Patents by Inventor Chih Sun

Chih Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8351635
    Abstract: A silicon-based microphone structure, flip-chip mounted a substrate, has a backside and a via hole formed on the backside. A conductive layer covers the backside and the inner walls of the via hole. A solder ring is attached to the silicon-based microphone structure and electrically connected to the conductive layer.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: January 8, 2013
    Assignee: Fortemedia, Inc.
    Inventors: Chih Sun, Shih-Chin Gong
  • Publication number: 20100111344
    Abstract: A silicon-based microphone structure, flip-chip mounted a substrate, has a backside and a via hole formed on the backside. A conductive layer covers the backside and the inner walls of the via hole. A solder ring is attached to the silicon-based microphone structure and electrically connected to the conductive layer.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 6, 2010
    Applicant: FORTEMEDIA, INC.
    Inventors: Chih Sun, Shih-Chin Gong