light source, one beam passes through the processing chamber before its intensity is analyzed. The intensity of a second beam is determined near the light source to provide a reference signal for ratio measurement. Using conventional signal processing, the atomic vapor density, and thus the deposition rate, can be precisely determined despite changes in light source intensity, window transmission and optical alignment.

Abstract: Apparatus is disclosed for utilizing a low energy electron beam to permit monitoring the rate of deposition and composition of the evaporant particles in a vacuum deposition system. This is accomplished by passing a sample of the evaporant employed in the vacuum deposition process through an enclosure defining a flow path for the evaporant sample which crosses the path of a relatively low energy electron beam which is sufficient to excite the electrons of the atoms constituting the vaporized particles in the deposition chamber. The outer-shell electrons of the atoms constituting the evaporant, after excitation, drop back to a lower energy state in the course of which photons are released which are characteristic of given materials. The enclosure is formed with an optical opening receiving the photons in a path orthogonal with respect to the excitation beam and evaporant sample path, and a photodetector is optically coupled to the opening for sensing the emitted photons.